TechConnect Announces BASF as Platinum Sponsor and Innovation Accelerator at the Co-Located 2013 National Innovation Summit and TechConnect World Taking place in the nation's capital, BASF to join global leaders and innovators focused on technology development and commercialization.

WASHINGTON, Nov. 8, 2012 /PRNewswire/ -- TechConnect is pleased to announce that BASF will be a platinum sponsor of the joint National Innovation Summit and TechConnect World Conference, taking place May 12-16 in Washington D.C.  Both events will take place just outside D.C. at the Gaylord National Convention Center, National Harbor, MD.

Now in its 15th year, the TechConnect World is the world's largest global conference and marketplace for innovators, corporate technology developers, and investors. TechConnect recently announced its co-location with the National Innovation Summit and Showcase (NISS), presenting America's top innovations supported by federal funding programs through partnerships with the Department of Energy, Department of Defense, National Institutes of Health, and more than a dozen additional federal agencies and components. 

"We are extremely proud to have BASF as a lead sponsor for both the National Innovation Summit and the TechConnect World events," said Dr. Matthew Laudon, CEO of TechConnect.  "With innovative programs such as the BASF-Harvard Advanced Research Initiative, the JONAS Research Network, and the annual BASF Innovation Awards, BASF is a true global innovation leader and we are looking forward to their participation in the joint events next May."

Dr. Jens Rieger, BASF Senior Vice President for Advanced Materials and Systems Research - Technology Incubation, will deliver a keynote presentation during the joint conference to both the business and research communities. 

"BASF is pleased to be a platinum sponsor of this year's TechConnect World and the National Innovation Summit (NISS).  The NISS enables us to enrich our We Create Chemistry strategy by looking for superior innovation partnerships and growth opportunities through strong positioning in growth markets, and excelling our innovation platform," said Volker Schaedler, Vice President, Innovation and Technology, North America.  "Our success lies in leading by innovation and innovation partnerships to provide solutions for a sustainable future."

In addition, BASF will participate in the TechConnect Corporate Acceleration program, in which participating innovations are vetted and matched with corporate and investment partners.  BASF will have a technology development team on-site for one-on-one meetings with participating innovators.

Submissions are now open for both technical abstracts and breakthrough innovations for the joint TechConnect World Conference and the National Innovation Summit and Showcase. 

To submit your Innovation for Showcase consideration, visit:
http://nationalinnovationsummit.com/showcase/

To learn more about the National Innovation Summit and Showcase, visit:
http://www.nationalinnovationsummit.com/

To learn more about TechConnect World 2013, visit:
http://www.techconnectworld.com/World2013/

About TechConnect (www.techconnect.org):
TechConnect is a global technology outreach & development organization. Through our innovative programs and conferences, we deliver the most promising technologies to the world's top corporate, investment, and government professionals.  TechConnect is headquartered in Austin, Texas, with offices in Cambridge, Massachusetts and Danville, California.

About NISS (http://www.nationalinnovationsummit.com/)
In support of the White House and Congressional call for innovation commercialization initiatives, the National Innovation Summit and Showcase, hosted at the TechConnect World Conference, May 12-16, 2013 in Washington DC, will deliver the world's largest showcase of industry-vetted emerging-technologies ready for commercialization.  There is no comparable gathering of innovation opportunities and influencers.  Invited US agencies include: DOC, DHS, DOD, DARPA, DMEA, DTRA, Army, Navy, Air Force, DOE, DOT, NASA, NIH, NIST, NSF, USDA, NNCO, NRO, SBA & all SBIR offices. 

 

Media Contact:
Jennifer Rocha, TechConnect
1-774-249-8514

SOURCE TechConnect



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