QUALCOMM Begins Utilizing 45 Nanometer Semiconductor Process Technology

- Company Marks Milestone in Advancement of Semiconductor Manufacturing -

    SAN DIEGO, Aug. 1 /PRNewswire-FirstCall/ -- QUALCOMM Incorporated
 ( QCOM) today announced that its first chip leveraging 45 nanometer
 (nm) process technology has taped out. The next milestone in CMOS
 semiconductor manufacturing, 45 nm technology enables chips that feature
 higher speeds, lower power consumption and enhanced integration with
 reduced die cost by providing more die per wafer.
     "QUALCOMM's synergistic relationship with strategic foundry partners
 continues to support our long history of technology innovation as we reach
 this milestone in leading-edge process technology," said Behrooz Abdi,
 senior vice president and general manager for QUALCOMM CDMA Technologies.
 "We look forward to enabling new classes of products at 45 nanometers and
 beyond, which will evolve the role of wireless in everyday life to a new
 level for people around the world."
     QUALCOMM has taped out its product on a low power-optimized 45 nm
 process that utilizes advanced immersion lithography and very low k
 inter-metal dielectrics features. The technology provides competitive
 performance with significant cost efficiency, along with improved
 performance on leakage and integration. The Company has also begun
 development work on 40 nm process technology, which is expected to deliver
 even greater benefits in semiconductor performance, cost and efficiency.
     Close collaboration with strategic technology and foundry partners is a
 key part of QUALCOMM's Integrated Fabless Manufacturing (IFM) business
 model, which delivers greater efficiencies and accelerated technology
 advancement to the industry.
     QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and
 delivering innovative digital wireless communications products and services
 based on CDMA and other advanced technologies. Headquartered in San Diego,
 Calif., QUALCOMM is included in the S&P 500 Index and is a 2007 FORTUNE
 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol
 QCOM.
     Except for the historical information contained herein, this news
 release contains forward-looking statements that are subject to risks and
 uncertainties, including the Company's ability to successfully design and
 have manufactured significant quantities of CDMA components on a timely and
 profitable basis, the extent and speed to which CDMA is deployed, change in
 economic conditions of the various markets the Company serves, as well as
 the other risks detailed from time to time in the Company's SEC reports,
 including the report on Form 10-K for the year ended September 24, 2006,
 and most recent Form 10-Q.
     QUALCOMM is a registered trademark of QUALCOMM Incorporated. All other
 trademarks are the property of their respective owners.
       QUALCOMM Contacts:
       Kira Lee, QUALCOMM CDMA Technologies
       Phone:  1-858-845-7571
       Email:  qctpublicrelations@qualcomm.com
 
       Tina Asmar, Corporate Communications
       Phone:  1-858-845-5959
       Email:  corpcomm@qualcomm.com
 
       John Gilbert, Investor Relations
       Phone:  1-858-658-4813
       Email:  ir@qualcomm.com
 
 

SOURCE QUALCOMM Incorporated