Ultratech Receives Multiple-System Orders From Several Customers for Advanced-Packaging Gold-Bump Lithography Tools Multiple-System Orders From Taiwan and China Reinforce Ultratech's Leading

Gold-Bump Position



    SAN JOSE, Calif., May 17 /PRNewswire-FirstCall/ -- Ultratech, Inc.
 (Nasdaq:   UTEK), a leading supplier of lithography and laser-processing systems
 used to manufacture semiconductors and nanotechnology devices, today announced
 that it has received multiple-system orders from several customers in Taiwan
 and China for its advanced-packaging (AP) lithography systems.  Ultratech's
 lithography systems are to be used for gold-bump processing for flat panel
 displays (FPDs) and display-driver ICs for liquid crystal displays (LCDs) for
 both consumer electronic devices and communication applications.  The
 escalating consumer demand for FPDs is creating an increase in demand for
 Ultratech's AP gold-bump lithography tools.  These multiple orders from
 several global customers further solidify Ultratech's leadership position in
 the gold-bump arena.
     The increased demand for flat panel display applications is propelling the
 growth of gold-bump lithography processing in Asia.  According to TechSearch
 International, a leading consulting and market research company, it is
 anticipated that gold-bump capacity will increase by a total of 13 percent
 from 2005 through 2007.
     Stephen Kay, Ultratech's director of marketing for advanced packaging
 technology, noted, "As a gold-bump market leader, we are very pleased with the
 recent rise in demand for AP lithography tools, especially in the FPD
 industry.  We believe our orders have increased as a result of this escalating
 demand, which is expected to increase gold bump fab utilization for the second
 half of 2005.  According to global market intelligence firm, International
 Data Corporation, there were 7.9 million LCD TVs sold last year and 2.6
 million plasma display panel TVs.  As FPDs replace traditional displays, and
 LCD and plasma TV screens continue to grow in size and popularity, gold-bump
 market requirements for cost-effective, leading AP technology will increase to
 meet the huge demand for consumer digital electronics.  We remain committed to
 providing enabling technology to meet our global customers' advanced
 manufacturing requirements."
 
     Certain of the statements contained herein, which are not a historical
 fact and which can generally be identified by words such as "anticipates,"
 "expects," "intends," "will," "could," "believes," "estimates," "continue,"
 and similar expressions, are forward-looking statements under Section 27A of
 the Securities Act of 1933, as amended, and Section 21E of the Securities
 Exchange Act of 1934, as amended, that involve risks and uncertainties, such
 as risks related to Ultratech's dependence on new product introductions and
 market acceptance of new products and enhanced versions of its existing
 products; lengthy sales cycles, including the timing of system installations
 and acceptances; lengthy and costly development cycles for laser-processing
 and lithography technologies and applications; integration, development and
 associated expenses of the laser processing operation; delays, deferrals and
 cancellations of orders by customers; cyclicality in the semiconductor and
 nanotechnology industries; pricing pressures and product discounts; high
 degree of industry competition; intellectual property matters; expiration of
 licensing arrangements, and the resulting adverse impact on Ultratech's
 licensing revenues; changes to financial accounting standards; changes in
 pricing by Ultratech, its competitors or suppliers; customer concentration;
 international sales; timing of new product announcements and releases by
 Ultratech or its competitors; ability to volume produce systems and meet
 customer requirements; sole or limited sources of supply; ability and
 resulting costs to attract or retain sufficient personnel to achieve
 Ultratech's targets for a particular period; dilutive effect of employee stock
 option grants on net income per share, which is largely dependent upon
 Ultratech achieving and maintaining profitability and the market price of
 Ultratech's stock; mix of products sold; rapid technological change and the
 importance of timely product introductions; outcome of litigation;
 manufacturing variances and production levels; timing and degree of success of
 technologies licensed to outside parties; product concentration and lack of
 product revenue diversification; inventory obsolescence; asset impairment;
 effects of certain anti-takeover provisions; future acquisitions; volatility
 of stock price; business interruptions due to natural disasters or utility
 failures; environmental regulations; and any adverse effects of terrorist
 attacks in the United States or elsewhere, or government responses thereto, or
 military actions in Iraq, Afghanistan and elsewhere, on the economy, in
 general, or on Ultratech's business in particular.  Such risks and
 uncertainties are described in Ultratech's SEC reports including its Annual
 Report on Form 10-K filed for the year ended December 31, 2004 and its
 Quarterly Report on Form 10-Q for the quarter ended April 2, 2005.
 
     About Ultratech:  Ultratech, Inc. designs, manufactures and markets
 photolithography equipment used worldwide in the fabrication of semiconductor
 and nanotechnology devices, and has expanded its technology scope in
 pioneering laser processing technology for IC manufacturing.  Founded in 1979,
 Ultratech is a market leader in gold and solder bump lithography.  Its
 products are designed to substantially reduce the cost of ownership for
 manufacturers in the electronics industry.  The company's home page on the
 World Wide Web is located at www.ultratech.com.
 
 

SOURCE Ultratech, Inc.

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