SAN DIEGO, Feb. 7 /PRNewswire-FirstCall/ -- Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that it has expanded both its device and base station chipset roadmaps to include Long Term Evolution (LTE). The new family of three multi-mode Mobile Data Modem(TM) (MDM(TM)) chipsets will deliver significant flexibility to the industry by supporting LTE, as well as other 3GPP and 3GPP2 standards. The MDM9xxx-series chipsets will allow UMTS and CDMA2000(R) operators to upgrade seamlessly to future LTE services while preserving backward compatibility to their existing 3G UMTS and CDMA2000 networks. The LTE solutions are scheduled to sample in the second quarter of 2009. "Qualcomm is in a very unique position with LTE, being one of the very few companies that will be able to offer multi-mode solutions that deliver an upgrade path for operators looking to complement their existing 3G networks with LTE," said Steve Mollenkopf, senior vice president of product management for Qualcomm CDMA Technologies. "We are pleased that we will be able to leverage our industry-leading technology position to offer LTE solutions to our customers."
The new family of MDM9xxx-series LTE device chipsets will include: -- MDM9200(TM) chipset designed to support UMTS, HSPA+ and LTE -- MDM9800(TM) chipset designed to support EV-DO Rev. B, UMB and LTE -- MDM9600(TM) chipset designed to support UMTS, HSPA+, EV-DO Rev. B, UMB and LTE All three MDM9xxx-series chipsets will offer full backward compatibility. The chipsets will support FDD and TDD duplex modes, different carrier bandwidths and will be capable of supporting peak data rates of up to 50 Mbps on the downlink and 25 Mbps on the uplink. Qualcomm is a leader in the 3GPP standards process, which is expected to develop the core set of LTE technology specifications by year-end 2008. LTE is a next-generation mobile phone specification that will use orthogonal frequency division multiple access (OFDMA) and multiple-input and multiple-output (MIMO) antenna technology. Qualcomm Incorporated (http://www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2007 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM. Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of LTE device chipsets on a timely and profitable basis, the time by when the core set of LTE technology specifications is developed, the extent and speed to which LTE is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 30, 2007, and most recent Form 10-Q. Qualcomm is a registered trademark of Qualcomm Incorporated. Mobile Data Modem, MDM, MDM9200, MDM9800, and MDM9600 are trademarks of Qualcomm Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.
Qualcomm Contacts: Kira Lee Golin, Qualcomm CDMA Technologies Phone: 1-858-651-1554 Email: firstname.lastname@example.org Tina Asmar, Corporate Communications Phone: 1-858-845-5959 Email: email@example.com John Gilbert, Investor Relations Phone: 1-858-658-4813 Email: firstname.lastname@example.org
SOURCE Qualcomm Incorporated