Electronic Design Automation International stories featuring EAD-specific topics to include industry trends, mergers & acquisitions, innovations, personnel news, and technology.

Jan 21, 2015

10:00 ET

API Technologies Corp. Logo.

Jan 21, 2015

09:05 ET

Jan 21, 2015

09:00 ET

Jan 21, 2015

08:00 ET

Jan 21, 2015

07:15 ET

Agile Frameworks, LLC is an independent software vendor (ISV) providing integrated field information management systems (FIMS) and laboratory information management systems (LIMS) software for the engineering, construction services and construction materials testing markets. The software automates the scheduling and dispatch, field data collection, quality control, lab and report delivery processes, with integration to leading ERP and accounting systems such as BST, Deltek Vision, Axium Ajera and Microsoft Dynamics AX and Microsoft Dynamics SL.

Jan 20, 2015

16:41 ET

Altera(R) programmable solutions enable designers of electronic systems to rapidly and cost effectively innovate, differentiate and win in their markets. Altera offers FPGAs, SoCs, CPLDs, ASICs and complementary technologies, such as power management, to provide high-value solutions to customers worldwide.

Jan 20, 2015

10:47 ET

Volanti at NAMM with AmpLive & Dot

Jan 20, 2015

10:45 ET

Cadence Logo

Jan 20, 2015

09:55 ET

Jan 20, 2015

09:48 ET

Jan 20, 2015

09:41 ET

Jan 20, 2015

09:00 ET

Tektronix USB 3.1 Automated Calibration and Jitter Tolerance Test Software

Jan 20, 2015

08:45 ET

Jan 20, 2015

07:59 ET

Jan 20, 2015

07:00 ET

Face and body Analysis Natural Computer Interaction (FANCI) project receives Horizon 2020 Funding. Project centers on integrating multiple human-machine technologies on a single platform for better power and cost efficiencies; FANCI applicable to multiple markets, initially focused on automotive industry.

Jan 19, 2015

08:00 ET

11 new NexFET(TM) N-channel power MOSFETs from TI include the 25-V CSD16570Q5B and 30-V CSD17570Q5B for hot swap and ORing applications with the industry's lowest on-resistance (Rdson) in a QFN package. In addition, the 12-V FemtoFET(TM) CSD13383F4 for low-voltage battery-powered applications achieves the lowest resistance at 84-percent below competitive devices in a tiny 0.6 mm by 1 mm package.

Jan 16, 2015

16:05 ET

Jan 16, 2015

09:00 ET

Jan 16, 2015

08:00 ET

Spansion logo.

Jan 15, 2015

16:30 ET

Jump to news releases