Park Electrochemical Corp. Announces Integration of Metclad SA Into Neltec, Inc. and Plans to Expand RF/Microwave Business in North America

Apr 25, 2001, 01:00 ET from Park Electrochemical Corp.

    LAKE SUCCESS, N.Y., April 25 /PRNewswire/ -- Park Electrochemical Corp.
 (NYSE:   PKE) announced the integration of its Metclad SA business in
 Lannemezan, France into its Neltec, Inc. business in Tempe, Arizona and plans
 for the expansion of its RF/microwave materials business into North America.
 The Company will install new RF/microwave materials manufacturing equipment at
 Neltec's recently expanded production facility in Tempe, Arizona.  This
 installation is expected to be operational in Park's current fiscal year's
 third quarter and will enable this facility to produce materials for the
 cellular infrastructure, wireless broadband, and digital broadband markets. In
 addition, the new equipment will be capable of producing very large format
 RF/microwave materials.  As part of the integration, Metclad SA is changing
 its name to Neltec SA but will continue to manufacture and develop high speed
 RF/microwave products.  The Metclad product line will be integrated into the
 Neltec global product line of high performance multilayer materials.  The
 Metclad business will report to Robert A. Forcier, President of Neltec, Inc.
 and Senior Vice President, OEM Marketing and Technology, of Park.
      Mr. Forcier said,  "We are very excited about adding manufacturing
 capability for RF/microwave materials in North America and integrating Metclad
 SA into Neltec, Inc.  As wireless and digital broadband technologies
 proliferate, we see a unique opportunity to provide our customers with new
 solutions for critical speed and signal integrity requirements.  With the
 addition of the Metclad product line, we will extend our technology solutions
 to include rapidly growing applications such as Bluetooth, 3G, advanced power
 amplifiers, embedded antenna designs, optical routers, wide bandwidth
 infrastructure systems and high speed chip packaging.  We are confident that
 Neltec's product capabilities in both RF/microwave products and digital
 broadband products, such as N4000-13, SI(TM) and N6000, will enhance system
 performance for our customers' next generation applications."
 
     Certain portions of this news release may be deemed to constitute
 forward-looking statements that are subject to various factors which could
 cause actual results to differ materially from Park's expectations.  Such
 factors include, but are not limited to, general conditions in the electronics
 industry, Park's competitive position, the status of Park's relationship with
 its customers, economic conditions in international markets, the cost and
 availability of utilities, and the various factors set forth under the caption
 "Factors That May Affect Future Results" after Item 7 of Park's Annual Report
 on Form 10-K for the fiscal year ended February 27, 2000.
 
     Park Electrochemical Corp. is a leading global designer and producer of
 electronic materials used to fabricate complex multilayer printed circuit
 boards, semiconductor packages and other electronic interconnect systems.
 Park specializes in advanced materials for high layer count circuit boards and
 high speed digital broadband telecommunications, internet and networking
 applications.  Park's electronic materials business operates through fully
 integrated business units in Asia, Europe and North America.  The Company's
 major manufacturing facilities are located in Singapore, England, France,
 Germany, New York, Arizona and California.  Park's electronic materials
 business operates under the "Nelco" and "Neltec" names.
     Additional corporate information is available on the World Wide Web at
 http://www.parkelectro.com and http://www.parknelco.com.
 
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SOURCE Park Electrochemical Corp.
    LAKE SUCCESS, N.Y., April 25 /PRNewswire/ -- Park Electrochemical Corp.
 (NYSE:   PKE) announced the integration of its Metclad SA business in
 Lannemezan, France into its Neltec, Inc. business in Tempe, Arizona and plans
 for the expansion of its RF/microwave materials business into North America.
 The Company will install new RF/microwave materials manufacturing equipment at
 Neltec's recently expanded production facility in Tempe, Arizona.  This
 installation is expected to be operational in Park's current fiscal year's
 third quarter and will enable this facility to produce materials for the
 cellular infrastructure, wireless broadband, and digital broadband markets. In
 addition, the new equipment will be capable of producing very large format
 RF/microwave materials.  As part of the integration, Metclad SA is changing
 its name to Neltec SA but will continue to manufacture and develop high speed
 RF/microwave products.  The Metclad product line will be integrated into the
 Neltec global product line of high performance multilayer materials.  The
 Metclad business will report to Robert A. Forcier, President of Neltec, Inc.
 and Senior Vice President, OEM Marketing and Technology, of Park.
      Mr. Forcier said,  "We are very excited about adding manufacturing
 capability for RF/microwave materials in North America and integrating Metclad
 SA into Neltec, Inc.  As wireless and digital broadband technologies
 proliferate, we see a unique opportunity to provide our customers with new
 solutions for critical speed and signal integrity requirements.  With the
 addition of the Metclad product line, we will extend our technology solutions
 to include rapidly growing applications such as Bluetooth, 3G, advanced power
 amplifiers, embedded antenna designs, optical routers, wide bandwidth
 infrastructure systems and high speed chip packaging.  We are confident that
 Neltec's product capabilities in both RF/microwave products and digital
 broadband products, such as N4000-13, SI(TM) and N6000, will enhance system
 performance for our customers' next generation applications."
 
     Certain portions of this news release may be deemed to constitute
 forward-looking statements that are subject to various factors which could
 cause actual results to differ materially from Park's expectations.  Such
 factors include, but are not limited to, general conditions in the electronics
 industry, Park's competitive position, the status of Park's relationship with
 its customers, economic conditions in international markets, the cost and
 availability of utilities, and the various factors set forth under the caption
 "Factors That May Affect Future Results" after Item 7 of Park's Annual Report
 on Form 10-K for the fiscal year ended February 27, 2000.
 
     Park Electrochemical Corp. is a leading global designer and producer of
 electronic materials used to fabricate complex multilayer printed circuit
 boards, semiconductor packages and other electronic interconnect systems.
 Park specializes in advanced materials for high layer count circuit boards and
 high speed digital broadband telecommunications, internet and networking
 applications.  Park's electronic materials business operates through fully
 integrated business units in Asia, Europe and North America.  The Company's
 major manufacturing facilities are located in Singapore, England, France,
 Germany, New York, Arizona and California.  Park's electronic materials
 business operates under the "Nelco" and "Neltec" names.
     Additional corporate information is available on the World Wide Web at
 http://www.parkelectro.com and http://www.parknelco.com.
 
                     MAKE YOUR OPINION COUNT -- Click Here
                http://tbutton.prnewswire.com/prn/11690X64328553
 
 SOURCE  Park Electrochemical Corp.