News from flipchip international

Jun 09, 2014, 09:05 ET
FlipChip International. (PRNewsFoto/FlipChip International)

FlipChip International and Fujikura Limited Participating in the Packaging and Assembly Considerations in Wearable Electronics Workshop

 FlipChip International - (FCI), the global technology leader in flip chip bumping and wafer level packaging, announced that their CTO, Ted...

May 12, 2014, 09:30 ET
FlipChip International. (PRNewsFoto/FlipChip International)

FlipChip International attending the MagnaChip Semiconductor Corporation Foundry Technology Symposium

 FlipChip International - (FCI), the global technology leader in Flip Chip bumping and Wafer Level Packaging announced they will sponsor the...

Mar 10, 2014, 02:00 ET
FlipChip International. (PRNewsFoto/FlipChip International)

FlipChip International at IMAPS 2014

FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced they will give the following...

Nov 12, 2013, 06:00 ET
FlipChip International. (PRNewsFoto/FlipChip International)

FlipChip International announces 100% ownership of Millennium Microtech (Shanghai) and FCMS.

 FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today the 100%...

Sep 03, 2013, 13:01 ET
FlipChip International. (PRNewsFoto/FlipChip International)

FlipChip International announces the Appointment of David Wilkie as President and Chief Executive Officer

FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging, announced today the appointment of...

Mar 18, 2013, 19:30 ET

FlipChip International Announces Elite™ OPM Technology for High Yield Copper Wire Bonding on Multiple Nodes of Semiconductor Devices

 FlipChip International (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today its Elite™ OPM...

Mar 18, 2013, 09:00 ET
FlipChip International. (PRNewsFoto/FlipChip International)

FlipChip International and EZconn Czech a.s. Announce Partnership in Wafer Level Micro Assembly Technologies and Services.

 FlipChip International (FCI), the global technology leader in flip chip bumping, Wafer Level and embedded die packaging and EZconn Czech...

Aug 01, 2012, 06:00 ET

FlipChip International Announces the Appointment of Weng Kay Lui as Asian Sales Director.

 FlipChip International - (FCI), the global technology leader in Wafer Level Packaging and flip chip bumping announced today the appointment of...

Jul 09, 2012, 06:00 ET
FlipChip International. (PRNewsFoto/FlipChip International)

FlipChip International Announces the Acquisition of Millennium Microtech Holdings Corporation and Controlling Interest in Millenium Microtech Shanghai

 FlipChip International - (FCI), a global technology leader in Wafer Level Packaging and flip chip wafer bumping, announced today the...

Jun 12, 2012, 14:37 ET

FlipChip International and Fujikura Ltd. Announce Strategic Business Agreement for ChipletT and ChipsetT Fan-Out and Fan-In 3D Semiconductor Packages.

FlipChip International, LLC (FCI) of Phoenix, Arizona (President: Bob Forcier) and Fujikura Ltd. (President: Yoichi Nagahama) today announced...

Mar 06, 2012, 09:00 ET
FlipChip International. (PRNewsFoto/FlipChip International)

FlipChip International and NANIUM S.A. Announce License, Sales and Marketing Agreements for 300mm Wafer Level Packaging Services

FlipChip International (FCI), the global technology leader in flipchip bumping and Wafer Level Packaging, and NANIUM S.A. (NANIUM), a world-class...

Nov 10, 2011, 08:00 ET

FlipChip International and Fujikura Ltd. Announce ChipletT™/ ChipsetT™ Ultra Thin 3D Packages

FlipChip International, LLC USA (FCI)  and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT™ and ChipsetT™...

Jul 11, 2011, 08:00 ET

RoseStreet Labs Scientists Demonstrate First Long Wavelength LED Based on InGaN on Silicon Technology

RoseStreet Labs, (RSL), announced today the world's first demonstration of a long wavelength LED device utilizing low cost silicon wafer...

Jun 13, 2011, 11:18 ET

FlipChip International and Fujikura Forge Partnership for Advanced Semiconductor Packaging Technologies

Fujikura Limited today announced an exciting collaboration with FlipChip International, LLC of Phoenix, Arizona USA on next generation...

Sep 13, 2010, 10:22 ET

FlipChip International Achieves ISO/TS 16949 Certification

FlipChip International (FCI) today announced that it has been granted ISO/TS 16949 certification at both its Bumping Facility in Phoenix and Die...

Aug 16, 2010, 09:00 ET

FlipChip International and Cookson Electronics Announce Polymer Collar Technology Patent License Agreement

FlipChip International (FCI) today announced that it has signed a patent license agreement with Cookson Electronics covering its intention to...

Nov 09, 2009, 08:00 ET

FlipChip International Announces Next Generation Adaptable NANOPillar(TM) Bumping Technology for Lead-Free Fine Pitch Flip Chip and 3D Packaging Applications

FlipChip International today announced a major step forward in semiconductor package miniaturization with its NANOPillar(TM), wafer bumping...

Oct 26, 2009, 09:30 ET

FlipChip International and IC Interconnect Announce U.S. Sales and Marketing Agreement for Wafer Level Packaging Services.

FlipChip International, (FCI), the global technology leader in flip-chip bumping and Wafer Level Packaging and IC Interconnect (ICI), a TS16949...

Mar 16, 2009, 07:00 ET

FlipChip International, LLC, Announces 300mm Strategic Partnership With SMIC

TKTK, 2009 -- FlipChip International, (FCI), the global technology leader in flip-chip bumping and wafer level packaging, announced today a...

Jul 08, 2008, 01:00 ET

Hermes European Embedded Die Consortia Selects FlipChip International's EDC (TM) (Embeddable Die Customization (TM)) Technology

PHOENIX, July 8 /PRNewswire/ -- Hermes, the European consortia for the development and industrialization of embedded die technology has...

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