SAN JOSE, Calif., March 29, 2016 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and highbrightness LEDs (HB LEDs), as well as atomic layer deposition (ALD) systems, announced that following technical validation the company received an order for multiple Superfast 4G+ inspection systems from a leading memory manufacturer in Asia. The in-line inspection systems will be used for high-volume production of advanced 3D NAND flash memory chips. Ultratech plans to begin shipping the Superfast 4G+ systems in June.
Damon Tsai, Ultratech's Asia Director for Inspection Systems, said, "We are thrilled to have been selected for insertion in this 3D NAND flash manufacturing factory, having just finished the development of our latest generation, the Superfast 4G+. With its high throughput and improved performance, our customer recognized the yield benefits and selected the Superfast 4G+ for its latest 3D NAND flash technology ramp. This adds to the list of 3D NAND flash factories using Superfast for displacement feed-forward to the scanners. Our customer will use the system initially for bow, warpage and planarization control. This order is further proof that Ultratech's Coherent Gradient Sensing (CGS) technology provides comprehensive measurements that deliver critical wafer shape distortion and topography parameters at any point in the process flow."
Ultratech's Superfast 4G+ Inspection System
Based on patented coherent gradient sensing (CGS) technology, Ultratech's Superfast 4G+ inspection system for patterned wafers provides the industry's highest-productivity for volume manufacturing with a lower cost solution compared to competing systems. Building on the fieldproven Superfast 4G, Ultratech's 4G+ Inspection System provides the industry with a 3D topography solution for advanced lithography applications with the flexibility to measure frontside of patterned wafers anywhere in the production line. Its direct, frontside 3D topography measurement capability is well suited for patterned wafer applications, such as displacement feedforward to the scanner, 3D topography measurement for focus control, and highstress process control with a costeffective solution.
This release includes forwardlooking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forwardlooking statements can generally be identified by words such as "anticipates," "expects," "remains," "thinks," "intends," "believes," "estimates," and similar expressions and include management's current expectation of its longer term prospects for success. These forwardlooking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forwardlooking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers; quarterly revenue fluctuations; industry and sector cyclicality, instability and unpredictability; market demand for consumer devices utilizing semiconductors produced by our clients; our ability to manage costs; new product introductions, market acceptance of new products and enhanced versions of our existing products; reliability and technical acceptance of our products; our lengthy sales cycles, and the timing of system installations and acceptances; lengthy and costly development cycles for laserprocessing and lithography technologies and applications; competition and consolidation in the markets we serve; improvements, including in cost and technical features, of competitors' products; rapid technological change; pricing pressures and product discounts; our ability to collect receivables; customer and product concentration and lack of product revenue diversification; inventory obsolescence; general economic, financial market and political conditions and other factors outside of our control; domestic and international tax policies; cybersecurity threats in the United States and globally that could impact our industry, customers, and technologies; and other factors described in our SEC reports including our Annual Report on Form 10K filed for the year ended December 31, 2015 and our Quarterly Report on Form 10-Q filed for the quarterly period ended October 3, 2015. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forwardlooking statements to reflect any event or circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: frontend semiconductor, backend semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/ultratech-receives-multiple-system-order-for-its-superfast-4g-inspection-system-300242177.html
SOURCE Ultratech, Inc.