Pacific Aerospace & Electronics Secures New Patent for Medical Electronic Packaging

Apr 25, 2001, 01:00 ET from Pacific Aerospace & Electronics, Inc.

    WENATCHEE, Wash., April 25 /PRNewswire/ --
 Pacific Aerospace & Electronics, Inc. (Nasdaq: PCTH), a diversified
 manufacturing company specializing in metal and ceramic components and
 assemblies, announced today that the Company's Interconnect Division has been
 granted a significant hermetic sealing patent from the United States Patent
 Office.
     The patent (U.S. No. 6,221,513) describes methodology and materials
 related to component assemblies and products that hermetically seal ceramic to
 metallic surfaces. The metallic component contains titanium, and the ceramic
 component comprises zirconia. This new process will result in highly robust,
 next generation electronic packages useful in a variety of applications,
 including advanced implantable medical devices.
     "The award of this patent will enable PA&E to maintain its leading
 position in advanced hermetic packaging of complex electronic devices," said
 Werner Hafelfinger, Vice President Operations and COO of the Company. "We
 believe our proprietary technology strengthens our long-term position as a
 technology leader in hermetic packaging for mission-critical electronic
 devices."
     Pacific Aerospace & Electronics, Inc. is an international engineering and
 manufacturing company specializing in technically demanding component designs
 and assemblies for global leaders in the aerospace, defense, electronics,
 medical, telecommunications, energy and transportation industries. The Company
 utilizes specialized manufacturing techniques, advanced materials science,
 process engineering and proprietary technologies and processes to its
 competitive advantage. Pacific Aerospace & Electronics, Inc. has approximately
 1,000 employees worldwide and is organized into three operational groups
 -- U.S. Aerospace, U.S. Electronics and European Aerospace. More information
 may be obtained by contacting the company directly or by visiting its Web site
 at www.pcth.com.
     Forward-looking statements in this release concerning trends or
 anticipated results are made pursuant to the safe harbor provisions of the
 Private Securities Litigation Reform Act of 1995. Actual results could differ
 materially from those stated or implied in the forward-looking statements. The
 forward-looking statements in this release are not guarantees of future
 performance and are subject to risks and uncertainties related to the
 Company's operations and its ability to obtain sufficient cash if and when
 needed. These risks and uncertainties include, but are not limited to,
 competitive factors (including the possibility of increased competition or
 technological development, competitors, and price pressures); legal factors
 (such as limited protection of the Company's proprietary technology and
 changes in government regulation); financial factors (such as the Company's
 significant debt load); and the Company's dependence on key personnel and
 significant customers. More information about potential factors that could
 affect the Company's financial results is included in the Company's filings
 with the Securities and Exchange Commission. All forward-looking statements
 included in this release are based on information available to the Company as
 of the date of this release, and the Company assumes no obligation to update
 any such forward-looking statements.
 
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SOURCE Pacific Aerospace & Electronics, Inc.
    WENATCHEE, Wash., April 25 /PRNewswire/ --
 Pacific Aerospace & Electronics, Inc. (Nasdaq: PCTH), a diversified
 manufacturing company specializing in metal and ceramic components and
 assemblies, announced today that the Company's Interconnect Division has been
 granted a significant hermetic sealing patent from the United States Patent
 Office.
     The patent (U.S. No. 6,221,513) describes methodology and materials
 related to component assemblies and products that hermetically seal ceramic to
 metallic surfaces. The metallic component contains titanium, and the ceramic
 component comprises zirconia. This new process will result in highly robust,
 next generation electronic packages useful in a variety of applications,
 including advanced implantable medical devices.
     "The award of this patent will enable PA&E to maintain its leading
 position in advanced hermetic packaging of complex electronic devices," said
 Werner Hafelfinger, Vice President Operations and COO of the Company. "We
 believe our proprietary technology strengthens our long-term position as a
 technology leader in hermetic packaging for mission-critical electronic
 devices."
     Pacific Aerospace & Electronics, Inc. is an international engineering and
 manufacturing company specializing in technically demanding component designs
 and assemblies for global leaders in the aerospace, defense, electronics,
 medical, telecommunications, energy and transportation industries. The Company
 utilizes specialized manufacturing techniques, advanced materials science,
 process engineering and proprietary technologies and processes to its
 competitive advantage. Pacific Aerospace & Electronics, Inc. has approximately
 1,000 employees worldwide and is organized into three operational groups
 -- U.S. Aerospace, U.S. Electronics and European Aerospace. More information
 may be obtained by contacting the company directly or by visiting its Web site
 at www.pcth.com.
     Forward-looking statements in this release concerning trends or
 anticipated results are made pursuant to the safe harbor provisions of the
 Private Securities Litigation Reform Act of 1995. Actual results could differ
 materially from those stated or implied in the forward-looking statements. The
 forward-looking statements in this release are not guarantees of future
 performance and are subject to risks and uncertainties related to the
 Company's operations and its ability to obtain sufficient cash if and when
 needed. These risks and uncertainties include, but are not limited to,
 competitive factors (including the possibility of increased competition or
 technological development, competitors, and price pressures); legal factors
 (such as limited protection of the Company's proprietary technology and
 changes in government regulation); financial factors (such as the Company's
 significant debt load); and the Company's dependence on key personnel and
 significant customers. More information about potential factors that could
 affect the Company's financial results is included in the Company's filings
 with the Securities and Exchange Commission. All forward-looking statements
 included in this release are based on information available to the Company as
 of the date of this release, and the Company assumes no obligation to update
 any such forward-looking statements.
 
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                http://tbutton.prnewswire.com/prn/11690X13433653
 
 SOURCE  Pacific Aerospace & Electronics, Inc.