HILLSBORO, Ore., Sept. 13 /PRNewswire-FirstCall/ -- FEI Company
(Nasdaq: FEIC) has released the industry's first-ever DualBeam(TM) mask repair
system designed to repair photolithography mask defects for the 65 nm node.
Combining both a focused ion beam (FIB) column and an environmental scanning
electron microscope (ESEM(TM)) in a single system, the new Accura(TM) XT+ is a
future-safe solution that can accommodate both today's photomasks and extend
to a broad set of next-generation lithography technologies including EUV
reflective, LEEPL/Stencil, Nanoimprint, CPL, and new absorber stacks.
The Accura XT+ contains a robust list of performance-enhancing features.
A new VisIONary(TM) FIB column provides smaller spot size and more accurate
beam placement for both imaging and repair. FEI's patented environmental SEM
technology enables e-beam repair of leading-edge 65 nm photomask types and
will play a major role in future lithography nodes, while also providing
high-resolution e-beam imaging. FEI's ESEM technology has the advantage of
eliminating the adverse charging effects of standard SEMs. The system also
features an optical microscope for easy mask navigation and global alignment.
The Accura XT+ delivers clean, high transmission repairs with excellent edge
placement on today's demanding photomasks designed for 65 nm production.
When used in combination with FEI's SNP XT stylus nanoprofilometer with
Rapid CD(TM), manufacturers of photomasks gain a highly compelling mask repair
solution. The SNP XT rapidly identifies and maps mask defects and confirms
repair by acquiring detailed 3D topographical data. The combination of the two
tools enables accurate alternating aperture phase shift (AAPSM) mask repair.
"The Accura XT+ builds on FEI's leadership in providing the mask industry
with advanced mask repair solutions," said Michel Epsztein, senior vice
president and general manager of FEI's CMD division. "The Accura XT+ is built
on FEI's flagship wafer fab platform, utilizing the latest technologies for
flexibility and reliability in a DualBeam configuration. Fully prepared for
future mask generations, this latest addition to the Accura product family
will enable manufacturers to continue saving thousands of dollars per mask by
eliminating scrapped masks and additional production time, and to reduce
delivery time to customers."
Also introduced with the Accura XT+ is CAD Copy(TM), a software upgrade
designed to boost the system's powerful Pattern Copy software. The software
package enables the repair of previously irreparable defects on single die
masks and accesses archived CAD data from mask writer tools to generate highly
accurate repair bitmaps. CAD Copy has an open modular software architecture
that can support all mask data formats and accommodate future expansion as new
protocols are adopted.
FEI's Tools for Nanotech(TM), featuring focused ion- and electron-beam
technologies, deliver 3D characterization, analysis and modification
capabilities with resolution down to the sub-Angstrom level. With R&D centers
in North America and Europe, and sales and service operations in more the 40
countries around the world, FEI is bringing the nanoscale within the grasp of
leading researchers and manufacturers and helping to turn some of the biggest
ideas of the this century into reality.
SOURCE FEI Company