ALISO VIEJO, Calif., March 4, 2016 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it is the recipient of the 2016 Electronic and Software Technologies Network (ESTnet) Innovative Product or Software Application Award for its MiniSIM ZL70323, a miniaturized radio module for implantable medical devices. Recognized by Wales-based ESTnet during a recent award ceremony, the winning application was based on Microsemi's embedded die technology, which was leveraged to produce the unique new radio module.
"This prestigious award from the ESTnet validates Microsemi's unique capabilities in miniaturization, which utilize Large Area Panel (LAP)-based embedded die technology to perform subsystem size reduction levels that cannot be achieved via standard chip-on-board technology—offering our customers performance, reliability and security," said Martin McHugh, head of business and technology development at Microsemi. "The miniaturization of Microsemi's award-winning MiniSIM has helped us launch the next generation of our patient-friendly pacemaker modules, gain entry into the neural stimulation market and provide a platform for entry into the Internet of Things (IoT) and wearable device market."
The MiniSIM concept has reduced the size of implantable radio modules by 70 percent. The size reduction has been achieved through an embedded die, a unique innovation that places the die inside the printed circuit board (PCB) and under other components to produce a module that is 5.5mm x 4.5mm x 1.5mm. This minute module can be directly soldered to a mother PCB using its surface mount solder pads. In addition to standard implantable radio modules like the MiniSIM ZL70323, Microsemi also offers package miniaturization services. See more at http://www.microsemi.com/design-support/package-miniaturization-services.
The ESTnet Award judges recognized Microsemi for demonstrating increased business opportunities directly affected by the company's development of its MiniSIM device. It was also acknowledged for its evidence of innovative technology, as well as research and development successes including time-to-market.
"This year's awards are once again a testament to the fantastic work and innovation taking place within Wales' technology sector," said ESTnet managing director, Avril Lewis. "This level of interest really does reflect the changing nature of our industry and highlights just how important it is for businesses to engage with the ESTnet, government and academic institutions to ensure we are at the forefront of digital skills for the future. The ESTnet is here to bring us all together, to listen to industry needs and to do our utmost to meet them."
Now in its fourth year, the annual ESTnet Awards celebrate excellence in Wales' electronics and software technologies sector. The Microsemi team was recognized during a ceremony held March 2 at the Wales Millennium Centre in Cardiff, UK, where more than 350 guests from the technology industry and related sectors were in attendance. For a full list of award winners, finalists and short video clips of each, visit http://www.estnetawards.co.uk/estnet-award-winners-and-finalists-2016/.
Created in 2011, the ESTnet is a network of technology organizations whose members design, develop, manufacture or integrate electronic and software technologies. ESTnet's associated members include supply chains and the professional services which support it. Its affiliate members provide the industry with professional services, and its academic members provide the industry with good quality graduates and opportunities to collaborate on research and innovation. The network provides a collaborative environment in which people and organizations working with these enabling technologies can create strong business relationships, exchange knowledge and share ideas.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements to Microsemi being the recipient of the 2016 Electronic and Software Technologies Network (ESTnet) Innovative Product or Software Application Award for its MiniSIM ZL70323, a miniaturized radio module for implantable medical devices, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation