TSMC Adopts Jordan Valley JVX 6200 for Copper Layer Metrology

MIGDAL HA'EMEK, ISRAEL, April 15 /PRNewswire/ -- Jordan Valley Semiconductors LTD, a provider of semiconductor metrology solutions, announced today that TSMC (TAIEX: 2330, NYSE: TSM), the world's largest dedicated semiconductor foundry, has selected JVX 6200 X-ray metrology tool for measuring the thickness of thin film copper layers in TSMC.

The evaluation of potential technologies - X-ray vs. opto-acoustic - "We found that X-ray reflectometry (XRR) demonstrated the required capability. Among the evaluated X-ray based tools, the JVX 6200 for its superior precision in the sub-angstrom range and for its lower total cost of ownership"

Isaac Mazor, Jordan Valley's President and CEO commented, "We are pleased and proud with the outcome of this evaluation. We see TSMC not only as a valued strategic customer, but also as a technological leader. TSMC's decision is recognition of XRR as the technology-of-choice for copper layer thickness metrology in our products. We are looking forward to continue supporting their metrology needs as they evolve."

About X-ray Reflectometry

X-ray reflectometry is a no-contact, non-distractive, surface-sensitive technique that delivers precise and accurate characterization and metrology of thin films and multi-layer stacks. The technique delivers thickness, density and roughness data by analyzing the reflection vs. angle, and interference patterns of X-rays that reflect off the interfaces.

XRR is capable of analyzing single and multiple thin films layers from 1 to 500 nm thick. Jordan Valley's advanced XRR technology allows measurements on production wafers and offers superior throughput of over 30 WPH (17 points on 300mm wafer).

About TSMC

Established in 1987, Taiwan Semiconductor Manufacturing Company (TSMC) is the world's largest dedicated semiconductor foundry. As the founder and leader of the dedicated foundry business, TSMC has built its reputation on offering advanced wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services to its customers. The company's total managed capacity exceeds 8 million 8-inch equivalent wafers in 2007, while its revenues represent some 50% of the dedicated foundry segment in the semiconductor industry.

About Jordan Valley

Jordan Valley Semiconductors, Ltd. Is the leader of X-ray metrology for advanced semiconductors fabs. We provide semiconductor metrology solutions for thin films front end of line (FEOL) and back end of line (BEOL) based on novel, rapid and non-destructive x-ray technology. We offer a comprehensive family of solutions based on advanced X-Ray Reflectivity (XRR), X-Ray Fluorescence (XRF), X-Ray Fluorescence (XRF), Small-angle X-ray scattering (SAXS) and High Resolution X-Ray Diffractometry (HR XRD). These tools are fully automated, production ready, and ideal for both blanket and patterned wafers. Jordan Valley's x-ray technology enables accurate and precise characterization of all film types metals and dielectrics - including single and multi-layer stacks, high k, metal gate, low k materials. It is also used for strain engineering (SiGe, Si:C) and is used for advanced processes control (<45nm, 32nm) worldwide. Research and development are based in Migdal Ha'Emek, Israel. Manufacturing is based primarily in Migdal Ha'Emek with a secondary location in Durham, United Kingdom. Applications engineering, customer support services, sales and marketing are located in Austin, Texas. http://www.jvsemi.com. Jordan Valley products are used in production by leading semiconductor manufacturers worldwide.

Jordan Valley's primary shareholders are Clal Industries and Investments Ltd. (TASE:CII), Elron Electronic Industries Ltd. ( ELRN).

SOURCE Jordan Valley Semiconductors

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