SAN JOSE, Calif., Nov. 18 /PRNewswire-FirstCall/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today announced that it has received an order from a DRAM manufacturer for its AP300 lithography system, built on the new Unity Platform(TM). The customer intends to utilize Ultratech's AP300 -- capable of processing both 200- and 300-mm wafers -- for wafer-level chip scale packaging (WLCSP) solutions. This order highlights the adoption of the company's Unity Platform design and supports Ultratech's position as a market leader at the forefront of the migration from wire bonding to WLCSP. Market research firm TechSearch International, Inc. expects a five-fold increase in the WLCSP market between 2004 and 2007. Behind this rapid growth is an increasing demand for integrated passives, power devices and DRAM that require advanced packaging technology. To meet the speed requirements of today's high-end graphic memory devices, DRAM manufacturers are moving from wire bonding to WLCSP, which enables increased device performance and the ability to meet shrinking form-factor design rules. "The AP300 system order for our customer's pilot WLCSP production line shows Ultratech's advanced packaging technology expertise and market leadership. The order from a DRAM manufacturer demonstrates that the memory market is beginning the migration from wire bonding to WLCSP," noted Stephen Kay, director, product marketing for Ultratech's Advanced Packaging Technology. "Ultratech's technology expertise, including the AP300's outstanding flexibility, extendibility and advanced lithography technology for 200- and 300-mm wafer processing, we believe played an important role in the customer's selection criteria. In addition, Ultratech is strategically positioned to support the DRAM manufacturing industry as it transitions to WLCSP technology. We look forward to supporting customer requirements for cost-effective DRAM manufacturing -- today and in the future." Certain of the statements contained herein may be considered forward- looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as lengthy and costly development cycles for advanced lithography and laser-processing technologies and applications; integration, development and associated expenses of the laser processing operation; delays, deferrals and cancellations of orders by customers; expiration of licensing arrangements, and the resulting adverse impact on Ultratech's licensing revenues; high degree of industry competition; pricing pressures and product discounts; changes in pricing by Ultratech, its competitors or suppliers; intellectual property matters; cyclicality in the semiconductor and nanotechnology industries; customer concentration; market acceptance of new products and enhanced versions of Ultratech's existing products; international sales; lengthy sales cycles, including the timing of system installations and acceptances; changes to financial accounting standards; timing of new product announcements and releases by Ultratech or its competitors; ability to volume produce systems and meet customer requirements; mix of products sold; rapid technological change and the importance of timely product introductions; dependence on new product introductions and commercial success of any new products; outcome of litigation; sole or limited sources of supply; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; ability and resulting costs to attract or retain sufficient personnel to achieve Ultratech's targets for a particular period; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon Ultratech achieving and maintaining profitability and the market price of Ultratech's stock; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on Ultratech's business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2003 and its Quarterly Report on Form 10-Q filed for the quarter ended October 2, 2004. About Ultratech: Ultratech, Inc. designs, manufactures and markets photolithography equipment used worldwide in the fabrication of semiconductor and nanotechnology devices, and has expanded its technology scope in pioneering laser processing technology for IC manufacturing. Founded in 1979, Ultratech is a market leader in gold and solder bump lithography. Its products are designed to substantially reduce the cost of ownership for manufacturers in the electronics industry. The company's home page on the World Wide Web is located at www.ultratech.com. NOTE: Unity Platform is a trademark of Ultratech, Inc.
SOURCE Ultratech, Inc.