SAN JOSE, Calif., May 17 /PRNewswire-FirstCall/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today announced that it has received multiple-system orders from several customers in Taiwan and China for its advanced-packaging (AP) lithography systems. Ultratech's lithography systems are to be used for gold-bump processing for flat panel displays (FPDs) and display-driver ICs for liquid crystal displays (LCDs) for both consumer electronic devices and communication applications. The escalating consumer demand for FPDs is creating an increase in demand for Ultratech's AP gold-bump lithography tools. These multiple orders from several global customers further solidify Ultratech's leadership position in the gold-bump arena. The increased demand for flat panel display applications is propelling the growth of gold-bump lithography processing in Asia. According to TechSearch International, a leading consulting and market research company, it is anticipated that gold-bump capacity will increase by a total of 13 percent from 2005 through 2007. Stephen Kay, Ultratech's director of marketing for advanced packaging technology, noted, "As a gold-bump market leader, we are very pleased with the recent rise in demand for AP lithography tools, especially in the FPD industry. We believe our orders have increased as a result of this escalating demand, which is expected to increase gold bump fab utilization for the second half of 2005. According to global market intelligence firm, International Data Corporation, there were 7.9 million LCD TVs sold last year and 2.6 million plasma display panel TVs. As FPDs replace traditional displays, and LCD and plasma TV screens continue to grow in size and popularity, gold-bump market requirements for cost-effective, leading AP technology will increase to meet the huge demand for consumer digital electronics. We remain committed to providing enabling technology to meet our global customers' advanced manufacturing requirements." Certain of the statements contained herein, which are not a historical fact and which can generally be identified by words such as "anticipates," "expects," "intends," "will," "could," "believes," "estimates," "continue," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to Ultratech's dependence on new product introductions and market acceptance of new products and enhanced versions of its existing products; lengthy sales cycles, including the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; delays, deferrals and cancellations of orders by customers; cyclicality in the semiconductor and nanotechnology industries; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; expiration of licensing arrangements, and the resulting adverse impact on Ultratech's licensing revenues; changes to financial accounting standards; changes in pricing by Ultratech, its competitors or suppliers; customer concentration; international sales; timing of new product announcements and releases by Ultratech or its competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; ability and resulting costs to attract or retain sufficient personnel to achieve Ultratech's targets for a particular period; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon Ultratech achieving and maintaining profitability and the market price of Ultratech's stock; mix of products sold; rapid technological change and the importance of timely product introductions; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on Ultratech's business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2004 and its Quarterly Report on Form 10-Q for the quarter ended April 2, 2005. About Ultratech: Ultratech, Inc. designs, manufactures and markets photolithography equipment used worldwide in the fabrication of semiconductor and nanotechnology devices, and has expanded its technology scope in pioneering laser processing technology for IC manufacturing. Founded in 1979, Ultratech is a market leader in gold and solder bump lithography. Its products are designed to substantially reduce the cost of ownership for manufacturers in the electronics industry. The company's home page on the World Wide Web is located at www.ultratech.com.
SOURCE Ultratech, Inc.