KLA-Tencor's Newest UV Brightfield Inspector Enables Cost-Effective Yield Ramp for Advanced IC Manufacturers
2367 Is Market's Fastest Tool for Earliest Capture of Yield-Impacting Defects
on Critical Layers
SAN JOSE, Calif., Mar. 8 /PRNewswire-FirstCall/ -- Enabling chipmakers to innovate faster and yield higher while protecting their profitability, KLA- Tencor (Nasdaq: KLAC) today announced the 2367, its fifth-generation broadband UV/visible brightfield inspection system. An extension of the widely adopted 23XX platform, the 2367 delivers increased sensitivity and a 2x faster data rate to help chipmakers sample more frequently and capture critical layer defects earlier. Complementing KLA-Tencor's 2800 Series full-spectrum DUV/UV/visible brightfield inspection platform, the 2367 is a key component of a mix-and-match inspection strategy that provides the lowest overall cost of inspection for next-generation IC manufacturing. To date, the 2367 is running in production at several 90-nm and 65-nm fabs worldwide. The installed base for KLA-Tencor's 23XX UV platform consists of more than 80 manufacturing lines worldwide. Chipmakers' relentless push for performance gains and cost control is unleashing a wave of new defect control challenges. Defect, yield and process engineers face new defect types and noise sources, pattern-limited yield issues, and a rise in systematic defects. Addressing these issues requires increased, high sensitivity sampling of work in progress at critical patterning layers, such as gate etch and copper chemical mechanical planarization (CMP). To help meet these challenges, the 2367 leverages the sensitivity advantages of the 2800 along with industry-leading throughput on UV and visible layers. Extending proven platform to expedite yield ramps "Performance and market requirements are driving advanced IC manufacturers to find and resolve critical defects on multiple layers as quickly and cost- effectively as possible," said Ute Vogler, module manager, Contamination Free Manufacturing, at AMD Fab 36 LLC & Co. KG in Dresden, Germany. "To meet these challenges, we require the sensitivity and speed of broadband illumination technology. We are excited that KLA-Tencor has extended its 23XX platform with a faster and more sensitive tool, and plan to integrate the 2367 into our inspection strategy for 300-mm logic devices." "From new chip architectures to advanced lithography technologies, IC manufacturers are innovating more than ever -- and facing new defect inspection challenges," said Mike Kirk, vice president, Wafer Inspection Group, KLA-Tencor. "Leveraging key sensitivity enhancements and technology breakthroughs that enable industry-leading throughput, we've again extended our 23XX platform to enable leading-edge chipmakers to achieve faster time to market on advanced chips." Tighter, faster process control Developed from a platform introduced more than five years ago, the 2367 addresses defect engineers' most complex problems. For example, its selectable broadband illumination modes and high numerical aperture deliver superior resolution and material contrast for detection of smaller defect types on resolution-limited layers, while at the same time providing lower false defect counts. The tool also can quickly segment critical defects from nuisance defects. Sophisticated algorithms from the 2800 are integrated into the 2367 to increase its sensitivity. For example, advanced binning and classification, enhanced edge contrast, and multi-die auto threshold equip the tool to find increasingly smaller critical defect types on all layers. The 2367 also features a new image computer and breakthrough time delay integration (TDI) sensor that enable the market's fastest data rate for tighter, faster process control. The 2367 shares a user interface and recipe commonality with several other KLA-Tencor inspection and review platforms, including the 2800, the Puma 9000 darkfield inspector, and the eS32 e-beam inspection tool. These commonalities enable engineers to leverage multiple inspection tools at the lowest overall cost to drive yield ramps. Volume shipments of the 2367 are underway. KLA-Tencor will showcase its latest yield management and process control solutions, including the 2367, at SEMICON China 2006, March 21-23 in booth #3401 at the Shanghai New International Expo in Shanghai, China. About AMD: Advanced Micro Devices is a leading global provider of innovative microprocessor solutions for computing, communications and consumer electronics markets. Founded in 1969, AMD is dedicated to delivering superior computing solutions based on customer needs that empower users worldwide. For more information visit www.amd.com About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, Calif., the company has sales and service offices around the world. An S&P 500 company, KLA-Tencor is traded on the Nasdaq National Market under the symbol KLAC. Additional information about the company is available on the Internet at http://www.kla-tencor.com
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