PR Newswire: news distribution, targeting and monitoring
Feb 7 2013

TOKYO and IRVINE, Calif., Feb. 7, 2013 /PRNewswire/ -- Toshiba Corporation and Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that it began shipping samples of its 64-gigabyte (GB) embedded NAND flash memory module equipped with a Universal Flash Storage (UFS) interface. The first in the industry[1], the new module is fully compliant with the JEDEC UFS[2] Ver.1.1 standard [3], and is designed for a wide range of digital consumer products - including smartphones and tablet PCs.

With improved data processing speeds in host chipsets and wider bandwidths for wireless connectivity, demand continues to grow for large density, high-performance memory that supports high resolution video. A proven innovator in this key area, Toshiba is reinforcing its leadership role by being the first in the industry to ship samples with a 64GB UFS module. 

Samples are mainly intended for evaluation of the UFS interface and its protocol in host chipsets and by OS vendors. Toshiba will schedule mass production of the 64GB UFS module, as well as other densities in its lineup, according to market demand.

Product

Part Number

Density

Package

Sample shipment

THGLF0G9B8JBAIE

64GB

169Ball FBGA

12x16x1.2mm

January 2013

Key Features

  • The JEDEC UFS Ver.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
  • UFS has a serial interface and scalability in terms of number of lanes and speed[4].
  • The new products are sealed in a small FBGA package, 12x16x1.2mm and have a signal layout compliant with JEDECUFS Ver.1.1.

[1]For embedded NAND flash memory modules. Source: Toshiba, as of February 2013.
[2]Universal Flash Storage is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.
[3]JEDEC UFS Ver.1.1 standard has already been published. The Ver.2.0 standard is now under discussion by JEDEC.
[4]JEDEC UFS Ver.2.0 standard will support multiple-lane and interface speed.

Specifications

Interface

JEDEC UFS Version 1.1 standard

Power Supply Voltage

2.7V to 3.6V           (Memory core)

1.70V to 1.95V     (Controller core)

1.10V to 1.30V       (UFS I/F signals)

Number of lanes

Downstream 1 lane / Upstream 1 lane

Interface Speed

2.9Gbps/lane

Temperature range

-25degrees to +85degrees Celsius

Package

169Ball 12x16x1.2mm FBGA

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, MP3 players, cameras, medical devices, automotive electronics, enterprise solutions and more. 

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2011 Worldwide Semiconductor Revenue, March, 2012).  Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

For additional company and product information, please visit http://www.toshiba.com/taec/.

Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. Maximum read and write speed may vary depending on the host device, read and write conditions, and file size.  For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.  Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.  In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook."  This information is available at www.chips.toshiba.com, or from your TAEC representative.

All trademarks and tradenames held within are the properties of their respective holders.

MEDIA CONTACT:
Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
dena@lages.com

SOURCE Toshiba America Electronic Components, Inc.



RELATED LINKS
http://www.toshiba.com/taec

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