EV Group and CEA/Leti Partner to Accelerate Adoption of TSV and 3D Integration Technology

Apr 01, 2009, 09:00 ET from EV Group (EVG)

ST. FLORIAN, Austria, April 1 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has entered a joint development program (JDP) with CEA/Leti -- one of Europe's renowned research labs focusing on microelectronics and nanotechnology. EVG, an early leader in through-silicon-via (TSV) and 3D integration technology, will provide CEA/Leti with its world-class, 300-mm temporary bonding and debonding technology. The first system will be shipped in May. The joint development work will focus on further developing these technologies and processes to accelerate continued adoption of TSV technology -- given its demonstrated advantages, which include higher performance, increased functionality, smaller footprint and lower power consumption.

More functionality, lower power

Flash memory and image sensors continue to lead the charge implementing 3D IC/TSV technology due to the complexity of the device structure and demands for more functionality with lower power. In demonstrating a cost-effective, manufacturable stackable interconnection technology, experts project TSV adoption to grow intensively over the next few years expanding into various other advanced IC applications. This joint development program spearheads another critical step to readying integrated device manufacturers and foundries to fully implement 3D integration technology and processes into their production lines, and bringing this technology's advantages to a global commercial scale.

"We are extremely pleased to be working with EVG--not only for their proven bonding/debonding and thin-wafer handling technology systems, but also for the tremendous groundwork and expertise on tools for TSV technology and 3D integration they bring to the table, which complements our own know-how in this field," said Nicolas Sillon, the head of the laboratory for advanced packaging and 3D integration at Leti. "TSV and 3D integration is proving to be a viable solution to a critical roadblock in advanced device performance. Together we can continue to unlock the full potential of this technology to ensure widespread commercialization for high-volume applications."

Successful results

Commenting on today's announcement, Stefan Pargfrieder, EVG's business development manager noted, "CEA/Leti is a world leader in accelerating emerging technologies to widespread market adoption. We are thrilled to be working with such a prestigious institution, and believe their expertise will be crucial to this JDP and pushing TSV and 3D technology forward in the market place. We are seeing an increasing number of high-volume manufacturers exploring implementation of this technology in their production lines, and this joint effort with CEA/Leti will be instrumental in continuing this positive momentum."

This cooperation also strengthens the existing and established joint development activities between Brewer Science, EVG and Leti. Ultimately, it exemplifies the synergy between materials, equipment and process expertise, and further enables value-added products and know-how in the growing field of 3D IC/TSV technology, as well as other potential users of temporary bonding and debonding techniques.

CEA/Leti and EV Group have already commenced work on the project and have produced successful results in 3D applications using their TSV technology and processes.

About EV Group

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at www.EVGroup.com.


CEA-LETI, the Laboratory for Electronics & Information Technology is operated by Direction de la Recherche Technologique at CEA, the French Atomic Energy Commission. It mainly aims at helping companies to increase their competitiveness through technological innovation and transfer of its technical know-how to industry. Major player in the MINATEC Micro-Nano technologies innovation center, CEA-LETI benefits from 8000 m2 state-of-the-art clean rooms, with equipments worth some 160 million euros. It is currently employing some 1600 people among whom 1100 CEA employees and co-workers of various status including 100 people from industrial partners, working in the CEA-LETI premises within the framework of bilateral collaborations. Overall, research contracts with industry are worth 75% of CEA-LETI annual income. It has a very important patents portfolio, and filed last year more than 200 patents and 700 publications. The laboratory is structured into six departments, with a specific department operating 24-7 the technological facilities of the silicon technology platform, and five application-oriented programs covering the fields of microelectronics, microsystems, optronics, system design and telco, and technologies for bio and healthcare. For more information, visit www.leti.fr.