ANSYS-Apache Receive TSMC 16nm FinFET Certification for Power Integrity And ElectroMigration Verification
PITTSBURGH, June 4, 2013 /PRNewswire/ -- ANSYS (NASDAQ: ANSS) and subsidiary Apache Design announced today that their RedHawk™ and Totem™ products have achieved version 0.1 of design reference manual (DRM) and SPICE model tool certification for TSMC 16-nanometer (nm) FinFET technology, a three-dimensional transistor architecture that results in higher-performing and lower power chips. TSMC has certified these tools for accuracy-related resistance correlation and expanded electromigration (EM) rule handling to enable advanced power, signal and reliability verification for 16nm FinFET technology used in integrated circuit designs.
One FinFET design challenge is a high-drive current that can lead to EM reliability and power integrity issues. ANSYS-Apache technology addresses this by providing advanced EM verification and accurate IR voltage drop analysis from early in the design flow through sign-off. Early adopters are currently using the flows and tools, as close collaboration continues between TSMC, ANSYS-Apache and designers.
RedHawk and Totem deliver power and reliability sign-off for system-on-chip and mixed-signal designs at advanced technology nodes. RedHawk also provides current direction-aware, metal topology-aware and temperature-aware checks, as well as expanded capabilities to support TSMC's 16 and 20nm EM rules. Totem provides full-chip, layout-based power and reliability analysis for analog and mixed-signal designs.
"For the industry's most advanced process nodes and emerging design technologies, Apache delivers innovative solutions that address complex power and reliability challenges," said Andrew Yang, president of Apache, a subsidiary of ANSYS. "By collaborating with TSMC, we are able to provide optimized tools and methodologies for our leading customers."
"With Apache 16nm certification at TSMC, chip designers can deliver more robust and reliable systems-on-chips for the demanding next generation electronic products," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division.
The ANSYS-Apache portfolio of product offerings will be showcased at the upcoming Design Automation Conference (DAC) in exhibit booth #1346.
About Apache Design, Inc.
Apache Design, an ANSYS subsidiary, enables simulation-driven IC and electronic systems design by providing advanced chip-level power analysis, optimization, and sign-off solutions. Apache's integrated products and methodologies advance low-power innovation and address chip-package-system power and noise challenges. Using Apache's engineering simulation software early in the design and throughout the process enables the world's top semiconductor companies to gain a competitive advantage delivering more power-efficient, high-performance, and noise immune chips. Apache's products help lower power consumption, increase operating performance, mitigate design risks, reduce system cost, and shorten time-to-market for a broad range of end-markets and applications. Learn more at: http://www.apache-da.com/.
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex design challenges through fast, accurate and reliable engineering simulation. Our technology enables organizations ― no matter their industry ― to predict with confidence that their products will thrive in the real world. Customers trust our software to help ensure product integrity and drive business success through innovation. Founded in 1970, ANSYS employs about 2,500 professionals, many of them expert in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 70 strategic sales locations throughout the world with a network of channel partners in 40+ countries. Visit www.ansys.com for more information.
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