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    SAN JOSE, Calif., Nov. 19 /PRNewswire-FirstCall/ -- CEVA, Inc.
 [(Nasdaq:   CEVA); (LSE: CVA)], a leading licensor of silicon intellectual
 property (SIP) platform solutions and DSP cores for mobile, consumer
 electronics and storage applications, today announced that Renesas
 Technology Corp. has commenced high-volume shipments of their chipsets with
 integrated Bluetooth connectivity powered by CEVA-Bluetooth IP. Renesas has
 successfully secured a number of key customers for their leading-edge
 solution, which will see their chip deployed in automotive applications for
 some of the world's leading car manufacturers.
     (Logo: http://www.newscom.com/cgi-bin/prnh/20051010/CEVALOGO)
     "CEVA and Renesas have enjoyed a strong relationship in the development
 of Renesas' product offerings incorporating our CEVA-Bluetooth IP and we
 are very pleased to see their leading-edge technology deployed in high
 volumes," said Paddy McWilliams, Managing Director, Communications Product
 Line at CEVA. "We look forward to continuing our successful partnership
 with them and the continued development of new and innovative Bluetooth
 products."
     "Throughout the development process of our chip, CEVA provided
 excellent technical support in addition to their comprehensive Bluetooth IP
 and we are pleased to complete Bluetooth IP in cooperation with CEVA," said
 Masayuki Hirokawa, senior manager of Automotive Application Engineering
 Dept.2, Automotive Semiconductor Business Unit at Renesas Technology Corp.
 "We acknowledge the success that the CEVA-Bluetooth IP has had in the
 successful development and deployment of our Bluetooth chipsets and
 envisage further success for our partnership."
     CEVA offers a range of Bluetooth hardware and software IP ranging from
 Bluetooth 1.2 through to Bluetooth 2.0+EDR. CEVA's latest Bluetooth 2.0+EDR
 IP consists of an RTL baseband engine coupled with an ANSI C software
 stack. It is available as a discrete IP package for use with 3rd party
 embedded processors or it may be licensed together with a CEVA DSP for a
 complete Bluetooth platform. Such a platform can be also coupled with a
 complete set of audio codecs, voice codecs, echo cancellation and noise
 suppression algorithms, yielding an integrated Bluetooth and multimedia
 solution.
     About CEVA, Inc.
     Headquartered in San Jose, Calif., CEVA is a leading licensor of
 silicon intellectual property (SIP) platform solutions and DSP cores for
 mobile, consumer electronics and storage applications. CEVA's IP portfolio
 includes comprehensive solutions for multimedia, audio, voice over packet
 (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a
 wide range of programmable DSP cores and subsystems with different
 price/performance metrics serving multiple markets. In 2006, CEVA's IP was
 shipped in over 190 million devices.
     For more information, visit http://www.ceva-dsp.com
 
 

SOURCE CEVA, Inc.