NEC Electronics and NEC Unveil Innovative System-in-Package Technology Single-Package 3-D SiP Technology Enables High-Speed and High-Resolution

for Image Processing in Mobile Consumer Devices



    TOKYO and SANTA CLARA, Calif., Aug. 1 /PRNewswire/ -- NEC Corporation,
 (Nasdaq:   NIPNY) NEC Electronics Corporation, and its subsidiary in North
 America, NEC Electronics America, Inc., today unveiled a new
 system-in-package (SiP) technology capable of stacking logic and
 gigabit-class memory in a single package to enable high-speed,
 high-definition image processing in mobile devices. The new SiP technology,
 SMAFTI(TM) (SMArt connection with Feed-Through Interposer), features a
 three-dimensional (3-D) chip connection whose approximately 60-micron gap
 and 50-micron-pitch microbump between the logic and memory devices can
 support transmissions up to 100 gigabits per second (Gbps). Designers who
 use SMAFTI technology in cellular phones and other portable equipment that
 have stringent size and power constraints can achieve resolutions
 comparable to those achieved in high-definition television.
     "The strong demand for digital video television, digital video gaming
 and other digital video capabilities in portable consumer devices is
 driving the need for high-speed image processing that realizes
 crystal-clear resolutions," said Takaaki Kuwata, general manager, Advanced
 Device Development Division, NEC Electronics Corporation. "System-on-chip
 (SOC) technologies present a disadvantage in terms of development cost and
 memory capacity, while conventional SiP products have larger package sizes
 due to thicker interposers, and have limitations in signal transfer speed,
 wire-bonding interconnections, and side-by-side chip placement. The new
 SMAFTI technology successfully resolves these issues and enables engineers
 to effectively design and manufacture high-performance systems for mobile
 electronic devices."
     Enabling Technologies
     NEC Electronics and NEC developed the SMAFTI technology by leveraging
 three key enabling technologies: a 50-micron-pitch microbump
 interconnection technology, a 15-micron-thick feed-through interposer (FTI)
 based on superconnect technology, and a multichip assembly process.
     The microbump interconnection technology makes it possible to realize
 low power dissipation, a small form factor, and high-speed interchip
 communication at more than 100 Gbps, ten times faster than conventional
 technologies. The small 50-micron-pitch interconnection size is the result
 of a silicon-to- silicon attachment process that effectively reduces the
 size of conventional pitch bumps and enables designers to accommodate four
 times the number of bumps in the same area. This process produces
 high-speed data transfers and is more reliable than the conventional
 silicon and organic substrate attachment process.
     Superconnect technology is used in chip fabrication and has a copper
 signal trace 15 microns wide and a polyimide layer 7 microns thick -- half
 that of a conventional substrate. The 15-microns-thick FTI, which is based
 on superconnect technology, makes it possible to convert a chip's wiring
 pitch to 50 microns and to fan out the pitch connection of an outer ball
 grid array to 500 microns. As a result, the routing of signals from a logic
 chip with a 50-micron pitch and memory connection points to universal
 substrate terminals can be simplified.
     The multichip assembly process is an enhancement of existing
 wafer-based manufacturing processes that are typically used for SOC
 manufacturing. Memory chips are first mounted onto silicon wafers using
 wiring based on superconnect technology. Then the chips and wiring layer
 are molded by resin and the silicon wafer is removed. The BGA attachment
 process follows.
     Availability
     Products featuring SMAFTI technology are expected to be available
 during the first quarter of 2007 in a variety of lead-free package sizes.
 Availability is subject to change.
     About NEC
     NEC Corporation is one of the world's leading providers of Internet,
 broadband network and enterprise business solutions dedicated to meeting
 the specialized needs of its diverse and global base of customers. NEC
 delivers tailored solutions in the key fields of computer, networking and
 electron devices, by integrating its technical strengths in IT and
 Networks, and by providing advanced semiconductor solutions through NEC
 Electronics Corporation. The NEC Group employs more than 150,000 people
 worldwide and had net sales of approximately 4,825 billion yen (approx.
 $41.2 billion) in the fiscal year ended March 2006. For additional
 information, please visit the NEC home page at: http://www.nec.com .
     About NEC Electronics
     NEC Electronics Corporation (TSE: 6723) specializes in semiconductor
 products encompassing advanced technology solutions for the high-end
 computing and broadband networking markets, system solutions for the mobile
 handset, PC peripherals, automotive and digital consumer markets, and
 platform solutions for a wide range of customer applications. NEC
 Electronics Corporation has 25 subsidiaries worldwide including NEC
 Electronics America, Inc. (www.am.necel.com ) and NEC Electronics (Europe)
 GmbH (www.eu.necel.com ). For additional information about NEC Electronics
 worldwide, visit www.necel.com .
     NOTE: SMAFTI is a trademark of NEC Electronics in Japan, Germany, Korea
 and Taiwan. NEC Electronics is either a registered trademark or trademark
 of NEC Electronics Corporation in the United States and/or other countries.
 All other registered trademarks or trademarks are property of their
 respective owners.
 
 

SOURCE NEC Electronics Corporation

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