Reverse Costing Analysis Report: AT&S ECP Embedded Power Die Package - GaN Systems GaNpx Top Cooled

Nov 03, 2015, 05:10 ET from Research and Markets

DUBLIN, Nov. 03, 2015 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/w7599j/atands_ecp) has announced the addition of the "AT&S ECP® Embedded Power Die Package - GaN Systems GaNpx Top Cooled - Reverse Costing Analysis" report to their offering.

GaN Systems offers for GS66508T (650V, 30A) a top-side cooling using AT&S ECP® embedded die packaging process. Compared to the bottom-side cooling approach, this new power packaging process allows to reduce the package footprint by 60% for a cost 40% cheaper!

The GS66508P is packaged is an innovative embedded die package developed by AT&S (ECP® process). This package has no wire bonding to reduce the inductance and a design to increase the heat management using the two sides of the die.

The new position of the die in the package allows to enhance the thermal dissipation. Moreover a simplification of the process reduces the time and the cost of manufacturing.

The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding process, equipment and materials.

The report also features a comparison with GaNpx bottom-side cooled packaging and with AT&S first generation ECP® process in order to understand the different technology choices made.

Key Topics Covered:

1. Introduction
- Executive Summary
- Reverse Costing Methodology

2. Companies Profile
- AT&S Profile

3. GS66508T Characteristics
- GS66508T Characteristics

4. GS66508T Packaging Physical Analysis
- Physical Analysis Methodology
- Package
- Views & Dimensions
- Marking
- Top-Side Delayering
- Bottom-Side Delayering
- Package Cross-Section
- Overview
- Through-Vias Cross-Section
- Micro-Vias Cross-Section
- EDX Material Analysis
- Die
- Redistribution Cross-Section
- Die Views & Dimensions
- GaNpx - ECP® technology
- Adaptation of AT&S ECP® package for high voltage power
- Comparison with GaNpx Bottom-Side Cooling

5. Manufacturing Process Flow
- Global Overview
- GaNpx Packaging Fabrication Unit
- GaNpx Packaging Process Flow

6. Cost Analysis
- Main steps of economic analysis
- GaNpx package
- Yields Hypotheses
- ECP Panel Efficiency
- GaNpx package Cost
- GaNpx package Cost per process steps
- GS66508T Component
- GS66508T Final Test Cost
- GS66508T Component Cost

7. Selling Price Estimation

8. Cost Comparison with Bottom-Side Cooling

For more information visit http://www.researchandmarkets.com/research/w7599j/atands_ecp

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets



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