SAN JOSE, Calif., April 2 /PRNewswire/ -- Hyundai Electronics America (HEA) today introduced a new family of highly integrated micro-camera modules, the HV7121BCOF, HV7131BCOF, HV7121BCOB and HV7131BCOB, an extension of the company's current CMOS image sensor product family. Meeting small form factor and low-power design requirements for various embedded camera applications used in personal digital assistants (PDAs), 3G-cell phones, smart phones, digital cameras and security cameras, the new products strengthen Hyundai's position as a leading capacity provider of cutting-edge System-on-Chip (SoC) devices required for the latest mobile and portable consumer devices. Commenting on the new products and their wide range of applications, Daniel Lee, general manager of sales and marketing for the System IC Standard Product Division at Hyundai Electronics America, said, "These new micro-camera modules offer the same highly integrated features as our very successful high-quality HV7121B and HV7131B camera-on-a-chip CMOS image sensor product family, which is manufactured in Korea. As a recognized capacity leader of semiconductor manufacturing, we look forward to maintaining our strong position in the growing embedded applications market with this new family of micro-camera modules." These micro-camera modules occupy as little as 9.8 mm x 9.8 mm x 7.78 mm to 11.3 mm x 11.1 mm x 12 mm based on a configurable, customizable, built-in lens system -- an important factor in space-starved portable devices. The modules capture both still and real-time video at 30 frames per second with VGA and/or CIF and QCIF resolution. The HV7121BCOF and HV7131BCOF come with built-in, 24-pin flex-ribbon cable for easy assembly. In addition, HV7121BCOB and HV7131BCOB are packaged in a 34-pin package, enabling a customer to either choose a lens system from four different standard lens systems from Hyundai or customize a special lens system from a few selected optical vendors. Visit Hyundai Electronics at the Embedded Systems Conference, booth #1244, San Francisco, Calif., April 9 through April 13, to learn more about the new family of highly integrated micro-camera modules. Pricing and availability Samples are available now; mass production is scheduled for the second quarter of 2001. Please e-mail email@example.com for pricing. For more information about Hyundai's CMOS image sensor family of products, please visit http://www.hea.com/Products/SystemIC/sp/is_product.htm . About Hyundai Electronics Industries Co., Ltd. Hyundai Electronics Industries Co., Ltd. (HEI) of Ichon, Korea, is an industry leader in the development, sales, marketing and distribution of high-quality semiconductors (including DRAM, SRAM, Flash memory and system IC devices), telecommunications and liquid crystal displays. The Semiconductor Group of Hyundai Electronics is the world's largest DRAM supplier with 11 semiconductor manufacturing facilities worldwide, and production capacity of over 300,000 wafer starts per month. In addition, Hyundai is expanding its system IC business unit with leading technology and added deep-submicron foundry services to strategically broaden its overall semiconductor presence and achieve its goal of leading the global semiconductor market. Based in Korea, HEI maintains development, manufacturing, sales and marketing facilities strategically located worldwide. Hyundai Electronics America (HEA) is a U.S. subsidiary of Hyundai Electronics Industries Co., Ltd. HEA is headquartered at 3101 North First Street, San Jose, Calif., 95134. More information on Hyundai Electronics America and its products is available from the company's web site at www.hea.com. NOTE: Hyundai Electronics is a trademark, and Hyundai is a registered trademark of Hyundai Electronics America. All other trademarks are the property of their respective owners.
SOURCE Hyundai Electronics America