LSI Logic and TSMC to Team on Process Technology and Manufacturing

Two Technology Leaders to Cooperate on Advanced Process Technology Development



Apr 04, 2001, 01:00 ET from LSI Logic Corporation

    MILPITAS, Calif., April 4 /PRNewswire/ -- LSI Logic Corporation
 (NYSE:   LSI) and Taiwan Semiconductor Manufacturing Company Ltd. (NYSE:   TSM)
 today announced an agreement to combine their efforts for development of
 advanced process technologies and to collaborate on state-of-the-art
 manufacturing.
     Under the co-development agreement, LSI Logic and TSMC will deploy a
 jointly developed 0.13-micron process technology. LSI Logic will support
 customer design programs for leading-edge system-on-a-chip products using this
 advanced process. Resulting products will be produced in both LSI Logic's and
 TSMC's world-class manufacturing facilities. The two companies have also
 agreed to explore collaborative opportunities on next generation process
 technology nodes, which will be ahead of published industry roadmaps.
     "This agreement strengthens LSI Logic's process technology and
 manufacturing roadmap by incorporating the best of both companies' advanced
 process technologies within LSI Logic's manufacturing facilities," said
 Joe Zelayeta, LSI Logic executive vice president of Worldwide Operations.
 "We fully intend to use these capabilities to better serve our customer base
 around the world."
     "TSMC is pleased to cooperate with system-on-chip leader LSI Logic on this
 advanced 0.13-micron process technology," said F.C. Tseng, TSMC president.
 "The technology developed under this agreement expands TSMC's 0.13-micron core
 technology, which has been in production since last December. We will also
 provide LSI Logic with additional world-class manufacturing capacity."
     The agreement continues an industrywide trend toward the sharing of
 process technology research and development costs and the increased use of
 foundries to efficiently support customer demand levels.
     "We are undertaking this strategic initiative to better serve our
 customers competing in fast-growing global communications and storage
 markets," said Ronnie Vasishta, LSI Logic vice president of Technology
 Marketing. "This agreement will ensure that as the company grows we continue
 to focus company resources on technology development projects that provide the
 greatest added value to our customers."
 
     Safe Harbor for Forward-Looking Statements:
     Statements contained in this news release relating to the parties'
 activities, benefits and other consequences anticipated by their agreement on
 the matters to which this news release apply, are forward-looking statements
 within the meaning of Section 27A of the Securities Act of 1933, as amended
 and Section 21E of the Securities and Exchange Act of 1934, as amended. The
 forward-looking statements included in this news release are made only as of
 the date of this news release and neither party to this news release
 undertakes any obligation to update the forward looking statements to reflect
 subsequent events or circumstances. The actual results obtained by either or
 both parties regarding any expectation or other matter to which the statements
 in this news release relate in future periods may be materially different from
 any suggested in this news release. Each company urges the reader to consider
 the risks and uncertainties to which each company is subject and which may
 cause actual results to differ materially from the expectations of each
 company or its management. Such risks and uncertainties may include, but may
 not necessarily be limited to fluctuations in the timing and volumes of
 customer demand, the rate of depletion of customer inventory buildup, each
 company's dealings with third parties for essential goods, rights and services
 and each company's achievement of revenue objectives and other financial
 targets. Other risks and uncertainties include, but are not necessarily
 limited to the timing and success of completion of their process development
 activities, new product introductions based on the technology development
 objectives, the continued availability of appropriate levels of manufacturing
 capacity and the realization of benefits from each company's other strategic
 relationships and investments. The extent to which each company's plans for
 future cost reductions are realized may also impact its future performance.
 Each company operates in an industry sector where securities' values are
 highly volatile and may be influenced by economic and other factors beyond the
 company's control. In the context of forward-looking information provided in
 this news release, reference is made to the discussion of risk factors
 detailed in each company's filings from time to time with the Securities and
 Exchange Commission, including but not limited to filings made during the past
 12 months.
 
     About LSI Logic
     LSI Logic Corporation is a leading designer and manufacturer of
 communications and storage semiconductors for applications that access,
 interconnect and store data, voice and video. In addition, the company
 supplies storage network solutions for the enterprise. LSI Logic is
 headquartered at 1551 McCarthy Boulevard, Milpitas, CA 95035, 408-433-8000,
 http://www.lsilogic.com .
 
     About TSMC
     TSMC is the world's largest dedicated semiconductor foundry, providing the
 industry's leading process technology, library and IP options and other
 leading-edge foundry services. TSMC operates two six-inch wafer fabs and nine
 eight-inch wafer fabs in three countries, including its two joint ventures
 fabs -- Vanguard and SSMC -- and its North American subsidiary, WaferTech. In
 2000, TSMC produced the foundry industry's first 300mm customer wafers and
 began constructing two dedicated 300mm fabs. TSMC's corporate headquarters are
 in Hsin-Chu, Taiwan. More information about TSMC is available through the
 World Wide Web at http://www.tsmc.com .
 
     Editor's Notes:
     (1) All LSI Logic news releases (financial, acquisitions, manufacturing,
 products, technology etc.) are issued exclusively by PR Newswire and are
 immediately thereafter posted on the company's external website,
 http://www.lsilogic.com .
     (2) The LSI Logic logo design is a registered trademark of
 LSI Logic Corporation.
     (3) All other brand or product names may be trademarks or registered
 trademarks of their respective companies.
 
 

SOURCE LSI Logic Corporation
    MILPITAS, Calif., April 4 /PRNewswire/ -- LSI Logic Corporation
 (NYSE:   LSI) and Taiwan Semiconductor Manufacturing Company Ltd. (NYSE:   TSM)
 today announced an agreement to combine their efforts for development of
 advanced process technologies and to collaborate on state-of-the-art
 manufacturing.
     Under the co-development agreement, LSI Logic and TSMC will deploy a
 jointly developed 0.13-micron process technology. LSI Logic will support
 customer design programs for leading-edge system-on-a-chip products using this
 advanced process. Resulting products will be produced in both LSI Logic's and
 TSMC's world-class manufacturing facilities. The two companies have also
 agreed to explore collaborative opportunities on next generation process
 technology nodes, which will be ahead of published industry roadmaps.
     "This agreement strengthens LSI Logic's process technology and
 manufacturing roadmap by incorporating the best of both companies' advanced
 process technologies within LSI Logic's manufacturing facilities," said
 Joe Zelayeta, LSI Logic executive vice president of Worldwide Operations.
 "We fully intend to use these capabilities to better serve our customer base
 around the world."
     "TSMC is pleased to cooperate with system-on-chip leader LSI Logic on this
 advanced 0.13-micron process technology," said F.C. Tseng, TSMC president.
 "The technology developed under this agreement expands TSMC's 0.13-micron core
 technology, which has been in production since last December. We will also
 provide LSI Logic with additional world-class manufacturing capacity."
     The agreement continues an industrywide trend toward the sharing of
 process technology research and development costs and the increased use of
 foundries to efficiently support customer demand levels.
     "We are undertaking this strategic initiative to better serve our
 customers competing in fast-growing global communications and storage
 markets," said Ronnie Vasishta, LSI Logic vice president of Technology
 Marketing. "This agreement will ensure that as the company grows we continue
 to focus company resources on technology development projects that provide the
 greatest added value to our customers."
 
     Safe Harbor for Forward-Looking Statements:
     Statements contained in this news release relating to the parties'
 activities, benefits and other consequences anticipated by their agreement on
 the matters to which this news release apply, are forward-looking statements
 within the meaning of Section 27A of the Securities Act of 1933, as amended
 and Section 21E of the Securities and Exchange Act of 1934, as amended. The
 forward-looking statements included in this news release are made only as of
 the date of this news release and neither party to this news release
 undertakes any obligation to update the forward looking statements to reflect
 subsequent events or circumstances. The actual results obtained by either or
 both parties regarding any expectation or other matter to which the statements
 in this news release relate in future periods may be materially different from
 any suggested in this news release. Each company urges the reader to consider
 the risks and uncertainties to which each company is subject and which may
 cause actual results to differ materially from the expectations of each
 company or its management. Such risks and uncertainties may include, but may
 not necessarily be limited to fluctuations in the timing and volumes of
 customer demand, the rate of depletion of customer inventory buildup, each
 company's dealings with third parties for essential goods, rights and services
 and each company's achievement of revenue objectives and other financial
 targets. Other risks and uncertainties include, but are not necessarily
 limited to the timing and success of completion of their process development
 activities, new product introductions based on the technology development
 objectives, the continued availability of appropriate levels of manufacturing
 capacity and the realization of benefits from each company's other strategic
 relationships and investments. The extent to which each company's plans for
 future cost reductions are realized may also impact its future performance.
 Each company operates in an industry sector where securities' values are
 highly volatile and may be influenced by economic and other factors beyond the
 company's control. In the context of forward-looking information provided in
 this news release, reference is made to the discussion of risk factors
 detailed in each company's filings from time to time with the Securities and
 Exchange Commission, including but not limited to filings made during the past
 12 months.
 
     About LSI Logic
     LSI Logic Corporation is a leading designer and manufacturer of
 communications and storage semiconductors for applications that access,
 interconnect and store data, voice and video. In addition, the company
 supplies storage network solutions for the enterprise. LSI Logic is
 headquartered at 1551 McCarthy Boulevard, Milpitas, CA 95035, 408-433-8000,
 http://www.lsilogic.com .
 
     About TSMC
     TSMC is the world's largest dedicated semiconductor foundry, providing the
 industry's leading process technology, library and IP options and other
 leading-edge foundry services. TSMC operates two six-inch wafer fabs and nine
 eight-inch wafer fabs in three countries, including its two joint ventures
 fabs -- Vanguard and SSMC -- and its North American subsidiary, WaferTech. In
 2000, TSMC produced the foundry industry's first 300mm customer wafers and
 began constructing two dedicated 300mm fabs. TSMC's corporate headquarters are
 in Hsin-Chu, Taiwan. More information about TSMC is available through the
 World Wide Web at http://www.tsmc.com .
 
     Editor's Notes:
     (1) All LSI Logic news releases (financial, acquisitions, manufacturing,
 products, technology etc.) are issued exclusively by PR Newswire and are
 immediately thereafter posted on the company's external website,
 http://www.lsilogic.com .
     (2) The LSI Logic logo design is a registered trademark of
 LSI Logic Corporation.
     (3) All other brand or product names may be trademarks or registered
 trademarks of their respective companies.
 
 SOURCE  LSI Logic Corporation

RELATED LINKS

http://www.lsilogic.com