Ultratech Receives Multiple Advanced-Packaging Lithography System Orders From SPIL Order Reinforces Growing Foundry Adoption for Ultratech's AP Lithography

Systems Built on Its Unity Platform

    SAN JOSE, Calif., March 15 /PRNewswire-FirstCall/ -- Ultratech, Inc.
 (Nasdaq:   UTEK), a leading supplier of lithography and laser-processing systems
 used to manufacture semiconductors and nanotechnology devices, today announced
 that Siliconware Precision Industries Co. Ltd. (SPIL), one of the world's
 leading semiconductor foundries, has ordered several Ultratech Unity AP200
 advanced-packaging (AP) lithography systems.  Slated for 200-mm devices, the
 tools will be delivered to SPIL's Taiwan headquarters over the next few
 quarters.  The AP200 is built on Ultratech's customizable Unity Platform(TM),
 which provides the cost of ownership (CoO), operational flexibility, technical
 abilities and technology extendibility that are essential for foundries to
 stay on their aggressive technology roadmaps.
     According to Jan Vardaman, president and founder of TechSearch
 International, Inc., the solder bump market is positioned for strong growth
 over the next several years, with an expected compound annual growth rate of
 approximately 30 percent.  This growth is mainly driven by high-end logic and
 communications devices.
     Johnson Tai, SPIL vice president, Manufacturing 3rd Division, noted, "To
 meet the rise in demand for communications chips, SPIL is on an aggressive
 bump-capacity expansion plan.  We chose Ultratech's Unity-based AP200 because
 it provides the technology, flexibility, reliability and extendibility needed
 to meet both our current and future productivity and technology requirements."
     "Ultratech's AP systems are becoming the advanced-packaging lithography
 industry standard," said Manish Ranjan, director, product marketing at
 Ultratech.  "The surge in solder-bump applications is a significant catalyst
 behind the growing demand for our AP tools.  This order signals the success of
 the Unity Platform's adoption with device manufacturers, as well as in the
 growing foundry market, where requirements are primarily driven by economic
 factors.  We greatly value our strong relationship with SPIL and will continue
 to develop technology to support their next-generation AP requirements."
     Certain of the statements contained herein, which are not historical facts
 and which can generally be identified by words such as "anticipates,"
 "expects," "intends," "will," "could," "believes," "estimates," "continue,"
 and similar expressions, are forward-looking statements under Section 27A of
 the Securities Act of 1933, as amended, and Section 21E of the Securities
 Exchange Act of 1934, as amended, that involve risks and uncertainties, such
 as risks related to our dependence on new product introductions and market
 acceptance of new products and enhanced versions of our existing products;
 lengthy sales cycles, including the timing of system installations and
 acceptances; lengthy and costly development cycles for laser-processing and
 lithography technologies and applications; integration, development and
 associated expenses of the laser processing operation; delays, deferrals and
 cancellations of orders by customers; cyclicality in the semiconductor and
 nanotechnology industries; pricing pressures and product discounts; high
 degree of industry competition; intellectual property matters; expiration of
 licensing arrangements, and the resulting adverse impact on our licensing
 revenues; changes to financial accounting standards; changes in pricing by us,
 our competitors or suppliers; customer concentration; international sales;
 timing of new product announcements and releases by us or our competitors;
 ability to volume produce systems and meet customer requirements; sole or
 limited sources of supply; ability and resulting costs to attract or retain
 sufficient personnel to achieve our targets for a particular period; dilutive
 effect of employee stock option grants on net income per share, which is
 largely dependent upon us achieving and maintaining profitability and the
 market price of our stock; mix of products sold; rapid technological change
 and the importance of timely product introductions; outcome of litigation;
 manufacturing variances and production levels; timing and degree of success of
 technologies licensed to outside parties; product concentration and lack of
 product revenue diversification; inventory obsolescence; asset impairment;
 effects of certain anti-takeover provisions; future acquisitions; volatility
 of stock price; foreign government regulations and restrictions, the political
 restrictions in Taiwan regarding offshore investments and the exporting of
 sensitive technologies and jobs to certain countries; business interruptions
 due to natural disasters or utility failures; environmental regulations; and
 any adverse effects of terrorist attacks in the United States or elsewhere, or
 government responses thereto, or military actions in Iraq, Afghanistan and
 elsewhere, on the economy, in general, or on our business in particular. Such
 risks and uncertainties are described in Ultratech's SEC reports including its
 Annual Report on Form 10-K filed for the year ended December 31, 2005.  Due to
 these and additional factors, the statements, historical results and
 percentage relationships set forth herein are not necessarily indicative of
 the results of operations for any future period. These forward-looking
 statements are based on management's current beliefs and expectations, some or
 all of which may prove to be inaccurate, and which may change. We undertake no
 obligation to revise or update any forward-looking statements to reflect any
 event or circumstance that may arise after the date of this release.
     About SPIL:  Siliconware Precision Industries Ltd. ("SPIL")
 (Nasdaq:   SPIL, TSE: 2325) is a leading provider of comprehensive semiconductor
 assembly and test services.  SPIL is dedicated to meeting all of its
 customers' integrated circuit packaging and testing requirements, with turnkey
 solutions that range from design consultations, modeling and simulations,
 wafer bumping, wafer probe and sort, package assembly, final test, burn-in, to
 drop ship.  Products include advanced leadframe and substrate packages, which
 are widely used in personal computers, communications, Internet appliances,
 cellular phones, digital cameras, cable modems, personal digital assistants
 and LCD monitors.  SPIL supplies services and support to fabless design
 houses, integrated device manufacturers and wafer foundries globally.  For
 further information, visit SPIL's web site at www.spil.com.tw.
     About Ultratech:  Ultratech, Inc. (Nasdaq:   UTEK) designs, manufactures and
 markets photolithography equipment used worldwide in the fabrication of
 semiconductor and nanotechnology devices, and has expanded its technology
 scope in pioneering laser processing technology for IC manufacturing.  Founded
 in 1979, Ultratech is a market leader in gold and solder bump lithography.
 Its products are designed to substantially reduce the cost of ownership for
 manufacturers in the electronics industry.  The company's home page on the
 World Wide Web is located at www.ultratech.com.
     NOTE:  Unity Platform is a trademark of Ultratech, Inc.

SOURCE Ultratech, Inc.

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