ESI Introduces New Dual Head Laser Microvia Drilling Platform Enabling Improved Performance and Accuracy

Apr 02, 2001, 01:00 ET from Electro Scientific Industries, Inc.

    PORTLAND, Oregon, April 2 /PRNewswire/ --
 Electro Scientific Industries, Inc. (Nasdaq: ESIO) introduced its dual head
 microvia drilling platform targeted at the high density interconnect (HDI) and
 packaging markets at the IPC Printed Circuit Expo, in Anaheim, California.
     (Photo:  http://www.newscom.com/cgi-bin/prnh/19990831/ESILOGO )
     The Model 5400 Dual Head Laser Microvia Drilling platform incorporates
 ESI's patented compound beam positioner.  The fluid motion of the beam
 positioner stage provides customers with greater throughput and accuracy,
 increasing productivity over conventional step and repeat methods.
     "This new platform, with its dual head configuration, increases
 productivity by at least 60 percent and expands ESI's array of drilling
 solutions for our customers," said Tom Richardson, general manager for ESI's
 advanced packaging products.  "The 5400 series offers flexibility and
 cost-effective drilling solutions and provides a platform for future
 technology upgrades."
     The first member of the dual head series, being shown at IPC Printed
 Circuits Expo, is the Model 5420 Dual Head Laser Microvia Drill.  It is
 targeted at decreasing costs for copper cutting for high density interconnect
 (HDI) applications such as mobile telecommunications.  Lower costs are
 achieved by using a high peak power laser that eliminates the need for
 pre-etching the copper.  This process produces clean, high-aspect-ratio vias.
     The dual head platform will allow ESI to configure the system specifically
 for the application.  A UV laser for example, may be used to punch blind vias
 in IC packaging substrates, while a second dual head C02 drill would be used
 on fiber reinforced materials for cell phone applications.  In addition the
 platform is field extensible to allow for future upgrades of new laser or
 optic technologies, protecting the customers' capital investment.
     While the dual head technology has been available in a step and repeat
 format, ESI's patented compound beam positioner gives users the innovative
 capability to move each of the drills independently in a linear, fluid,
 high-speed motion along both an X and Y axis, eliminating many sources of
 errors found in most two-stage designs.  Because via spacing is generally
 small, the galvanometer field can be small and very accurate.  Distortions
 found in larger galvanometer systems aren't a factor in this design, nor are
 "patchwork" or "abutment" errors that may arise by piecing together smaller
 fields over a large area.
 
     About IPC Printed Circuits Expo 2001
     IPC Printed Circuits Expo is the largest conference and exhibition for the
 printed circuit industry. IPC is a US-based trade association dedicated to the
 competitive excellence and financial success of its more than 2,700 member
 companies which represent all facets of the electronic interconnection
 industry, including design, printed wiring board manufacturing and electronics
 assembly.
 
     About ESI's Advanced Packaging Products
     ESI's advanced packaging product line provides innovative, cost-effective
 via solutions to the high density interconnect (HDI) and advanced packaging
 markets.  Anticipating design and production needs, ESI continuously targets
 improved accuracy and production rates, while simultaneously providing
 solutions that enable customers to shrink pad design for increased density of
 the circuit board or electronic package.  By offering complete via technology,
 regardless of drilling method deployed, ESI is committed to meeting the
 challenges of existing and emerging applications in integrated circuit (IC)
 packages, multi-chip modules and high density printed wiring boards.
 
     About ESI
     Electro Scientific Industries, headquartered in Portland, Oregon, designs
 and manufactures sophisticated products used around the world in electronics
 manufacturing including:  laser manufacturing systems for semiconductor yield
 improvement; production and test equipment for the manufacture of surface
 mount ceramic capacitors; laser trim systems for precise electrical tuning of
 circuits; precision laser and mechanical drilling systems for electronic
 interconnection; and machine vision systems. Electro Scientific Industries is
 traded on Nasdaq under ESIO. For more information, visit ESI's web site at
 www.esi.com.
 
 

SOURCE Electro Scientific Industries, Inc.
    PORTLAND, Oregon, April 2 /PRNewswire/ --
 Electro Scientific Industries, Inc. (Nasdaq: ESIO) introduced its dual head
 microvia drilling platform targeted at the high density interconnect (HDI) and
 packaging markets at the IPC Printed Circuit Expo, in Anaheim, California.
     (Photo:  http://www.newscom.com/cgi-bin/prnh/19990831/ESILOGO )
     The Model 5400 Dual Head Laser Microvia Drilling platform incorporates
 ESI's patented compound beam positioner.  The fluid motion of the beam
 positioner stage provides customers with greater throughput and accuracy,
 increasing productivity over conventional step and repeat methods.
     "This new platform, with its dual head configuration, increases
 productivity by at least 60 percent and expands ESI's array of drilling
 solutions for our customers," said Tom Richardson, general manager for ESI's
 advanced packaging products.  "The 5400 series offers flexibility and
 cost-effective drilling solutions and provides a platform for future
 technology upgrades."
     The first member of the dual head series, being shown at IPC Printed
 Circuits Expo, is the Model 5420 Dual Head Laser Microvia Drill.  It is
 targeted at decreasing costs for copper cutting for high density interconnect
 (HDI) applications such as mobile telecommunications.  Lower costs are
 achieved by using a high peak power laser that eliminates the need for
 pre-etching the copper.  This process produces clean, high-aspect-ratio vias.
     The dual head platform will allow ESI to configure the system specifically
 for the application.  A UV laser for example, may be used to punch blind vias
 in IC packaging substrates, while a second dual head C02 drill would be used
 on fiber reinforced materials for cell phone applications.  In addition the
 platform is field extensible to allow for future upgrades of new laser or
 optic technologies, protecting the customers' capital investment.
     While the dual head technology has been available in a step and repeat
 format, ESI's patented compound beam positioner gives users the innovative
 capability to move each of the drills independently in a linear, fluid,
 high-speed motion along both an X and Y axis, eliminating many sources of
 errors found in most two-stage designs.  Because via spacing is generally
 small, the galvanometer field can be small and very accurate.  Distortions
 found in larger galvanometer systems aren't a factor in this design, nor are
 "patchwork" or "abutment" errors that may arise by piecing together smaller
 fields over a large area.
 
     About IPC Printed Circuits Expo 2001
     IPC Printed Circuits Expo is the largest conference and exhibition for the
 printed circuit industry. IPC is a US-based trade association dedicated to the
 competitive excellence and financial success of its more than 2,700 member
 companies which represent all facets of the electronic interconnection
 industry, including design, printed wiring board manufacturing and electronics
 assembly.
 
     About ESI's Advanced Packaging Products
     ESI's advanced packaging product line provides innovative, cost-effective
 via solutions to the high density interconnect (HDI) and advanced packaging
 markets.  Anticipating design and production needs, ESI continuously targets
 improved accuracy and production rates, while simultaneously providing
 solutions that enable customers to shrink pad design for increased density of
 the circuit board or electronic package.  By offering complete via technology,
 regardless of drilling method deployed, ESI is committed to meeting the
 challenges of existing and emerging applications in integrated circuit (IC)
 packages, multi-chip modules and high density printed wiring boards.
 
     About ESI
     Electro Scientific Industries, headquartered in Portland, Oregon, designs
 and manufactures sophisticated products used around the world in electronics
 manufacturing including:  laser manufacturing systems for semiconductor yield
 improvement; production and test equipment for the manufacture of surface
 mount ceramic capacitors; laser trim systems for precise electrical tuning of
 circuits; precision laser and mechanical drilling systems for electronic
 interconnection; and machine vision systems. Electro Scientific Industries is
 traded on Nasdaq under ESIO. For more information, visit ESI's web site at
 www.esi.com.
 
 SOURCE  Electro Scientific Industries, Inc.