News from FlipChip International, LLC A wide array of domestic and global news stories; news topics include politics/government, business, technology, religion, sports/entertainment, science/nature, and health/lifestyle. Articles that appear in this section may be written in English or other languages.

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Oct 01, 2014, 15:29 ET FlipChip International Creates 250 Multi-Product Wafer Bump Designs

 FlipChip International - (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their...


Jun 09, 2014, 09:05 ET FlipChip International and Fujikura Limited Participating in the Packaging and Assembly Considerations in Wearable Electronics Workshop

 FlipChip International - (FCI), the global technology leader in flip chip bumping and wafer level packaging, announced that their CTO, Ted...


May 12, 2014, 09:30 ET FlipChip International attending the MagnaChip Semiconductor Corporation Foundry Technology Symposium

 FlipChip International - (FCI), the global technology leader in Flip Chip bumping and Wafer Level Packaging announced they will sponsor the...


Nov 12, 2013, 06:00 ET FlipChip International announces 100% ownership of Millennium Microtech (Shanghai) and FCMS.

 FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today the 100%...


Sep 03, 2013, 13:01 ET FlipChip International announces the Appointment of David Wilkie as President and Chief Executive Officer

FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging, announced today the appointment of...


Mar 18, 2013, 19:30 ET FlipChip International Announces Elite™ OPM Technology for High Yield Copper Wire Bonding on Multiple Nodes of Semiconductor Devices

 FlipChip International (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today its Elite™ OPM...


Mar 18, 2013, 09:00 ET FlipChip International and EZconn Czech a.s. Announce Partnership in Wafer Level Micro Assembly Technologies and Services.

 FlipChip International (FCI), the global technology leader in flip chip bumping, Wafer Level and embedded die packaging and EZconn Czech...


Aug 01, 2012, 06:00 ET FlipChip International Announces the Appointment of Weng Kay Lui as Asian Sales Director.

 FlipChip International - (FCI), the global technology leader in Wafer Level Packaging and flip chip bumping announced today the appointment of...


Jul 09, 2012, 06:00 ET FlipChip International Announces the Acquisition of Millennium Microtech Holdings Corporation and Controlling Interest in Millenium Microtech Shanghai

 FlipChip International - (FCI), a global technology leader in Wafer Level Packaging and flip chip wafer bumping, announced today the...


Jun 12, 2012, 14:37 ET FlipChip International and Fujikura Ltd. Announce Strategic Business Agreement for ChipletT and ChipsetT Fan-Out and Fan-In 3D Semiconductor Packages.

FlipChip International, LLC (FCI) of Phoenix, Arizona (President: Bob Forcier) and Fujikura Ltd. (President: Yoichi Nagahama) today announced...


Mar 06, 2012, 09:00 ET FlipChip International and NANIUM S.A. Announce License, Sales and Marketing Agreements for 300mm Wafer Level Packaging Services

FlipChip International (FCI), the global technology leader in flipchip bumping and Wafer Level Packaging, and NANIUM S.A. (NANIUM), a world-class...


Nov 10, 2011, 08:00 ET FlipChip International and Fujikura Ltd. Announce ChipletT™/ ChipsetT™ Ultra Thin 3D Packages

FlipChip International, LLC USA (FCI)  and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT™ and ChipsetT™...


Jul 11, 2011, 08:00 ET RoseStreet Labs Scientists Demonstrate First Long Wavelength LED Based on InGaN on Silicon Technology

RoseStreet Labs, (RSL), announced today the world's first demonstration of a long wavelength LED device utilizing low cost silicon wafer...


Jun 13, 2011, 11:18 ET FlipChip International and Fujikura Forge Partnership for Advanced Semiconductor Packaging Technologies

Fujikura Limited today announced an exciting collaboration with FlipChip International, LLC of Phoenix, Arizona USA on next generation...


Sep 13, 2010, 10:22 ET FlipChip International Achieves ISO/TS 16949 Certification

FlipChip International (FCI) today announced that it has been granted ISO/TS 16949 certification at both its Bumping Facility in Phoenix and Die...


Aug 16, 2010, 09:00 ET FlipChip International and Cookson Electronics Announce Polymer Collar Technology Patent License Agreement

FlipChip International (FCI) today announced that it has signed a patent license agreement with Cookson Electronics covering its intention to...


Oct 26, 2009, 09:30 ET FlipChip International and IC Interconnect Announce U.S. Sales and Marketing Agreement for Wafer Level Packaging Services.

FlipChip International, (FCI), the global technology leader in flip-chip bumping and Wafer Level Packaging and IC Interconnect (ICI), a TS16949...


Mar 16, 2009, 07:00 ET FlipChip International, LLC, Announces 300mm Strategic Partnership With SMIC

TKTK, 2009 -- FlipChip International, (FCI), the global technology leader in flip-chip bumping and wafer level packaging, announced today a...


Jul 08, 2008, 01:00 ET Hermes European Embedded Die Consortia Selects FlipChip International's EDC (TM) (Embeddable Die Customization (TM)) Technology

PHOENIX, July 8 /PRNewswire/ -- Hermes, the European consortia for the development and industrialization of embedded die technology has...


Mar 17, 2008, 01:00 ET FlipChip International Announces Official Opening of FABLAB, WLCSP & 3D Packaging Innovation Center

PHOENIX, March 17 /PRNewswire/ -- FlipChip International today announced the official opening of its FABLAB & Center of Innovation aimed at...


Nov 13, 2007, 00:00 ET FlipChip International's EDC(TM) Enables Embedded Die Packaging

PHOENIX, Nov. 13 /PRNewswire/ -- FlipChip International today announced the introduction of its new EDC(TM), Embeddable Die Customization(TM)...


Nov 12, 2007, 00:00 ET FlipChip International Announces Expansion of DSD Fab to 3 Million Die Weekly Capacity

TEMPE, Ariz., Nov. 12 /PRNewswire/ -- FlipChip International, LLC (FCI) announced the completion of its first phase expansion in Q4 2007 of its...


Sep 24, 2007, 01:00 ET FlipChip International Appoints David McComb as Vice President Sales and Marketing

PHOENIX, Sept. 24 /PRNewswire/ -- FlipChip International, LLC announced today that it has appointed David McComb as Global Vice President Sales...


Sep 10, 2007, 01:00 ET FlipChip International and White Mountain Labs Announce Turnkey Business Offering Using Eagle Test ETS364 Platform

PHOENIX, Sept. 10 /PRNewswire/ -- FlipChip International (FCI), the leading merchant flip chip and wafer level package provider, and White...


Aug 07, 2007, 01:00 ET FlipChip International Appoints Scott T. Barrett as Vice President Asian Business Development

PHOENIX, Aug. 7 /PRNewswire/ -- FlipChip International LLC announced today that it has appointed Scott T. Barrett as Vice President Asian...