2014

TI's New Family of 9 Amp High-Speed MOSFET Drivers Reduce Space, Design Complexity and Assembly Cost Drivers Ideal for Power Applications Requiring High Gate Drive Current



    DALLAS, Nov. 1 /PRNewswire/ -- Texas Instruments (NYSE:   TXN) introduced
 today a family of high-speed drivers that delivers 9 amps (A) of peak drive
 current in an industry standard pin-out.  The UCC37321 and UCC37322 can drive
 the largest of metal-oxide semiconductor field-effect transistors (MOSFETs) in
 applications that require extreme Miller current, such as switch mode power
 supplies, DC/DC converters, motor controllers and class-D switching
 amplifiers.  The drivers effectively eliminate the need for additional
 external circuits, and replace multiple components to reduce space, design
 complexity and assembly cost. See:  power.ti.com/sc02274
     Using a design that minimizes shoot-through current, the outputs of these
 devices can provide high gate drive current where it is most needed at the
 Miller plateau region during the MOSFET switching transition.  A unique hybrid
 output stage called TrueDrive(TM) technology, parallels bipolar and MOSFET
 transistors, and allows efficient current delivery at low supply voltages.
 With this drive architecture, UCC37321/2/3 can be used in industry standard
 6-A, 9-A and many 12-A driver applications.  Latch up and electrostatic
 discharge protection circuitries are also included.
 
     Features
     --  Industry-Standard Pin-Out
     --  Active High Logic Function Pin
     --  High-Peak Current Drive Capability of +-9 A at the Miller Plateau
         Region Using TrueDrive(TM) Technology
     --  Efficient Constant Current Sourcing Using a Unique Bipolar & CMOS
         Output Stage
     --  TTL/CMOS Compatible Inputs Independent of Supply Voltage
     --  20-ns Typical Rise and Fall Times with 10-nF Load
     --  Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns
         with Input Rising
     --  4-V to 15-V Supply Voltage
     --  Available in Thermally Enhanced MSOP PowerPAD(TM) Package
     --  Rated From -40 degrees C to 105 degrees C
 
     Available Today
     UCC37321/2 family products are available now from TI and its authorized
 distributors in SOIC-8 (D), PDIP-8 (P) and 8-pin MSOP PowerPAD(TM) (DGN)
 packaging.  The PowerPAD(TM) package drastically lowers the thermal resistance
 to extend the temperature operation range and improve the long-term
 reliability.  Suggested resale pricing in quantities of 1,000 units is $.99.
 
     Texas Instruments Incorporated provides innovative DSP and analog
 technologies to meet our customers' real world signal processing requirements.
 In addition to Semiconductor, the company's businesses include Sensors &
 Controls, and Educational & Productivity Solutions.  TI is headquartered in
 Dallas, Texas, and has manufacturing, design or sales operations in more than
 25 countries.
     Texas Instruments is traded on the New York Stock Exchange under the
 symbol TXN.  More information is located on the World Wide Web at www.ti.com .
 
     Please refer all reader inquiries to:  Texas Instruments Incorporated
                                            Semiconductor Group, SC-02274
                                            Literature Response Center
                                            P.O. Box 954
                                            Santa Clarita, CA  91380
                                            1-800-477-8924, ext. 4500
 
     TRADEMARKS
     All trademarks and registered trademarks are the property of their
 respective owners.
 
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SOURCE Texas Instruments Incorporated
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