NEW YORK, Sept. 8 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue.

Thermal Management Technologies (Heat Sinks)

http://www.reportlinker.com/p0131223/Thermal-Management-Technologies-(Heat-Sinks).html

This report analyzes the worldwide markets for Thermal Management Technologies (Heat Sinks) in Millions of US$. The report on 'Thermal Management Technologies (Heat Sinks)' analyzes the Heat Sinks market by the following product segments: Metal Extruded Heat Sinks, Stamped Heat Sinks, Bonded or Fabricated Fin Heat Sinks, and Folded Fin Heat Sinks. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2006 through 2015. The report profiles 180 companies including many key and niche players worldwide such as Aavid Thermalloy, LLC, Aerocool Advanced Technologies Corp., ADDA Corp., Advanced Thermal Solutions, Inc., Ajigo Corp., Akasa Group, Alpha Company Ltd., Asia Vital Components Co. Ltd., ASUSTeK Computer Inc., Chaun Choung Technology Corp., Cooler Master Co. Ltd., Dynatron Corp., Enertron Inc., GlacialTech, Inc.. JMC Products, Inc., Melcor Corp., Neng Tyi Co. Ltd., Polo Tech Co. Ltd., R-Theta Thermal Solutions, Inc., Radian Heat Sinks, Sumitomo Electric Industries, Ltd., Swiftech, Taisol Electronics Co. Ltd., TennMax United, Thermal Integration Technology, Inc., Thermacore, Thermalright, Inc., Thermaltake Technology Co., Ltd., Titan Computer Co. Ltd., Verax Ventilatoren GmbH, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations I-1

Disclaimers I-2

Data Interpretation & Reporting Level I-3

Quantitative Techniques & Analytics I-3

Product Definitions and Scope of Study I-3

Metal Extruded Heat Sinks I-4

Stamped Heat Sinks I-4

Bonded or Fabricated Fin Heat sinks I-4

Folded fin Heat Sinks I-4

Computers I-5

Telecommunication I-5

Medical I-5

Industrial Electronics I-5

Aerospace/Military I-5

Consumer Electronics I-6

Automotive I-6

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEW II-1

Thermal Management - A Critical Function II-1

Global Thermal Management Solutions Market: An Overview II-1

Heat Sinks - Market Outlook II-2

Heat Sinks Market Estimates and Forecasts by Region II-2

Heat Sinks Market Estimates and Forecasts by Product Segment II-2

Heat Sinks Market Estimates and Forecasts by End-use Segment II-2

2. MARKET TRENDS AND ISSUES II-3

Technological Advancements Drive Growth in Heat sink Market II-3

PC Market Stimulates Growth II-3

Pricing Trends in the Heat sinks Market II-3

Hybrid Technologies Gaining Popularity Over Traditional Heat

Sinks II-4

Polymers: The Future in Heat Sink Technology II-4

Liquid Cooling: The Next Big Thing in Thermal Technology II-4

3. INNOVATIONS IN HEAT SINK TECHNOLOGY II-6

New Aluminum Silicon Carbide (AlSiC) Heat Sinks II-6

Heat sink System for Circuit Boards II-6

Heat Sink BGA Package II-6

New Mounting Assembly for Heat Sink II-6

Dual Material Heat Sinks II-7

New Heat Sink, Interfacing Multiple Components II-7

Heat Sinks with Fins II-7

New Fastening Structure Method For Heat Sinks II-7

New Heat Sink Attached to the Module with Adhesive II-8

New Method to Set Up Posts on Heat Sinks II-8

New Heat Sink System for Circuit Boards Developed II-8

New Bi-level Heat Sinks II-8

New Ceramic-based Heat Sink II-9

Heat Sink Attached to Two Separate PCBs II-9

New Heat Sink Bonds with Dielectric Material II-9

4. PRODUCT OVERVIEW II-10

Heat Sinks II-10

Composition and Structure of a Heat Sink: II-10

Comparison between Aluminum and Copper by Physical Parameters

- Thermal Conductivity, Cost, Weight, Production Method and

Pressure on mounting deviseII-11

Usage Criteria for a Heat sinkII-11

Necessity of a Heat Sink: II-12

Characteristics of an Ideal Heat Sink II-12

Measuring and Boosting the Thermal Performance of a Heat Sink II-12

Classification of Heat Sinks II-13

Active Heat SinkII-13

Characteristics of an active Heat Sink II-13

Passive Heat Sink II-14

Extruded Heat Sinks II-14

Stamped Heat sinks II-14

Bonded or Fabricated Fins II-15

Folded Fins II-15

Castings II-15

Comparing Active and Passive Heat Sinks II-15

5. END USE APPLICATIONS OF HEAT SINKS II-16

Computers II-16

TelecommunicationII-17

Medical II-17

Industrial Electronics II-17

Aerospace/Military II-17

Consumer Electronics II-18

Automotive II-18

6. THERMAL MANAGEMENT PRODUCTS - CLASSIFICATION II-19

Hardware II-19

Heat Pipes II-19

Micro Channels II-19

Spray Cooling II-19

Electronic Cooling Fans II-19

Metal BackplanesII-20

BGAs II-20

Table 1: Leading Players in the Worldwide Thermal Management

Hardware Market (2006 & 2007) - Percentage Share Breakdown

by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and

Others (includes corresponding Graph/Chart) II-21

Software II-21

Computational Methods of Heat Transfer (CHT) and Fluid

Dynamics (CFD) II-21

Electronic Design Automation (EDA) Software, Electronic

Computer Aided Design (ECAD) Software, and Technology

Computer Aided Design (TCAD) Software II-21

Interfaces and Substrates II-22

Thermal Compounds and Thermal Interface Materials II-22

7. RECENT INDUSTRY ACTIVITY II-24

Thermacore Awarded Research Contract by DARPA (US) II-24

Celsia Technologies Inks Strategic Deal with Thermapower(Taiwan) II-24

Modine to Shut Down Pemberville and Other Manufacturing Unit

(USA) II-24

Modine Sells Thermacore (USA) II-25

Furukawa America to Merge with Furukawa Electric (USA) II-25

Alexandria Extrusion Takes Over M&M Metals (USA) II-25

Waytronx Takes Over CUI (USA) II-26

Avnet Electronics Enters into Agreement with Nuventix (America) II-26

Graphics Product and Celsia Form Partnership (US) II-26

Modine Sets up Production Unit (India) II-27

Wakefield Acquires Simon Industries (NA) II-27

Celsia Launches Next Generation NanoSpreader (USA) II-27

ATS Launched the New Star(TM) Series Heat Sinks (USA) II-28

New Improved Heat Sinks from Hitachi (Japan) II-28

Honeywell to Extend Its Research and Development Center (USA) II-28

Vette Corp. Forms Allies with Asia Aluminum (China) II-29

OnScreen Inks a Licensing and Royalty Deal with Thermaltake

Technologies (Taiwan) II-29

ONSC Inks a Licensing Deal with CUI (US) II-29

Modine to Construct Second Facility (Hungary) II-29

Onscreen Technologies Revamps Business Strategy (US) II-30

Digi-Key Inks Global Distribution Agreement with ATS II-30

Mouser Signs Distribution Agreement with Comair Rotron (US) II-31

Laird Expands Distribution Agreement with Sager (US) II-31

Denki Kagaku Plans Capacity Expansion for Ceramic Heat Sinks

(Japan) II-31

Vette Corp Announces Production Expansion (North America) II-32

ANSYS, Inc to acquire Aavid Thermal Technologies (US) II-32

Celsia Technologies Enters Into a Collaboration Yeh- Chiang

Technology (Taiwan) II-32

CPS Enters Into Partnership with Diamond Technologies (US) II-33

Vette Takes Over ERM Thermal Technologies (USA) II-33

Celsia Technologies Sign Strategic Contract with Kubo Kinzoku

(Japan) II-33

OnScreen(TM) Acquires Proprietary Rights for WayCool(TM) (US) II-33

iCurie Re-named as Celsia Technologies (US) II-34

AET Receives Approval on HS-400 Heat Sink Design (US) II-34

Thermal Solutions Acquires Woven Electronics (USA) II-34

Laird Announces Acquisition of Supercool (Sweden) II-34

Intel Acquires 5% Stake in Neng Tyi (Taiwan) II-35

Modine Acquires Radiadores (Brazil) II-35

Celsia Unveils Web Portal II-35

AET's eGRAF(R) HS-400 Heat Sinks to Feature in LS/X

Supercomputer (USA) II-35

Vette Announces New BGA Thermal Solutions for Integrated

Circuits (US) II-36

Vette Acquires EUMAX (China) II-36

Wakefield Extends Bonded Fin Heat Sink Line (US) II-36

Wakefield Expands DC/DC Converter Heat Sink Line (US) II-37

8. HEAT SINKS AND RELATED PRODUCT LAUNCHES AND DEVELOPMENTS II-38

Thermalright Unveils T-RAD2 (US) II-38

Alpha Launches FS/FSR Series Active Heat Sinks (Japan) II-38

Alpha Unveils Heat Sinks with 3.45mm Attachment Holes (Japan) II-38

Alpha Releases New Push Pin Tabs Integrated Heat Sinks (Japan) II-38

Alpha Launches Low Profile LPD Series Heat Sinks (Japan) II-39

Alpha Unveils Heat Sinks with Incorporated Attachment Tabs

(Japan) II-39

Alpha Releases UB13070 Heat Sink (Japan) II-39

Alpha Expands LPD Series Heat Sinks with LPD90 (Japan) II-39

ASUS Expands Triton Family with New Triton 81 CPU Coolers

(Taiwan) II-39

Vantec Unveils New AeroFlow FX Series CPU Coolers (US) II-40

Thermalright Launches HR-09 Type 4 Mosfet Cooler (US) II-40

Thermalright Rolls Out TRUE Copper (US) II-40

Spire Announced Plans to Launch New Thermax Cooling Solutions

(US) II-40

ATS Offers Two New Heat Sinks for BGA Packages (US) II-41

ATS Launches ATS-552 Heat Sink Cooling Solution for Freescale

Processors (US) II-41

ATS Offers New Heat Sink Cooling Solutions for Linear LED

Lighting Products (US) II-42

Ohmite Offers Heat Sinks to Combat Overtorque Issues (US) II-42

ASUS Launches Silent Cooling Solutions (Taiwan) II-42

Alpha Replaces SB Series Heat Sinks with LT Series Heat Sinks

(Japan) II-42

Alpha Launches ST Series Heat Sinks (Japan) II-43

Thermalright Launches HR-03 GT VGA Cooler (US) II-43

Thermalright Announces Availability of HR-03 Plus VGA Cooler(US) II-43

Thermalright Unveils HR-07 Duo Ram Cooler (US) II-43

Thermalright Launches HR-01 X CPU Cooler (US) II-44

Thermalright Launches HR-11 Backside Cooler (US) II-44

Thermalright Rolls Out IFX-14 CPU Cooler (US) II-44

Thermalright Unveils HR-09 Mosfet Cooler (US) II-45

ATS Rolls out maxiFLOW Heat Sinks (US) II-45

ATS's maxiGRIP(TM) Clears Stringent Military Testing (US) II-45

ATS Offers Passive and Active Heat Sinks for Freescale's

Processors (US) II-46

MEC International to Offer Heat sinks From Seifert (UK) II-46

New Heatsink from Advanced Thermal for BGA Components (US) II-46

Tyco Launches CardBus Connector Technology Integrated Heatsink

(US) II-46

Schaffner Expands Product Line with Seifert Electronics

Products (Switzerland) II-47

ATS Unveils New Thermal Management Design Kit (US) II-47

Andigilog(R) Unveils New Thermal Management System Controllers(US) II-47

THERMALTAKE Presents Two Turion CPU Coolers (US) II-48

GlacialTech Rolls Out Igloo 7210 M CPU Coolers (US) II-48

ATS Launches HFC-100(TM) Heat Flux Controller (US) II-48

ATS Offers Online Tutorials for Thermal Management (US) II-49

Cooler Master Unveils New Hyper Z600 CPU Cooler (Taiwan) II-49

Advanced Thermal Solutions (ATS) Launches New Three Devices (US) II-49

Emulation Technology Launches Heat Sinks with Elliptical Fin

BGA Chipset (US)II-50

Advanced Thermal Solutions Launches blackDIAMOND Heat Sink (US) II-51

9. FOCUS ON SELECT GLOBAL PLAYERS II-52

Aavid Thermalloy, LLC (USA) II-52

Aerocool Advanced Technologies Corp. (Taiwan) II-52

ADDA Corp. (Taiwan) II-52

Advanced Thermal Solutions, Inc. (USA) II-52

Ajigo Corp. (USA)II-53

Akasa Group (UK) II-53

Alpha Company Ltd. (Japan) II-53

Asia Vital Components Co. Ltd. (Taiwan) II-54

ASUSTeK Computer Inc. (Taiwan)II-54

Chaun Choung Technology Corp. (Taiwan) II-54

Cooler Master Co. Ltd. (Taiwan) II-55

Dynatron Corp. (USA) II-55

Enertron Inc. (USA) II-55

GlacialTech, Inc. (Taiwan) II-56

JMC Products, Inc. (USA) II-56

Melcor Corp. (USA) II-56

Neng Tyi Co. Ltd (Taiwan) II-57

Polo Tech Co. Ltd. (Taiwan) II-57

R-Theta Thermal Solutions, Inc. (Canada) II-57

Radian Heat Sinks (US) II-57

Sumitomo Electric Industries, Ltd. (Japan) II-58

Swiftech (US) II-58

Taisol Electronics Co. Ltd. (China) II-58

TennMax United (USA) II-59

Thermal Integration Technology, Inc (Taiwan) II-59

Thermacore (USA) II-59

Thermalright, Inc. (USA) II-60

Thermaltake Technology Co., Ltd (Taiwan) II-60

Titan Computer Co. Ltd (Taiwan) II-60

Verax Ventilatoren GmbH (Germany) II-61

Vette Corp. (USA)II-61

Wakefield Thermal Solutions, Inc. (US) II-61

10. GLOBAL MARKET PERSPECTIVE II-63

Table 2: World Recent Past, Current & Future Analysis for Heat

Sinks Market by Geographic Region - US, Canada, Japan, Europe,

Asia-Pacific and Rest of World Markets Independently Analyzed

with Annual Sales in US$ Million for Years 2006 through 2015

(includes corresponding Graph/Chart) II-63

Table 3: World 10-year Perspective for Heat Sinks Market by

Geographic Region - Percentage Share of Dollar Sales for North

America, Japan, Europe, Asia-Pacific and Rest of World for

2006, 2009, and 2015 (includes corresponding Graph/Chart) II-64

Analysis by Product Segment II-65

Table 4: World Recent Past, Current & Future Analysis for

Metal Extruded Heat Sinks Market by Geographic Region - US,

Canada, Japan, Europe, Asia-Pacific and Rest of World Markets

Independently Analyzed with Annual Sales in US$ Million for

Years 2006 through 2015 (includes corresponding Graph/Chart) II-65

Table 5: World 10-year Perspective for Metal Extruded Heat

Sinks Market by Geographic Region - Percentage Share Breakdown

of Dollar Sales for North America, Japan, Europe, Asia-Pacific

and Rest of World for 2006, 2009, and 2015 (includes

corresponding Graph/Chart) II-66

Table 6: World Recent Past, Current & Future Analysis for

Stamped Heat Sinks Market by Geographic Region - US, Canada,

Japan, Europe, Asia-Pacific and Rest of World Markets

Independently Analyzed with Annual Sales in US$ Million for

Years 2006 through 2015 (includes corresponding Graph/Chart) II-67

Table 7: World 10-year Perspective for Stamped Heat Sinks

Market by Geographic Region - Percentage Share Breakdown of

Dollar Sales for North America, Japan, Europe, Asia-Pacific

and Rest of World for 2006, 2009, and 2015 (includes

corresponding Graph/Chart) II-68

Table 8: World Recent Past, Current & Future Analysis for

Bonded Fins Heat Sinks Market by Geographic Region - US,

Canada, Japan, Europe, Asia-Pacific and Rest of World Markets

Independently Analyzed with Annual Sales in US$ Million for

Years 2006 through 2015 (includes corresponding Graph/Chart) II-69

Table 9: World 10-year Perspective for Bonded Fins Heat Sinks

Market by Geographic Region - Percentage Share Breakdown of

Dollar Sales for North America, Japan, Europe, Asia-Pacific

and Rest of World for 2006, 2009, and 2015 2015 (includes

corresponding Graph/Chart) II-70

Table 10: World Recent Past, Current & Future Analysis for

Folded Fins Heat Sinks Market by Geographic Region - US,

Canada, Japan, Europe, Asia-Pacific and Rest of World Markets

Independently Analyzed with Annual Sales in US$ Million for

Years 2006 through 2015 (includes corresponding Graph/Chart) II-71

Table 11: World 10-year Perspective for Folded Fins Heat Sinks

Market by Geographic Region - Percentage Share Breakdown of

Dollar Sales for North America, Japan, Europe, Asia-Pacific

and Rest of World for 2006, 2009, and 2015 2015 (includes

corresponding Graph/Chart) II-72

Analysis By End-Use Market II-73

Table 12: World Recent Past, Current & Future Analysis for

Heat Sinks in Computers Sector by Geographic Region - US,

Canada, Japan, Europe, Asia-Pacific and Rest of World Markets

Independently Analyzed with Annual Sales in US$ Million for

Years 2006 through 2015 (includes corresponding Graph/Chart) II-73

Table 13: World 10-year Perspective for Heat Sinks in

Computers Sector by Geographic Region - Percentage Share of

Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and

Rest of World Markets for 2006, 2009 & 2015 (includes

corresponding Graph/Chart) II-74

Table 14: World Recent Past, Current & Future Analysis for

Heat Sinks in Telecom Sector by Geographic Region - US,

Canada, Japan, Europe, Asia-Pacific and Rest of World Markets

Independently Analyzed with Annual Sales in US$ Million for

Years 2006 through 2015 (includes corresponding Graph/Chart) II-75

Table 15: World 10-year Perspective for Heat Sinks in Telecom

Sector by Geographic Region - Percentage Share of Dollar Sales

for US, Canada, Japan, Europe, Asia- Pacific and Rest of World

Markets for 2006, 2009 & 2015 (includes corresponding

Graph/Chart) II-76

Table 16: World Recent Past, Current & Future Analysis for

Heat Sinks in Consumer Electronics Sector by Geographic Region -

US, Canada, Japan, Europe, Asia- Pacific and Rest of World

Markets Independently Analyzed with Annual Sales in US$

Million for Years 2006 through 2015 (includes corresponding

Graph/Chart) II-77

Table 17: World 10-year Perspective for Heat Sinks in

Consumer Electronics Sector by Geographic Region - Percentage

Share of Dollar Sales for US, Canada, Japan, Europe,

Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015

(includes corresponding Graph/Chart) II-78

Table 18: World Recent Past, Current & Future Analysis for

Heat Sinks in Medical Electronics and Office Equipment Sectors

by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific

and Rest of World Markets Independently Analyzed with Annual

Sales in US$ Million for Years 2006 through 2015 (includes

corresponding Graph/Chart) II-79

Table 19: World 10-year Perspective for Heat Sinks in Medical

and Office Equipment Sectors by Geographic Region - Percentage

Share of Dollar Sales for US, Canada, Japan, Europe,

Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015

(includes corresponding Graph/Chart) II-80

Table 20: World Recent Past, Current & Future Analysis for

Heat Sinks in Industrial and Military Sector by Geographic

Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of

World Markets Independently Analyzed with Annual Sales in US$

Million for Years 2006 through 2015 (includes corresponding

Graph/Chart) II-81

Table 21: World 10-year Perspective for Heat Sinks in

Industrial and Military Sector by Geographic Region -

Percentage Share of Dollar Sales for US, Canada, Japan,

Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 &

2015 (includes corresponding Graph/Chart) II-82

Table 22: World Recent Past, Current & Future Analysis for

Heat Sinks in Automotive Sector by Geographic Region - US,

Canada, Japan, Europe, Asia-Pacific and Rest of World Markets

Independently Analyzed with Annual Sales in US$ Million for

Years 2006 through 2015 (includes corresponding Graph/Chart) II-83

Table 23: World 10-year Perspective for Heat Sinks in

Automotive Sector by Geographic Region - Percentage Share of

Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and

Rest of World Markets for 2006, 2009 & 2015 (includes

corresponding Graph/Chart) II-84

III. MARKET

1. THE UNITED STATES III-1

A.Market AnalysisIII-1

Market OverviewIII-1

Product Innovations III-2

Product Launches/Developments III-4

Strategic Corporate Developments III-14

Select Players III-24

Aavid Thermalloy, LLC (USA)III-24

Advanced Thermal Solutions, Inc. (USA) III-24

Ajigo Corp. (USA) III-24

CTS Corp. (USA) III-25

Cool Innovations, Inc. (USA) III-25

Dynatron Corp. (USA) III-25

Enertron, Inc. (USA) III-26

JMC Products, Inc. (USA) III-26

Melcor Corp. (USA) III-26

Radian Heat sinks (US) III-26

Swiftech (US) III-27

Tennmax United (USA) III-27

Thermacore (USA) III-27

Thermalright, Inc. (USA) III-28

United Thermal Engineering Corp. (USA) III-28

Vantec Thermal Technologies, Inc. (US) III-29

Vette Corp. (USA) III-29

Wakefield Thermal Solutions, Inc. (US) III-29

B.Market Analytics III-30

Table 24: US Recent Past, Current & Future Analysis for Heat

Sinks Market by Product Segment - Metal Extruded, Stamped,

Bonded Fin, and Folded Fin Heat Sinks Markets Independently

Analyzed with Annual Sales in US$ Million for Years 2006

through 2015 (includes corresponding Graph/Chart) III-30

Table 25: US 10-year Perspective for Heat Sinks Market by

Product Segment - Percentage Share Breakdown of Dollar Sales

for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat

Sinks for 2006, 2009, and 2015 (includes corresponding

Graph/Chart) III-31

Table 26: US Recent Past, Current & Future Analysis for Heat

Sinks by End-Use Sector - Computers, Telecom, Consumer

Electronics, Medical and Office Equipment, Industrial and

Military, and Automotive Markets Independently Analyzed with

Annual Sales Figures in US$ Million for Years 2006 through

2015 (includes corresponding Graph/Chart) III-32

Table 27: US 10-Year Perspective for Heat Sinks by End-Use

Sector: Percentage Share Breakdown of Dollar Sales for

Computers, Telecom, Consumer Electronics, Medical and Office

Equipment, Industrial and Military and Automotive Markets

for 2006, 2009 & 2015 (includes corresponding Graph/Chart) III-33

2. CANADA III-34

A.Market AnalysisIII-34

Current and Future Analysis III-34

Select Player III-34

B.Market Analytics III-35

Table 28: Canadian Recent Past, Current & Future Analysis

for Heat Sinks Market by Product Segment - Metal Extruded,

Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets

Independently Analyzed with Annual Sales in US$ Million for

Years 2006 through 2015 (includes corresponding Graph/Chart) III-35

Table 29: Canadian 10-year Perspective for Thermal

Management Heat Sinks Market by Product Segment - Percentage

Share Breakdown of Dollar Sales for Metal Extruded, Stamped,

Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and

2015 (includes corresponding Graph/Chart) III-36

Table 30: Canadian Recent Past, Current & Future Analysis

for Heat Sinks by End-Use Sector - Computers, Telecom,

Consumer Electronics, Medical/Office Equipment, Industrial

and Military, and Automotive Markets Independently Analyzed

with Annual Sales Figures in US$ Million for Years 2006

through 2015 (includes corresponding Graph/Chart) III-37

Table 31: Canadian 10-Year Perspective for Heat Sinks by

End-Use Sector: Percentage Share Breakdown of Dollar Sales

for Computers, Telecom, Consumer Electronics, Medical and

Office Equipment, Industrial/ Military, and Automotive

Markets for 2006, 2009 & 2015 (includes corresponding

Graph/Chart) III-38

3. JAPAN III-39

A.Market AnalysisIII-39

Current and Future Analysis III-39

Product Innovations III-39

Strategic Corporate Developments III-41

Select Players III-42

Alpha Company Ltd. (Japan) III-42

Sumitomo Electric Industries, Ltd. (Japan) III-43

B.Market Analytics III-43

Table 32: Japanese Recent Past, Current & Future Analysis

for Thermal Management Heat sinks Market by Product Segment -

Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat

Sinks Markets Independently Analyzed with Annual Sales in

US$ Million for Years 2006 through 2015 (includes

corresponding Graph/Chart) III-43

Table 33: Japanese 10-year Perspective for Heat Sinks Market

by Product Segment - Percentage Share Breakdown of Dollar

Sales for Metal Extruded, Stamped, Bonded Fin, and Folded

Fin Heat Sinks for 2006, 2009, and 2015 (includes

corresponding Graph/Chart) III-44

Table 34: Japanese Recent Past, Current & Future Analysis

for Heat Sinks by End-Use Sector - Computers, Telecom,

Consumer Electronics, Medical/Office Equipment, Industrial

and Military, and Automotive Markets Independently Analyzed

with Annual Sales Figures in US$ Million for Years 2006

through 2015 (includes corresponding Graph/Chart) III-45

Table 35: Japanese 10-Year Perspective for Heat Sinks by

End-Use Segment - Percentage Share Breakdown of Dollar

Sales for Computers, Telecom, Consumer Electronics, Medical

and Office Equipment, Industrial and Military, and

Automotive Markets for 2006, 2009 & 2015 (includes

corresponding Graph/Chart) III-46

4. EUROPE III-47

A.Market AnalysisIII-47

Current and Future Analysis III-47

Product Launches/Developments III-47

Strategic Corporate Developments III-48

Select Players III-48

Akasa Group (UK) III-48

Verax Ventilatoren GmbH (Germany) III-49

B.Market Analytics III-50

Table 36: European Recent Past, Current & Future Analysis

for Heat Sinks Market by Product Segment - Metal Extruded,

Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets

Independently Analyzed with Annual Sales in US$ Million for

Years 2006 through 2015 (includes corresponding Graph/Chart) III-50

Table 37: European 10-year Perspective for Heat Sinks Market

by Product Segment - Percentage Share Breakdown of Dollar

Sales for Metal Extruded, Stamped, Bonded Fin, and Folded

Fin Heat Sinks for 2006, 2009, and 2015 (includes

corresponding Graph/Chart) III-51

Table 38: European Recent Past, Current & Future Analysis

for Heat Sinks by End-Use Sector - Computers, Telecom,

Consumer Electronics, Medical/Office Equipment, Industrial

and Military, and Automotive Markets Independently Analyzed

with Annual Sales Figures in US$ Million for Years 2006

through 2015 (includes corresponding Graph/Chart) III-52

Table 39: European 10-Year Perspective for Heat Sinks by

End-Use Sector: Percentage Share Breakdown of Dollar Sales

for Computers, Telecom, Consumer Electronics, Medical and

Office Equipment, Industrial/ Military, and Automotive

Markets for 2006, 2009 & 2015 (includes corresponding

Graph/Chart) III-53

5. ASIA PACIFIC III-54

A.Market AnalysisIII-54

Current and Future Analysis III-54

Mainland China Heat Sinks Market III-54

Taiwan Market Scenario III-54

Product Innovations III-55

Product Launches/Developments III-56

Strategic Corporate Developments III-57

Select Players III-59

Act-Rx Technology Corp. (Taiwan) III-59

Aerocool Advanced Technologies Corp. (Taiwan) III-60

ADDA Corp. (Taiwan) III-60

Arkua Technology Co., Ltd (Taiwan) III-60

Asia Vital Components Co. Ltd. (Taiwan) III-60

ASUSTeK Computer, Inc. (Taiwan) III-61

Chaun Choung Technology Corp. (Taiwan) III-61

Cooler Master Co. Ltd. (Taiwan) III-62

EVERCOOL Thermal Co., Ltd. (Taiwan) III-62

GlacialTech, Inc. (Taiwan) III-62

Kuang Thousand Technology Co., Ltd. (Taiwan) III-62

Neng Tyi Co. Ltd (Taiwan) III-63

Polo Tech Co. Ltd (Taiwan) III-63

Taisol Electronics Co. Ltd. (China) III-63

Thermal Integration Technology, Inc (Taiwan) III-64

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