Ultratech Expands Advanced-Packaging Offerings with New Low-Cost Unity Platform(TM)-Based Tools Targeting Foundry Customers Unity GOLD and Unity PLATINUM Deliver Low-risk, Low-cost, Production-Proven

Lithography Solutions



    SAN JOSE, Calif., Sept. 19 /PRNewswire-FirstCall/ - Ultratech, Inc.
 (Nasdaq:   UTEK), a leading supplier of lithography and laser-processing
 systems used to manufacture semiconductors and nanotechnology devices,
 today introduced two new advanced-packaging (AP) lithography tools built on
 the company's highly successful Unity Platform(TM). Leveraging its industry
 expertise and market-leading AP platform, Ultratech developed the new 200mm
 Unity GOLD and 300mm Unity PLATINUM lithography systems to deliver cost-
 effective solutions for foundry customers. These low-risk manufacturing
 solutions provide the cost-of-ownership (CoO), operational flexibility and
 technical performance essential for Ultratech's global customers.
     Ultratech Chairman and CEO Arthur W. Zafiropoulo explained, "As
 semiconductor chips become more pervasive, there is a greater focus on the
 economics of global manufacturing. Our newest Unity tools were developed to
 be key enablers in providing the best cost-effective solutions for our
 global customers. We are proud of the strength of our customer
 relationships as it allows us to gain insight into their challenges and
 emerging requirements. As the advanced-packaging lithography leaders, we
 will continue to leverage our industry experience to create customized,
 low-risk solutions, meeting our global customers' changing technology and
 economic needs with a broad and flexible portfolio of product offerings."
     Ultratech's new products, built on the customizable Unity Platform,
 represent a tangible solution to address market conditions witnessed by the
 leading wafer foundry customers. Unity GOLD provides 150- and 200mm wafer
 packaging solutions for flat panel display (FPD) applications, while the
 Unity PLATINUM lithography system provides 200- and 300mm wafer processing
 capabilities for high-volume chip manufacturing.
     Certain of the statements contained herein, which are not historical
 facts and which can generally be identified by words such as "anticipates,"
 "expects," "intends," "will," "could," "believes," "estimates," "continue,"
 and similar expressions, are forward-looking statements under Section 27A
 of the Securities Act of 1933, as amended, and Section 21E of the
 Securities Exchange Act of 1934, as amended, that involve risks and
 uncertainties, such as risks related to integration of Oraxion's technology
 and products with our technology and products and market acceptance
 thereof; our dependence on new product introductions and market acceptance
 of new products and enhanced versions of our existing products; lengthy
 sales cycles, including the timing of system installations and acceptances;
 lengthy and costly development cycles for laser-processing and lithography
 technologies and applications; integration, development and associated
 expenses of the laser processing operation; delays, deferrals and
 cancellations of orders by customers; cyclicality in the semiconductor and
 nanotechnology industries; pricing pressures and product discounts; high
 degree of industry competition; intellectual property matters; expiration
 of licensing arrangements, and the resulting adverse impact on our
 licensing revenues; changes to financial accounting standards; changes in
 pricing by us, our competitors or suppliers; customer concentration;
 international sales; timing of new product announcements and releases by us
 or our competitors; ability to volume produce systems and meet customer
 requirements; sole or limited sources of supply; ability and resulting
 costs to attract or retain sufficient personnel to achieve our targets for
 a particular period; dilutive effect of employee stock option grants on net
 income per share, which is largely dependent upon us achieving and
 maintaining profitability and the market price of our stock; mix of
 products sold; rapid technological change and the importance of timely
 product introductions; outcome of litigation; changes in accounting
 policies or interpretations of such policies; manufacturing variances and
 production levels; timing and degree of success of technologies licensed to
 outside parties; product concentration and lack of product revenue
 diversification; inventory obsolescence; asset impairment; effects of
 certain anti-takeover provisions; future acquisitions; volatility of stock
 price; foreign government regulations and restrictions and the exporting of
 sensitive technologies and jobs to certain countries; business
 interruptions due to natural disasters or utility failures; environmental
 regulations; and any adverse effects of terrorist attacks in the United
 States or elsewhere, or government responses thereto, or military actions
 in Iraq, Afghanistan and elsewhere, on the economy, in general, or on our
 business in particular. Such risks and uncertainties are described in
 Ultratech's SEC reports including its Annual Report on Form 10-K filed for
 the year ended December 31, 2005, and its Quarterly Report on Form 10-Q for
 the quarter ended July 1, 2006. Due to these and additional factors, the
 statements, historical results and percentage relationships set forth
 herein are not necessarily indicative of the results of operations for any
 future period. These forward-looking statements are based on management's
 current beliefs and expectations, some or all of which may prove to be
 inaccurate, and which may change. We undertake no obligation to revise or
 update any forward-looking statements to reflect any event or circumstance
 that may arise after the date of this release.
     About Ultratech: Ultratech, Inc. designs, manufactures and markets
 photolithography equipment used worldwide in the fabrication of
 semiconductor and nanotechnology devices, and has expanded its technology
 scope in pioneering laser processing technology for IC manufacturing.
 Founded in 1979, Ultratech is a market leader in gold and solder bump
 lithography. Its products are designed to substantially reduce the cost of
 ownership for manufacturers in the electronics industry. The company's home
 page on the World Wide Web is located at www.ultratech.com.
     NOTE: Unity Platform is a trademark of Ultratech, Inc.
 
 

SOURCE Ultratech, Inc.

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