FEI's Automated 3D Cyrstallography Featured at PITTCON FEI's EBS3 Fully-Automated Electron Backscattered Diffraction Solution

Delivers Rapid Serial Sectioning and 3D Crystal Orientation

Reconstructions of Materials

    HILLSBORO, Ore., March 13 /PRNewswire-FirstCall/ -- FEI Company
 (Nasdaq:   FEIC) will feature its EBS3 DualBeam(TM) solution for rapid serial
 sectioning and 3D crystallographic reconstructions of materials at this week's
 PITTCON conference in Orlando.  The fully integrated solution, utilizes an FEI
 DualBeam (FIB/SEM) system with an EBSD detector and advanced automation
     EBS3 is an optimized extension to Slice and View technology pioneered by
 FEI. While Slice and View generates serial images for 3D image reconstruction,
 EBS3 also provides crystallographic information, including serial EBSD
 orientation maps for quantitative 3D grain reconstruction, using the crystal
 orientation of each individual voxel within the volume of interest. The
 automated data collection procedure includes accurate (re)positioning between
 the milling location and the EBSD location to accommodate the geometry
 requirements for both operations.
     EBS3 was developed in collaboration with Prof Dr Hamish Fraser at Ohio
 State University and with HKL Technology (Oxford Instruments) as a strategic
 partner.  The basic concept of EBS3 was first introduced by FEI in April 2004.
 Product development focused on a depth resolution similar to the lateral
 resolution (hundreds of slices) and on automated, unattended use for 60 hours
 or more. The first beta customers included Ohio State University, Gent
 University (Belgium) and, recently, University of Manchester (UK).
     "EBS3 users are now able to obtain a wealth of crystallographic
 information from a sample, including the orientation, position, size and shape
 of grains and phases within internal interfaces as well as grain boundary
 related data.  A 3D view of these characteristics was previously an extremely
 difficult and time consuming endeavor," said Hamish Fraser of OSU. "This will
 enhance research for 3D FE (finite element) modeling, alloy development, grain
 boundary engineering, and validation of stereological corrections. It will
 also result in faster development cycles for new nano-enabled materials."
      PITTCON attendees can learn more about EBS3 and FEI's entire range of
 solutions for NanoResearch and Industry, NanoElectronics and NanoBiology by
 visiting the FEI booth (2045) at the Orange Country Convention Center in
 Orlando. Conference exhibit hours are 9:00 am - 5:00 pm Monday, March 13
 through Wednesday March 15, and 9:00 am - 3:00 pm on Thursday, March 16.
     About FEI
     FEI's Tools for Nanotech(TM), featuring focused ion- and electron-beam
 technologies, deliver 3D characterization, analysis and modification
 capabilities with resolution down to the sub-Angstrom level and provide
 innovative solutions for customers working in NanoBiology, NanoResearch and
 NanoElectronics.  With R&D centers in North America and Europe, and sales and
 service operations in more than 50 countries around the world, FEI is bringing
 the nanoscale within the grasp of leading researchers and manufacturers and
 helping to turn some of the biggest ideas of this century into reality.  More
 information can be found on the FEI website at:  www.fei.com.


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