YAVNE, Israel, Feb. 10, 2016 /PRNewswire/ -- ORBOTECH LTD. (NASDAQ: ORBK) today announced that, Nippon Mektron Mektec, the world's most dominant maker of flexible printed circuit boards (FPCBs), is deploying Orbotech direct imaging (DI) and automated optical inspection (AOI) systems in multiple factories. These systems will significantly improve current and future smartphone manufacturing by facilitating the creation of flex inspections and high-throughput production capability.
"Flex" PCB manufacturing, which is required to accommodate the rapidly expanding mobile phone market, will be supported by Orbotech's Nuvogo™ DI systems, with state-of-the-art DI for patterning and solder mask applications, as well as Orbotech's AOI systems for inspection. Nippon Mektron has worked closely with Orbotech's local support teams to ensure consistent product performance and quick production ramp up throughout their factories in Japan, Thailand, China and Taiwan.
"From mobile phones and tablets to wearables and sophisticated automotive electronics, today's electronics manufacturers are constantly being challenged to simplify designs, provide flexible packaging solutions and support ever-smaller devices," said Yair Alcobi, President, Orbotech Asia East. "Through this very close collaboration, we are pleased to support Nippon Mektron's current and future product performance requirements for flex PCB manufacturing processes and enable them to offer innovative and market-ready solutions."
According to industry analyst firm Prismark Partners' January 2016 Printed Circuit Report, the 2015/2014 year-on-year value growth estimate for flex PCBs increased by 6.2 percent in dollar value worldwide, which can be attributed to demand for smart and connected electronics and the need for high-speed communications in small and lightweight packages.
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ: ORBK) is a global innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems.
For more information, visit http://www.orbotech.com/.
Cautionary Statement Regarding Forward-Looking Statements
Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management's expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech's operations and business environment, all of which are difficult to predict and many of which are beyond the Company's control. Many factors could cause the actual results to differ materially from those projected including, without limitation, cyclicality in the industries in which the Company operates, the Company's production capacity, timing and occurrence of product acceptance (the Company defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices as well as automobiles, the Company's global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the Company's ability to achieve strategic initiatives, including related to its acquisition strategy, the Company's debt and corporate financing activities; the final outcome and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company's customers, which may result in monetary judgments or settlements, expenses associated with the Korean Matter, ongoing or increased hostilities in Israel and the surrounding areas, and other risks detailed in the Company's SEC reports, including the Company's Annual Report on Form 20-F for the year ended December 31, 2014, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.
Anat Earon-Heilborn Director of Investor Relations Orbotech Ltd. Tel: +972-8-942-3582 Investor.email@example.com
Tally Kaplan Porat Head of Corporate Marketing Orbotech Ltd. Tel: +972-8-942-3603 Tally-Ka@orbotech.com
SOURCE Orbotech Ltd.