ESEC Features New Flip Chip Die Bonder for Smart Card Applications At SEMICON Europa 2001

Apr 23, 2001, 01:00 ET from ESEC Inc.

    CHAM, Switzerland, April 23 /PRNewswire Interactive News Release/ -- ESEC
 will demonstrate its new Flip Chip Die Bonder 2008xSC(FC) at SEMICON Europa
 2001, April 24-26, Munich Convention Center, Hall A1 booth #202. The Die
 Bonder 2008xSC is ESEC's new expandable high speed die bonder platform for
 endless tape applications. The machine's modularity enables semiconductor
 manufacturers to run different reel to reel applications on the same platform,
 which leads to outstanding cost performance.
 
     The solution for smart card
     The 2008xSC is ESEC's new solution for smart card applications featuring a
 throughput rate of 8000 UPH with a bonding accuracy of 15 micron (1sigma)
 ESEC's 2008xSC is a reliable system as it is based on the field-proven Die
 Bonders 2008SC and 2008xP -- models that have sold more than 80 units since
 introduction. Upgrading the 2008SC has lead to several improvements of ESEC's
 key technologies for reel to reel applications. The pick and place has been
 equipped with a high speed drive and the indexer incorporates a rail as
 y-guide, which results in superior reliability and an extended application
 range. In addition, the 2008xSC is prepared for an upgradeable kit to achieve
 compliance with Sematech S2-0200.
     A number of features unique to ESEC equipment enable further performance
 improvements. A wide application range of 0.2mm up to 25mm die leads to
 enhanced cost performance. The indexing system enables the handling of thin
 substrates, which are used for new low cost Flip Chip applications. In
 addition, a tape width up to 70mm reduces the cost for tape material.
 
     Convertible for Flip Chip
     The 2008xSC is convertible to a high speed Flip Chip machine. The Flip
 Chip Module is designed for high speed flip chip bonding for RF applications,
 smart cards and logic devices. These applications need the lowest cost of
 ownership while featuring highest productivity at a lower accuracy. As a flip
 chip bonder, the 2008xSC(FC) has productivity of up to 6000 UPH and a bond
 accuracy of +/- 50 micron (3 sigma). An even higher accuracy can be achieved
 according to the configurable centering systems.
     A new control system with a improved HMI enables the integration of the
 latest technology and the readiness for the upcoming low cost Flip Chip
 applications.
     The introduction of ESEC's new Flip Chip Smart Card Die Bonder is a
 further step in ESEC's Modular Single Platform Strategy. Because of the unique
 equipment modularity, semiconductor manufacturers can use the same platform
 for competitive production performance on different applications. This is
 particularly important for the industry's subcontract assemblers, who must
 quickly reconfigure package specifications to meet the market's rapidly
 changing demands.
     ESEC is the expert for total assembly solutions and the leading global
 provider of chip assembly equipment, processing techniques and systems
 solutions for the semiconductor industry. The core business of ESEC
 encompasses Die Bonders, Wire Bonders, Flip Chip Bonders (Micron) and a
 computer-integrated production cell, the Autoline, as well as solutions for
 factory integration. ESEC's net revenues for its 2000 financial year
 (10 month) equalled CHF 531.7 million (US$332.4 million) and the company has
 reported an operating profit (EBIT) for this 10 month period of
 CHF 156.1 million (US$97.5 million). ESEC maintains customer support centers
 worldwide. ESEC's web site address is www.esec.com.
 
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SOURCE ESEC Inc.
    CHAM, Switzerland, April 23 /PRNewswire Interactive News Release/ -- ESEC
 will demonstrate its new Flip Chip Die Bonder 2008xSC(FC) at SEMICON Europa
 2001, April 24-26, Munich Convention Center, Hall A1 booth #202. The Die
 Bonder 2008xSC is ESEC's new expandable high speed die bonder platform for
 endless tape applications. The machine's modularity enables semiconductor
 manufacturers to run different reel to reel applications on the same platform,
 which leads to outstanding cost performance.
 
     The solution for smart card
     The 2008xSC is ESEC's new solution for smart card applications featuring a
 throughput rate of 8000 UPH with a bonding accuracy of 15 micron (1sigma)
 ESEC's 2008xSC is a reliable system as it is based on the field-proven Die
 Bonders 2008SC and 2008xP -- models that have sold more than 80 units since
 introduction. Upgrading the 2008SC has lead to several improvements of ESEC's
 key technologies for reel to reel applications. The pick and place has been
 equipped with a high speed drive and the indexer incorporates a rail as
 y-guide, which results in superior reliability and an extended application
 range. In addition, the 2008xSC is prepared for an upgradeable kit to achieve
 compliance with Sematech S2-0200.
     A number of features unique to ESEC equipment enable further performance
 improvements. A wide application range of 0.2mm up to 25mm die leads to
 enhanced cost performance. The indexing system enables the handling of thin
 substrates, which are used for new low cost Flip Chip applications. In
 addition, a tape width up to 70mm reduces the cost for tape material.
 
     Convertible for Flip Chip
     The 2008xSC is convertible to a high speed Flip Chip machine. The Flip
 Chip Module is designed for high speed flip chip bonding for RF applications,
 smart cards and logic devices. These applications need the lowest cost of
 ownership while featuring highest productivity at a lower accuracy. As a flip
 chip bonder, the 2008xSC(FC) has productivity of up to 6000 UPH and a bond
 accuracy of +/- 50 micron (3 sigma). An even higher accuracy can be achieved
 according to the configurable centering systems.
     A new control system with a improved HMI enables the integration of the
 latest technology and the readiness for the upcoming low cost Flip Chip
 applications.
     The introduction of ESEC's new Flip Chip Smart Card Die Bonder is a
 further step in ESEC's Modular Single Platform Strategy. Because of the unique
 equipment modularity, semiconductor manufacturers can use the same platform
 for competitive production performance on different applications. This is
 particularly important for the industry's subcontract assemblers, who must
 quickly reconfigure package specifications to meet the market's rapidly
 changing demands.
     ESEC is the expert for total assembly solutions and the leading global
 provider of chip assembly equipment, processing techniques and systems
 solutions for the semiconductor industry. The core business of ESEC
 encompasses Die Bonders, Wire Bonders, Flip Chip Bonders (Micron) and a
 computer-integrated production cell, the Autoline, as well as solutions for
 factory integration. ESEC's net revenues for its 2000 financial year
 (10 month) equalled CHF 531.7 million (US$332.4 million) and the company has
 reported an operating profit (EBIT) for this 10 month period of
 CHF 156.1 million (US$97.5 million). ESEC maintains customer support centers
 worldwide. ESEC's web site address is www.esec.com.
 
                     MAKE YOUR OPINION COUNT -  Click Here
                http://tbutton.prnewswire.com/prn/11690X54714096
 
 SOURCE  ESEC Inc.