EV Group and CEA/Leti Partner to Accelerate Adoption of TSV and 3D Integration Technology
More functionality, lower power
Flash memory and image sensors continue to lead the charge implementing 3D IC/TSV technology due to the complexity of the device structure and demands for more functionality with lower power. In demonstrating a cost-effective, manufacturable stackable interconnection technology, experts project TSV adoption to grow intensively over the next few years expanding into various other advanced IC applications. This joint development program spearheads another critical step to readying integrated device manufacturers and foundries to fully implement 3D integration technology and processes into their production lines, and bringing this technology's advantages to a global commercial scale.
"We are extremely pleased to be working with EVG--not only for their proven bonding/debonding and thin-wafer handling technology systems, but also for the tremendous groundwork and expertise on tools for TSV technology and 3D integration they bring to the table, which complements our own know-how in this field," said Nicolas Sillon, the head of the laboratory for advanced packaging and 3D integration at Leti. "TSV and 3D integration is proving to be a viable solution to a critical roadblock in advanced device performance. Together we can continue to unlock the full potential of this technology to ensure widespread commercialization for high-volume applications."
Commenting on today's announcement, Stefan Pargfrieder, EVG's business development manager noted, "CEA/Leti is a world leader in accelerating emerging technologies to widespread market adoption. We are thrilled to be working with such a prestigious institution, and believe their expertise will be crucial to this JDP and pushing TSV and 3D technology forward in the market place. We are seeing an increasing number of high-volume manufacturers exploring implementation of this technology in their production lines, and this joint effort with CEA/Leti will be instrumental in continuing this positive momentum."
This cooperation also strengthens the existing and established joint development activities between Brewer Science, EVG and Leti. Ultimately, it exemplifies the synergy between materials, equipment and process expertise, and further enables value-added products and know-how in the growing field of 3D IC/TSV technology, as well as other potential users of temporary bonding and debonding techniques.
CEA/Leti and EV Group have already commenced work on the project and have produced successful results in 3D applications using their TSV technology and processes.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in
CEA-LETI, the Laboratory for Electronics & Information Technology is operated by Direction de la Recherche Technologique at CEA, the French Atomic Energy Commission. It mainly aims at helping companies to increase their competitiveness through technological innovation and transfer of its technical know-how to industry. Major player in the MINATEC Micro-Nano technologies innovation center, CEA-LETI benefits from 8000 m2 state-of-the-art clean rooms, with equipments worth some
SOURCE EV Group (EVG)
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