KLA-Tencor's New Puma 91xx Darkfield Inspection System Provides Almost Twice the Throughput of Highly Successful Puma 9000
Sensitivity and Ease-of-Use Enhancements Enable Rapid and Cost-Effective
Inspection of DRAM, SRAM, Flash and Logic Devices at High Defect Capture
Rates
SEMICON TAIWAN, TAIPEI, Taiwan, Sept. 11 /PRNewswire-FirstCall/ --
KLA-Tencor (Nasdaq: KLAC) today unveiled the Puma 91xx darkfield patterned
wafer inspection system-the latest member of its widely adopted Puma
product family. Designed to capture the broadest range of critical defect
types at the lowest cost of ownership (CoO), the Puma 91xx Series provides
nearly double the throughput of the previous-generation Puma 9000 Series at
equivalent or better sensitivity-making it the performance leader for
darkfield inspection for the 65-nm and 45-nm nodes. Multiple Puma 91xx
Series systems have already shipped to leading logic, DRAM and Flash fabs
worldwide, where they are used for advanced tool and line monitoring
applications in production. KLA-Tencor's current installed base of Puma
9000 systems can be field upgraded to 91xx Series performance levels.
"Defect capture, sampling frequency, and cost per inspection are very
important considerations for optimizing our inspection strategy," stated
Masanori Numano, manager of the Material and Process Engineering Group at
Toshiba Oita. "As we transitioned to 65 nm, we needed an inspection
platform that could meet production throughput requirements without
compromising sensitivity. The Puma 91xx has demonstrated this capability in
our 300-mm production line."
At sub-65-nm design rules, the competitive environment, shorter product
lifecycles, and the escalating costs of advanced process nodes drive the
need for cost-effective manufacturing. These economic pressures increase
the focus on cycle time reduction, CoO, and capital management. As a
result, IC manufacturers need to extract the most value from their
equipment without sacrificing the performance required to maximize and
protect their yield. To meet this need, inspection tools must be capable of
providing both cost- and performance-optimized defect monitoring on the
broadest range of process layers. The Puma 91xx Series leads in defect-type
capture as well as production throughput, and its flexible architecture can
be configured to meet a wide range of applications and price points for
memory and logic devices.
The Performance Leader for All Device Types
The Puma 91xx Series provides significant improvements in speed,
sensitivity and ease of use. Enhanced data processing nearly doubles
inspection throughput compared to the Puma 9000 Series at equivalent
sensitivity. Additional pixel combinations provide the widest range of
production-mode throughputs available, to enable more sampling, higher
sensitivity or lower CoO. Like its predecessor, the Puma 91xx Series
incorporates KLA-Tencor's proprietary Streak(TM) multi-pixel sensor and
line scanning technologies to achieve high-resolution darkfield imaging
inspection without the speed and sensitivity limitations of darkfield
systems based on acousto-optic device (AOD) and photo multiplier tube (PMT)
technology.
Enabling Faster Integration into Production
Tool recipe setup has been significantly simplified with KLA-Tencor's
new Fast Adaptive Single Threshold (FAST) algorithm, which reduces the
number of parameters needed to create and tune tool recipes by nearly 80
percent over the previous algorithm. KLA-Tencor's inline Defect
Organizer(TM) (iDO(TM)) binning solution provides more accurate defect
classification for faster root-cause identification. Commonality with
KLA-Tencor's 23xx/28xx brightfield inspectors and the eS3x e-beam
inspectors enables recipe sharing between platforms for optimizing
inspector capacity and speeding inspection tool integration into
production.
"With the introduction of the Puma 9000 last year, we experienced rapid
adoption primarily because of the tool's ability to simultaneously address
our customers' technological and economic pressures," stated Paul Marella,
vice president and general manager of KLA-Tencor's Wafer Inspection
Division. "We are pleased that the next-generation Puma 91xx Series offers
our customers an even faster, easier-to-use system that can uniquely
address a broad range of inspection applications for 65-nm and 45-nm memory
and logic devices."
About KLA-Tencor: KLA-Tencor is the world leader in yield management
and process control solutions for semiconductor manufacturing and related
industries. Headquartered in San Jose, Calif., the company has sales and
service offices around the world. An S&P 500 company, KLA-Tencor is traded
on the Nasdaq National Market under the symbol KLAC. Additional information
about the company is available on the Internet at http://www.kla-tencor.com
NOTE: Streak, inline Defect Organizer and iDO are trademarks of
KLA-Tencor.
SOURCE KLA-Tencor
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