Kinetics Introduces K1S Modular Gas System - Delivers Major Boost for 300mm Upgrades & Tools

Apr 24, 2001, 01:00 ET from Kinetics Group, Inc.

    SANTA CLARA, Calif., April 24 /PRNewswire Interactive News Release/ --
 Kinetics Group Inc., launched K1S, its innovative 11/8-inch "compact" modular
 surface-mount gas system in Europe at SEMICON EUROPA.  This innovative modular
 technology delivers a breakthrough in weight and size reduction compared with
 both conventional welded gas sticks and the previous generation of 11/2-inch
 modular systems.
     It provides device manufacturers and wafer fabrication tool OEMs the
 technology to meet the aggressive footprint and pricing targets demanded for
 300mm semiconductor fabrication equipment.  As well as advancing gas system
 design, Kinetics is actively promoting standardization efforts by providing
 the industry with royalty-free licenses for K1S design specifications.
     "With the advent of the 11/8-inch substrate platform, the advantages of
 compact modular technology are now compelling," said Peter English, director
 for Kinetics Fluid Systems Europe.  "Since semiconductor manufacturers
 and equipment OEMs are reluctant to choose products available from a
 single-source, we believe open principles and standardization will drive
 adoption of the technology -- benefiting the industry as a whole."
     The 11/8-inch component interface K1S system uses the C-seal
 specifications of SEMI PR 3.1, and builds on several previous generations of
 modular technology to deliver new levels of performance.  Based on a 10 stick
 gas system, a K1S gas system would weigh 36.8kg (81 pounds), compared with
 45.9kg (101 pounds) for a conventional welded stick, and around 57.2kg
 (126 pounds) for a previous generation 11/2-inch system.  The 11/8-inch
 footprint allows space savings of 30-50% from previous generation modular
 systems, and 50-75% from conventional welded gas systems.  It is this powerful
 combination of attributes -- plus the major step towards standardization
 -- which is expected to speed the adoption of surface mount, gas systems
 technology by tool OEMs.
     K1S is based on substrate modules that connect via a "tongue and groove"
 configuration, and bolt together to connect flow components without special
 tooling.  This allows semiconductor tool OEMs and semiconductor manufacturers
 to build custom gas sticks extremely rapidly, and to break them down for
 process upgrades or maintenance with equal ease -- at a cost competitive with
 welded gas systems.  Thanks to the elimination of welds and the ease of
 reconfiguration to handle last-minute changes, lead-times are typically
 reduced by over 50%, to 3-4 weeks, compared with 10-12 weeks for conventional
 gas systems.
     K1S uses active components to bridge the modules -- thereby eliminating
 assembly seals and fasteners -- and a planar structure which allows all
 components to be installed or removed from one direction using a single
 wrench.  The substrate modules feature dowel pins for self-alignment, graphics
 to help users visualize the gas flow path, and industry-standard seals -- for
 open compatibility with valves, regulators, filters, transducers and mass flow
 controllers (MFCs) from all major manufacturers.
     Kinetics is supporting European demand for the new modular technology from
 its regional headquarters in Ireland, where it has both gas system
 manufacturing and MFC support facilities.  The first K1S system destined for
 use in Europe was shipped from this facility just prior to SEMICON Europa.
     "Modular technology is now progressing rapidly from evaluation and
 qualification phases into production," adds Peter English.  "OEMs are now
 beginning to standardize on the approach, and we expect the technology to make
 the break into volume production this year."
     Kinetics is the world's largest provider of critical process
 infrastructure, uniquely positioned to meet its customers' needs for capacity
 expansions and integration of new process and manufacturing technologies in
 their facilities.  Kinetics designs and manufactures gas distribution systems,
 mass flow controllers, re-circulating coolers and chillers, chemical and
 slurry blending and distribution systems, and provides outsource contract
 manufacturing services.
 
                      MAKE YOUR OPINION COUNT - Click Here
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SOURCE Kinetics Group, Inc.
    SANTA CLARA, Calif., April 24 /PRNewswire Interactive News Release/ --
 Kinetics Group Inc., launched K1S, its innovative 11/8-inch "compact" modular
 surface-mount gas system in Europe at SEMICON EUROPA.  This innovative modular
 technology delivers a breakthrough in weight and size reduction compared with
 both conventional welded gas sticks and the previous generation of 11/2-inch
 modular systems.
     It provides device manufacturers and wafer fabrication tool OEMs the
 technology to meet the aggressive footprint and pricing targets demanded for
 300mm semiconductor fabrication equipment.  As well as advancing gas system
 design, Kinetics is actively promoting standardization efforts by providing
 the industry with royalty-free licenses for K1S design specifications.
     "With the advent of the 11/8-inch substrate platform, the advantages of
 compact modular technology are now compelling," said Peter English, director
 for Kinetics Fluid Systems Europe.  "Since semiconductor manufacturers
 and equipment OEMs are reluctant to choose products available from a
 single-source, we believe open principles and standardization will drive
 adoption of the technology -- benefiting the industry as a whole."
     The 11/8-inch component interface K1S system uses the C-seal
 specifications of SEMI PR 3.1, and builds on several previous generations of
 modular technology to deliver new levels of performance.  Based on a 10 stick
 gas system, a K1S gas system would weigh 36.8kg (81 pounds), compared with
 45.9kg (101 pounds) for a conventional welded stick, and around 57.2kg
 (126 pounds) for a previous generation 11/2-inch system.  The 11/8-inch
 footprint allows space savings of 30-50% from previous generation modular
 systems, and 50-75% from conventional welded gas systems.  It is this powerful
 combination of attributes -- plus the major step towards standardization
 -- which is expected to speed the adoption of surface mount, gas systems
 technology by tool OEMs.
     K1S is based on substrate modules that connect via a "tongue and groove"
 configuration, and bolt together to connect flow components without special
 tooling.  This allows semiconductor tool OEMs and semiconductor manufacturers
 to build custom gas sticks extremely rapidly, and to break them down for
 process upgrades or maintenance with equal ease -- at a cost competitive with
 welded gas systems.  Thanks to the elimination of welds and the ease of
 reconfiguration to handle last-minute changes, lead-times are typically
 reduced by over 50%, to 3-4 weeks, compared with 10-12 weeks for conventional
 gas systems.
     K1S uses active components to bridge the modules -- thereby eliminating
 assembly seals and fasteners -- and a planar structure which allows all
 components to be installed or removed from one direction using a single
 wrench.  The substrate modules feature dowel pins for self-alignment, graphics
 to help users visualize the gas flow path, and industry-standard seals -- for
 open compatibility with valves, regulators, filters, transducers and mass flow
 controllers (MFCs) from all major manufacturers.
     Kinetics is supporting European demand for the new modular technology from
 its regional headquarters in Ireland, where it has both gas system
 manufacturing and MFC support facilities.  The first K1S system destined for
 use in Europe was shipped from this facility just prior to SEMICON Europa.
     "Modular technology is now progressing rapidly from evaluation and
 qualification phases into production," adds Peter English.  "OEMs are now
 beginning to standardize on the approach, and we expect the technology to make
 the break into volume production this year."
     Kinetics is the world's largest provider of critical process
 infrastructure, uniquely positioned to meet its customers' needs for capacity
 expansions and integration of new process and manufacturing technologies in
 their facilities.  Kinetics designs and manufactures gas distribution systems,
 mass flow controllers, re-circulating coolers and chillers, chemical and
 slurry blending and distribution systems, and provides outsource contract
 manufacturing services.
 
                      MAKE YOUR OPINION COUNT - Click Here
                http://tbutton.prnewswire.com/prn/11690X93434118
 
 SOURCE  Kinetics Group, Inc.