Broadcom Leaps Ahead of the Competition with the World's First '3G Phone on a Chip' Solution Over a Year Ahead of Competitors, Broadcom Introduces Single-Chip HSUPA


BCM21551 Features Full CMOS RF, Rich Multimedia, Bluetooth(R), FM Radio, FM

Transmitter and More, Packed on a Single 65nm Die to Slash Price, Size and


    IRVINE, Calif., Oct. 15 /PRNewswire-FirstCall/ -- Broadcom Corporation
 (Nasdaq:   BRCM), a global leader in semiconductors for wired and wireless
 communications, today announced a new single-chip HSPA (high-speed packet
 access) processor that integrates all of the key 3G (third generation)
 cellular and mobile technologies on an extremely low power, single 65
 nanometer CMOS die. Broadcom's new "3G Phone on a Chip" solution enables
 manufacturers to build next generation 3G HSUPA phones with breakthrough
 features, sleek form factors and very long battery life, all at a fraction
 of the cost of today's solutions - driving widespread consumer adoption.
 Never before has anyone integrated as many radio devices on a single chip,
 which demonstrates Broadcom's technology leadership in multi-modal CMOS RF
     Advancements in mobile phone designs, such as the proliferation of
 extensive Internet applications and web services, multimedia, high
 resolution video and still cameras, games and music, are driving a growing
 demand for faster cellular networks and an appetite for rich multimedia
 phones that can take advantage of them. HSUPA is often considered the
 ultimate cellular modem technology. There are already over 900 million
 subscribers in HSPA enabled networks today, and many network operators are
 planning massive worldwide deployment of HSUPA over the next several years.
 Using phones enabled by the new Broadcom(R) HSUPA processor, consumers will
 be able to download content at up to 7.2 Megabits per second (Mbps), and
 upload content such as pictures and videos at up to 5.8Mbps, all directly
 from their phone. HSUPA technology also holds the promise for much higher
 quality "live" video conferencing and an array of exciting services and
     Announced today is the BCM21551 3G "Phone on a Chip," which combines a
 high-speed HSUPA 3G baseband, a multi-band radio frequency (RF)
 transceiver, Bluetooth(R) 2.1 with enhanced data rate (EDR) technology, an
 FM radio receiver and an FM radio transmitter (for car stereo music
 playback). The device also features advanced multimedia processing, up to
 five Megapixel camera support, and 30 frame per second video with "TV Out,"
 as well as support for the HSUPA, HSDPA, WCDMA and EDGE cellular protocols.
 It can even be paired with other Broadcom devices, such as Wi-Fi(R) and
 GPS, PMU, or the new VideoCore(R) III mobile multimedia processor. No
 competing cellular baseband chip has ever achieved this level of
 integration, which drives down cost, power and size, while enabling an
 advanced level of functionality. This makes the BCM21551 an ideal choice
 for both "mass market" high volume 3G "feature phones" as well as
 smartphones running an open OS such as Symbian(R), Windows Mobile(R), or
     "Broadcom has already demonstrated commercial success with its EGPRS
 single-chip solution and multi-chip 3G solutions," commented Michael
 Thelander, CEO and Founder of Signals Research Group, LLC. "With this
 single chip solution, Broadcom is becoming a one-stop supplier of 3G/2G,
 Wi-Fi and Bluetooth silicon solutions and communications software,
 positioning it to leapfrog many of its competitors from both a technology
 and market share perspective."
     "With what we believe is more than a full year's lead over similar
 competing products, this new 3G solution should place Broadcom squarely at
 the head of the hyper-competitive 3G chip race," said Yossi Cohen, Senior
 Vice President and General Manager of Broadcom's Mobile Platforms Group.
 "We built upon the success of our single-chip EDGE solution and merely
 eight months later our engineers not only built a single chip HSUPA
 solution, but also integrated Bluetooth, FM radio, and the next level of
 multimedia. This is truly amazing engineering execution, a hallmark of
 Broadcom. Our investments in multi-modal CMOS RF and high definition
 multimedia technologies will further widen our mobile technology leadership
 in the coming years."
     Technical Information
     Designed and manufactured on a single 65 nanometer silicon die, the
 BCM21551 is an innovative HSPA system-on-a-chip (SoC) that features
 unprecedented integration of advanced smartphone features. The BCM21551
 integrates dual ARM11(TM) processors to provide open OS support, and
 features full stereo music capabilities for both headset and stereo
 speakers as well as an integrated 5-band graphic equalizer and digital
 mixing capabilities for superior audio performance. The BCM21551 also
 integrates advanced MIPI serial interfaces for the LCD and image sensor
 (which facilitates a low power interface for the BCM21551 and the LCD in
 the phone) and the analog physical layer required for the 480Mbps high
 speed USB2.0 applications that enable the rapid transfer of multimedia
 files to and from the handset.
     The BCM21551 also incorporates Broadcom's proprietary M-Stream and
 single antenna interference cancellation (SAIC) signal processing
 technologies designed to improve cellular handset reception and voice
 quality, ultimately resulting in fewer dropped calls.
     The 65 nanometer (nm) process is the most advanced lithographic node
 for manufacturing semiconductors in large volumes today and provides
 significant benefits over 90 nm and 130 nm processes by enabling lower
 power consumption, smaller size and higher levels of integration. For
 Broadcom, the move to 65 nanometer process technology is changing the
 competitive landscape because of the breadth and depth of the
 communications intellectual property the company possesses. Without such a
 broad portfolio of market-leading solutions to integrate, competitors are
 not able to take full advantage of the benefits that these next-generation
 processes provide.
     The BCM21551 also benefits from the company's world class expertise and
 extensive experience in pure digital CMOS radio design, delivering the
 highest RF performance and lowest power consumption available. With a deep
 intellectual property portfolio and mature, field-proven RF technologies
 (with hundreds of millions of devices shipped to date that include radio
 functionality), Broadcom is well suited to apply its RF expertise to the
 cellular market. Breakthrough RF technology enables for the first time in
 the industry the removal of inter-stage filters. For a typical 3-band WCDMA
 phone, this results in extensive savings of 6 inter-stage filters,
 significantly reducing cost and board space.
     Availability and Pricing
     The BCM21551 3G baseband processor is available now to early access
 customers and is priced at $23.00 in large quantities.
     Broadcom Webcast - Monday, October 15, 2007 at 9:00 a.m. Pacific Time;
 12:00 p.m. Eastern Time
     Broadcom will conduct a webcast for media and analysts to discuss this
 breakthrough processor and to provide a cellular update on Monday, October
 15, 2007 at 9:00 a.m. Pacific Time; 12:00 p.m. Eastern Time. The webcast
 will be conducted by Yossi Cohen, Senior Vice President and General Manager
     Broadcom's Mobile Platforms Group. To listen to the webcast, please
 visit the Investors section of the Broadcom website at The webcast will be recorded and
 available until 5:00 p.m. Pacific Time on Monday, October 22, 2007.
     About Broadcom
     Broadcom Corporation is a major technology innovator and global leader
 in semiconductors for wired and wireless communications. Broadcom products
 enable the delivery of voice, video, data and multimedia to and throughout
 the home, the office and the mobile environment. We provide the industry's
 broadest portfolio of state-of-the-art, system-on-a-chip and software
 solutions to manufacturers of computing and networking equipment, digital
 entertainment and broadband access products, and mobile devices. These
 solutions support our core mission: Connecting everything(R).
     Broadcom is one of the world's largest fabless semiconductor companies,
 with 2006 revenue of $3.67 billion, and holds over 2,200 U.S. and 900
 foreign patents, more than 6,600 additional pending patent applications,
 and one of the broadest intellectual property portfolios addressing both
 wired and wireless transmission of voice, video and data.
     Broadcom is headquartered in Irvine, Calif., and has offices and
 research facilities in North America, Asia and Europe. Broadcom may be
 contacted at +1.949.926.5000 or at
     Safe Harbor Statement under the Private Securities Litigation Reform
 Act of 1995:
     All statements included or incorporated by reference in this release,
 other than statements or characterizations of historical fact, are forward-
 looking statements. These forward-looking statements are based on our
 current expectations, estimates and projections about our industry and
 business, management's beliefs, and certain assumptions made by us, all of
 which are subject to change. Forward-looking statements can often be
 identified by words such as "anticipates," "expects," "intends," "plans,"
 "predicts," "believes," "seeks," "estimates," "may," "will," "should,"
 "would," "could," "potential," "continue," "ongoing," similar expressions,
 and variations or negatives of these words. These forward-looking
 statements are not guarantees of future results and are subject to risks,
 uncertainties and assumptions that could cause our actual results to differ
 materially and adversely from those expressed in any forward-looking
     Important factors that may cause such a difference for Broadcom in
 connection with our BCM21551 baseband processor products include, but are
 not limited to, general economic and political conditions and specific
 conditions in the markets we address, including the volatility in the
 technology sector and semiconductor industry, trends in the broadband
 communications markets in various geographic regions, including seasonality
 in sales of consumer products into which our products are incorporated, and
 possible disruption in commercial activities related to terrorist activity
 or armed conflict in the United States and other locations; the rate at
 which our present and future customers and end-users adopt Broadcom's
 technologies and products in the markets for 3G HSPA applications; delays
 in the adoption and acceptance of industry standards in those markets; the
 timing, rescheduling or cancellation of significant customer orders and our
 ability, as well as the ability of our customers, to manage inventory; the
 gain or loss of a key customer, design win or order; our ability to scale
 our operations in response to changes in demand for our existing products
 and services or demand for new products requested by our customers; our
 ability to specify, develop or acquire, complete, introduce, market and
 transition to volume production new products and technologies in a cost-
 effective and timely manner; intellectual property disputes and customer
 indemnification claims and other types of litigation risk; the quality of
 our products and any remediation costs; changes in our product or customer
 mix; the volume of our product sales and pricing concessions on volume
 sales; the effectiveness of our expense and product cost control and
 reduction efforts; our ability to timely and accurately predict market
 requirements and evolving industry standards and to identify opportunities
 in new markets; problems or delays that we may face in shifting our
 products to smaller geometry process technologies and in achieving higher
 levels of design integration; our ability to retain, recruit and hire key
 executives, technical personnel and other employees in the positions and
 numbers, with the experience and capabilities, and at the compensation
 levels needed to implement our business and product plans; the risks and
 uncertainties associated with our international operations; competitive
 pressures and other factors such as the qualification, availability and
 pricing of competing products and technologies and the resulting effects on
 sales and pricing of our products; the timing of customer-industry
 qualification and certification of our products and the risks of non-
 qualification or non-certification; the availability and pricing of third
 party semiconductor foundry, assembly and test capacity and raw materials;
 fluctuations in the manufacturing yields of our third party semiconductor
 foundries and other problems or delays in the fabrication, assembly,
 testing or delivery of our products; the risks of producing products with
 new suppliers and at new fabrication and assembly facilities; the effects
 of natural disasters, public health emergencies, international conflicts
 and other events beyond our control; the level of orders received that can
 be shipped in a fiscal quarter; and other factors.
     Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form
 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange
 Commission filings discuss the foregoing risks as well as other important
 risk factors that could contribute to such differences or otherwise affect
 our business, results of operations and financial condition. The
 forward-looking statements in this release speak only as of this date. We
 undertake no obligation to revise or update publicly any forward-looking
 statement for any reason.
     Broadcom(R), the pulse logo, Connecting everything(R), the Connecting
 everything logo and VideoCore(R) are among the trademarks of Broadcom
 Corporation and/or its affiliates in the United States, certain other
 countries and/or the EU. Bluetooth(R) is a trademark of Bluetooth SIG. Wi-
 Fi(R) is a trademark of the Wi-Fi Alliance. Symbian(R) is a trademark of
 Symbian Limited. Windows Mobile(R) is a trademark of Microsoft Corporation.
 Linux(R) is a trademark of Linus Torvalds. ARM11(TM) is a trademark of ARM
 Limited. Any other trademarks or trade names mentioned are the property of
 their respective owners.
     Broadcom Trade Press Contact               Broadcom Investor Relations
     Jeremy Hyatt                               Contact
     Senior Manager, Corporate Communications   T. Peter Andrew
     949-926-5971                               Vice President, Corporate                        Communications

SOURCE Broadcom Corporation; BRCM Mobile & Wireless

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