SANTA CLARA, Calif., Sept. 28 /PRNewswire/ -- sp3 Diamond Technologies,
Inc., a leading supplier of diamond film services, equipment and products, has
been awarded a DARPA contract to introduce its nanoparticle diamond thin film
deposition process into the MEMS Exchange. This will give MEMS developers the
ability to make cost-effective use of the thermal, mechanical and wear
benefits of diamond in their designs.
"We look forward to the formal introduction of sp3's diamond thin-film
process," said Michael Huff, Director of the MEMS and Nanotechnology Exchange.
"A diamond process is a significant addition to the many enabling processes
already available to MEMS Exchange users."
sp3's award from DARPA covers a 10-month project in which the company will
also transfer a nanoparticle seeding process developed by the Naval Research
Laboratory into sp3's process flow. At the end of the project, sp3's diamond
thin film deposition process will be available on 4-inch and 6-inch wafers
through the DARPA supported MEMS Exchange. sp3 also has the ability to provide
diamond thin films on 200-mm and 300-mm wafers.
"DARPA's support for the use of diamond thin films in MEMS devices, as
evidenced by this contract, is a critical recognition of our technology,"
stated Dwain Aidala, president and COO of sp3 Diamond Technologies. "The
properties of diamond make it an ideal material for use in MEMS devices where
thermal and mechanical management issues are key. By reducing wear and
stiction problems MEMS devices will perform better and last longer than
devices manufactured with other materials."
About the MEMS and Nanotechnology Exchange
The MEMS and Nanotechnology Exchange is the nation's leading provider of
high-quality foundry and consulting services. Our 54 individual
state-of-the-art foundries collectively offer the most comprehensive and
diverse set of implementation solutions for MEMS, micro- and nano-technologies
to be found anywhere in the world. The MEMS and Nanotechnology Exchange
customer list includes nearly 600 organizations around the country including
multinational corporations, small start-ups, leading academic research
institutions, and government facilities.
The content of this release does not necessarily reflect the position or
the policy of the Government, and no official endorsement should be inferred.
For more information about the Defense Advanced Research Projects Agency
(DARPA) see http://www.darpa.mil/ .
About sp3 Diamond Technologies, Inc.
sp3 Diamond Technologies is focused on developing diamond-based
applications for electronics thermal management, diamond-on-silicon, and
enhanced cutting surfaces. Based in Santa Clara, California, USA, the company
provides diamond deposition services, hot filament CVD reactors, and
deposition consulting services to companies worldwide across a broad spectrum
sp3 Diamond Technologies is a subsidiary of sp3 Inc., a full service
provider of products and services relating to thin-film and thick-film diamond
deposition and other diamond materials. sp3 Inc. is comprised of sp3 Diamond
Technologies and sp3 Cutting Tools.
For more information about the company and its products and services
please visit www.sp3inc.com.
SOURCE sp3 Diamond Technologies, Inc.