Ultratech Receives Order From DRAM Manufacturer for AP300 Lithography System Built on the Unity Platform(TM)

Nov 18, 2004, 00:00 ET from Ultratech, Inc.

    SAN JOSE, Calif., Nov. 18 /PRNewswire-FirstCall/ -- Ultratech, Inc.
 (Nasdaq:   UTEK), a leading supplier of lithography and laser-processing systems
 used to manufacture semiconductors and nanotechnology devices, today announced
 that it has received an order from a DRAM manufacturer for its AP300
 lithography system, built on the new Unity Platform(TM).  The customer intends
 to utilize Ultratech's AP300 -- capable of processing both 200- and 300-mm
 wafers -- for wafer-level chip scale packaging (WLCSP) solutions.  This order
 highlights the adoption of the company's Unity Platform design and supports
 Ultratech's position as a market leader at the forefront of the migration from
 wire bonding to WLCSP.
     Market research firm TechSearch International, Inc. expects a five-fold
 increase in the WLCSP market between 2004 and 2007.  Behind this rapid growth
 is an increasing demand for integrated passives, power devices and DRAM that
 require advanced packaging technology.  To meet the speed requirements of
 today's high-end graphic memory devices, DRAM manufacturers are moving from
 wire bonding to WLCSP, which enables increased device performance and the
 ability to meet shrinking form-factor design rules.
     "The AP300 system order for our customer's pilot WLCSP production line
 shows Ultratech's advanced packaging technology expertise and market
 leadership.  The order from a DRAM manufacturer demonstrates that the memory
 market is beginning the migration from wire bonding to WLCSP," noted Stephen
 Kay, director, product marketing for Ultratech's Advanced Packaging
 Technology.  "Ultratech's technology expertise, including the AP300's
 outstanding flexibility, extendibility and advanced lithography technology for
 200- and 300-mm wafer processing, we believe played an important role in the
 customer's selection criteria.  In addition, Ultratech is strategically
 positioned to support the DRAM manufacturing industry as it transitions to
 WLCSP technology.  We look forward to supporting customer requirements for
 cost-effective DRAM manufacturing -- today and in the future."
     Certain of the statements contained herein may be considered forward-
 looking statements under Section 27A of the Securities Act of 1933, as
 amended, and Section 21E of the Securities Exchange Act of 1934, as amended,
 that involve risks and uncertainties, such as lengthy and costly development
 cycles for advanced lithography and laser-processing technologies and
 applications; integration, development and associated expenses of the laser
 processing operation; delays, deferrals and cancellations of orders by
 customers; expiration of licensing arrangements, and the resulting adverse
 impact on Ultratech's licensing revenues; high degree of industry competition;
 pricing pressures and product discounts; changes in pricing by Ultratech, its
 competitors or suppliers; intellectual property matters; cyclicality in the
 semiconductor and nanotechnology industries; customer concentration; market
 acceptance of new products and enhanced versions of Ultratech's existing
 products; international sales; lengthy sales cycles, including the timing of
 system installations and acceptances; changes to financial accounting
 standards; timing of new product announcements and releases by Ultratech or
 its competitors; ability to volume produce systems and meet customer
 requirements; mix of products sold; rapid technological change and the
 importance of timely product introductions; dependence on new product
 introductions and commercial success of any new products; outcome of
 litigation; sole or limited sources of supply; manufacturing variances and
 production levels; timing and degree of success of technologies licensed to
 outside parties; product concentration and lack of product revenue
 diversification; inventory obsolescence; asset impairment; ability and
 resulting costs to attract or retain sufficient personnel to achieve
 Ultratech's targets for a particular period; dilutive effect of employee stock
 option grants on net income per share, which is largely dependent upon
 Ultratech achieving and maintaining profitability and the market price of
 Ultratech's stock; effects of certain anti-takeover provisions; future
 acquisitions; volatility of stock price; business interruptions due to natural
 disasters or utility failures; environmental regulations; and any adverse
 effects of terrorist attacks in the United States or elsewhere, or government
 responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on
 the economy, in general, or on Ultratech's business in particular.  Such risks
 and uncertainties are described in Ultratech's SEC reports including its
 Annual Report on Form 10-K filed for the year ended December 31, 2003 and its
 Quarterly Report on Form 10-Q filed for the quarter ended October 2, 2004.
     About Ultratech:  Ultratech, Inc. designs, manufactures and markets
 photolithography equipment used worldwide in the fabrication of semiconductor
 and nanotechnology devices, and has expanded its technology scope in
 pioneering laser processing technology for IC manufacturing.  Founded in 1979,
 Ultratech is a market leader in gold and solder bump lithography.  Its
 products are designed to substantially reduce the cost of ownership for
 manufacturers in the electronics industry.  The company's home page on the
 World Wide Web is located at www.ultratech.com.
     NOTE:  Unity Platform is a trademark of Ultratech, Inc.

SOURCE Ultratech, Inc.