ChipPAC Introduces Industry's First Advanced Package Design & Characterization System

SmartDESIGN(TM) Includes Electrical,

Mechanical and Thermal Simulation Analysis



Apr 26, 2001, 01:00 ET from ChipPAC, Inc.

    SANTA CLARA, Calif., April 26 /PRNewswire/ --
 ChipPAC, Inc. (Nasdaq:   CHPC), one of the world's largest and most diversified
 semiconductor packaging, test and distribution providers, today unveiled its
 new, automated SmartDESIGN(TM) packaging design system.  Developed to optimize
 device performance and reliability while reducing customer cost and time to
 market,  SmartDESIGN is a fully-integrated IC packaging design and
 characterization process that includes electrical, mechanical and thermal
 simulation analysis.
     "ChipPAC is the only assembly and test company in the world to provide its
 customers with this kind of characterization analysis as a standard part of
 package design," said Dennis McKenna, Chief Executive Officer and President of
 ChipPAC.  "This process allows us to better serve our customers by providing
 the most reliable package solutions with the fastest turn times possible."
     SmartDESIGN describes a service- and performance-driven design process
 that begins when a customer inputs complete package and performance
 requirements via the company's website.  Data is fed directly to ChipPAC's
 design and characterization team which then utilizes the input from the onset
 of the design cycle to produce a final product that meets all performance
 specifications.  ChipPAC offers the broadest portfolio of packages available
 in the SAT industry and has already adapted SmartDESIGN for use with all of
 its chip package families.
     "This tightly-coupled package design and characterization system is unique
 to ChipPAC and comes after years of internal development and automation to
 ensure accuracy and rapid response times," said Marcos Karnezos, ChipPAC's
 Chief Technology Officer.  "With operating frequencies common in the
 Giga-Hertz range and ball pitches moving to 0.5mm and less, today's customers
 have to be concerned both with device performance and the reliability of their
 end-product.  By supporting all of our designs with advanced
 electrical-mechanical-thermal simulation analysis, SmartDESIGN provides our
 customers with the up-front services they need as well as end-products that
 fully support their time-to-market and applications requirements."
     Beginning in June of 2001, ChipPAC will also offer SmartDESIGN technology
 seminars in strategic locations around the world.  Data pertinent to both
 top-level management and design engineers will be presented covering the
 company's new products as well as emerging industry technologies and the
 relation of each to SmartDESIGN advanced package design and characterization.
 The first of these seminars is scheduled for June 26th in San Jose,
 California.
     SmartDESIGN advanced packaging design centers are located in ChipPAC's
 Chandler, Arizona, and Ichon, Korea, facilities.  Additional centers are
 planned for company sites in China and Malaysia.
 
     About ChipPAC, Inc.
     ChipPAC is a full-portfolio provider of semiconductor packaging, test and
 distribution services that combines a history of innovation and reliability
 with more than a decade of experience satisfying some of the largest -- and
 most demanding -- customers in the industry.  With advanced process technology
 capabilities and a global manufacturing presence spanning Korea, China,
 Malaysia and the United States, ChipPAC has established a reputation for
 providing dependable, high quality packaging solutions.  For more information,
 visit the company's web site at http://www.chippac.com.
 
      Investor and Media Contacts
      David Pasquale, 646-536-7006, or Julie Prozeller, 646-536-7010
      Both with The Ruth Group, http://www.TheRuthGroup.com
 
     This press release includes forward-looking statements, as that term is
 defined in the Private Securities Reform Act of 1995, which are subject to
 known and unknown risks and uncertainties that could cause actual results to
 differ materially from those expressed or implied by such statements.  These
 forward-looking statements include statements regarding market conditions in
 2001, expected continued demand for our services and products, growth in our
 end markets, targeted investments to support customer requirements, our
 ability to execute on planned product development, revenue and earnings
 projections, and our position to capitalize on future growth in the
 semiconductor industry.  Some of these risks and uncertainties are detailed in
 documents filed with the Securities and Exchange Commission, and include, but
 may not necessarily be limited to, fluctuations in customer demand, raw
 material costs, exchange rates, timing and success of new product and service
 introductions, the ongoing quality of the Company's services, the trends in
 our financial performance, and the ability of the Company's principal
 suppliers to provide materials and equipment on a timely and cost competitive
 basis.  The Company undertakes no obligation to update the information in this
 press release.
 
 

SOURCE ChipPAC, Inc.
    SANTA CLARA, Calif., April 26 /PRNewswire/ --
 ChipPAC, Inc. (Nasdaq:   CHPC), one of the world's largest and most diversified
 semiconductor packaging, test and distribution providers, today unveiled its
 new, automated SmartDESIGN(TM) packaging design system.  Developed to optimize
 device performance and reliability while reducing customer cost and time to
 market,  SmartDESIGN is a fully-integrated IC packaging design and
 characterization process that includes electrical, mechanical and thermal
 simulation analysis.
     "ChipPAC is the only assembly and test company in the world to provide its
 customers with this kind of characterization analysis as a standard part of
 package design," said Dennis McKenna, Chief Executive Officer and President of
 ChipPAC.  "This process allows us to better serve our customers by providing
 the most reliable package solutions with the fastest turn times possible."
     SmartDESIGN describes a service- and performance-driven design process
 that begins when a customer inputs complete package and performance
 requirements via the company's website.  Data is fed directly to ChipPAC's
 design and characterization team which then utilizes the input from the onset
 of the design cycle to produce a final product that meets all performance
 specifications.  ChipPAC offers the broadest portfolio of packages available
 in the SAT industry and has already adapted SmartDESIGN for use with all of
 its chip package families.
     "This tightly-coupled package design and characterization system is unique
 to ChipPAC and comes after years of internal development and automation to
 ensure accuracy and rapid response times," said Marcos Karnezos, ChipPAC's
 Chief Technology Officer.  "With operating frequencies common in the
 Giga-Hertz range and ball pitches moving to 0.5mm and less, today's customers
 have to be concerned both with device performance and the reliability of their
 end-product.  By supporting all of our designs with advanced
 electrical-mechanical-thermal simulation analysis, SmartDESIGN provides our
 customers with the up-front services they need as well as end-products that
 fully support their time-to-market and applications requirements."
     Beginning in June of 2001, ChipPAC will also offer SmartDESIGN technology
 seminars in strategic locations around the world.  Data pertinent to both
 top-level management and design engineers will be presented covering the
 company's new products as well as emerging industry technologies and the
 relation of each to SmartDESIGN advanced package design and characterization.
 The first of these seminars is scheduled for June 26th in San Jose,
 California.
     SmartDESIGN advanced packaging design centers are located in ChipPAC's
 Chandler, Arizona, and Ichon, Korea, facilities.  Additional centers are
 planned for company sites in China and Malaysia.
 
     About ChipPAC, Inc.
     ChipPAC is a full-portfolio provider of semiconductor packaging, test and
 distribution services that combines a history of innovation and reliability
 with more than a decade of experience satisfying some of the largest -- and
 most demanding -- customers in the industry.  With advanced process technology
 capabilities and a global manufacturing presence spanning Korea, China,
 Malaysia and the United States, ChipPAC has established a reputation for
 providing dependable, high quality packaging solutions.  For more information,
 visit the company's web site at http://www.chippac.com.
 
      Investor and Media Contacts
      David Pasquale, 646-536-7006, or Julie Prozeller, 646-536-7010
      Both with The Ruth Group, http://www.TheRuthGroup.com
 
     This press release includes forward-looking statements, as that term is
 defined in the Private Securities Reform Act of 1995, which are subject to
 known and unknown risks and uncertainties that could cause actual results to
 differ materially from those expressed or implied by such statements.  These
 forward-looking statements include statements regarding market conditions in
 2001, expected continued demand for our services and products, growth in our
 end markets, targeted investments to support customer requirements, our
 ability to execute on planned product development, revenue and earnings
 projections, and our position to capitalize on future growth in the
 semiconductor industry.  Some of these risks and uncertainties are detailed in
 documents filed with the Securities and Exchange Commission, and include, but
 may not necessarily be limited to, fluctuations in customer demand, raw
 material costs, exchange rates, timing and success of new product and service
 introductions, the ongoing quality of the Company's services, the trends in
 our financial performance, and the ability of the Company's principal
 suppliers to provide materials and equipment on a timely and cost competitive
 basis.  The Company undertakes no obligation to update the information in this
 press release.
 
 SOURCE  ChipPAC, Inc.