FEI Launches New V600FIB System Powerful FIB Platform for Design Debug, Failure Analysis and Sample Prep Is

Designed to Bridge Applications From 130 nm to 65 nm and Beyond

    HILLSBORO, Ore., July 6 /PRNewswire-FirstCall/ -- FEI Company (Nasdaq:  
 FEIC) has released the V600FIB, an all-new focused ion beam (FIB) system
 designed to provide optimum flexibility for high-throughput applications
 including circuit modification, cross-sectioning, sample prep and failure
 analysis for semiconductor devices with designs down to 90 nm. The
 upgradeable platform of the V600FIB is designed to ultimately provide
 advanced circuit edit applications for designs below 65 nm, giving users
 the full range of capabilities they need today, and a cost-effective path
 for meeting future requirements.
     The rapid time-to-data for defect analysis and shortened cycles for
 device debugging provided by FEI's FIB and DualBeam(TM) (FIB/SEM) tools
 help semiconductor manufacturers finalize chips designs and achieve full
 production ramps faster and more efficiently. The results are lower costs
 and accelerated time to market.
     The V600FIB replaces FEI's FIB 200 which, with more than 200 systems
 installed worldwide, has earned a reputation for its reliability and
 versatility for mid-range, high-volume semiconductor lab applications. The
 platform joins FEI's VectraVision(TM), currently recognized as the most
 advanced circuit edit platform for sub-90 nm technology nodes.
     The V600FIB features FEI's Sidewinder(TM) 30kV ion column, a versatile
 gas delivery system to suit specific application requirements, and a 5-axis
 tilt stage for stable site-specific cross sectioning for failure analysis
 applications. The system also accommodates a variety of samples from
 packaged parts to eight inch wafers.
     The first V600FIB, the initial system available on the new platform,
 has already shipped to Philips Semiconductors in Nijmegen, the Netherlands.
 Philips semiconductors has long-standing experience with FEI lab tools and
 plans to use the V600FIB as a multiple-user, high throughput circuit edit
     "The V600FIB will provide users with new levels of performance across
 multiple high-throughput applications," said Tony Edwards, vice president
 and general manager for FEI's NanoElectronics Laboratory Business. "With
 its designed-in upgradeability, the V600 FIB will give customers greater
 flexibility in planning and managing their equipment assets as they
 progress through rapidly shrinking design nodes."
     About FEI
     FEI's Tools for Nanotech(TM), featuring focused ion- and electron-beam
 technologies, deliver 3D characterization, analysis and modification
 capabilities with resolution down to the sub-Angstrom level and provide
 innovative solutions for customers working in NanoBiology, NanoResearch and
 NanoElectronics. FEI's solutions deliver ultra-high resolution and
 automation to speed the pace of product release and production cycles for
 semiconductor, data storage, and MEMS manufacturers.
     With R&D centers in North America and Europe, and sales and service
 operations in more than 50 countries around the world, FEI is bringing the
 nanoscale within the grasp of leading researchers and manufacturers and
 helping to turn some of the biggest ideas of this century into reality.
 More information can be found on the FEI website at: www.fei.com.
     This news release contains forward-looking statements that include
 statements about performance of a newly-introduced product and future
 product performance. Factors that could affect these forward-looking
 statements include, but are not limited to changes to or cancellation of
 product application development initiatives; the inability of FEI, its
 suppliers or partners to make the technology advances required for the
 projects to achieve anticipated results; problems arising during execution
 of the initiatives that delay it or cause results to vary from the
 anticipated results; unforeseen technology challenges; and failure of a key
 supplier or partner. Please also refer to our Form 10-K, Forms 10-Q, Forms
 8-K and other filings with the U.S. Securities and Exchange Commission for
 additional information on these factors and other factors that could cause
 actual results to differ materially from the forward-looking statements.
 FEI assumes no duty to update forward-looking statements.


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