Simtek Expands Packaging Support for FPGA Replacement Product Family

Apr 30, 2001, 01:00 ET from Simtek Corporation

    COLORADO SPRINGS, Colo., April 30 /PRNewswire/ -- Simtek Corporation
 (OTC Bulletin Board:   SRAM), provider of high performance nonvolatile memory
 and logic integrated circuits, is expanding packaging capabilities in support
 of its FPGA to ASIC conversion products.
     Simtek's Integrated Logic business unit is now supporting conversion of
 high density FPGAs in an extended family of Ball Grid Array (BGA) packaging,
 ranging from ball counts as low as 40 to high density packages that exceed 900
 balls.  Ball pitch ranges from 1.0 mm to 0.5 mm and packages can be as thin as
 1.2 mm.
     Major FPGA manufacturers including Xilinx, Altera and Lattice
 Semiconductor are increasingly using BGA packaging as the technology of choice
 for high density and low profile applications requiring ease of manufacturing,
 low cost and high reliability.
     Simtek can typically deliver prototypes 8 weeks from receipt and approval
 of FPGA design archive files from Xilinx, Altera, Lattice and other suppliers
 with cost savings of at least 50% when compared to the original FPGA.
 Additional information can be found by visiting Simtek's web site or by
 contacting Simtek directly.
 
     Simtek Corporation delivers the world's fastest re-programmable
 nonvolatile semiconductor memories and the industry's most cost-effective FPGA
 to ASIC conversions.  Information on Simtek products can be obtained from its
 web page: www.simtek.com; email: info@simtek.com; by calling (719) 531-9444;
 or fax (719) 531-9481.  The company is headquartered in Colorado Springs,
 Colorado, with international sales and marketing channels.  Simtek is listed
 under the symbol SRAM on the OTC Electronic Bulletin Board.
 
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SOURCE Simtek Corporation
    COLORADO SPRINGS, Colo., April 30 /PRNewswire/ -- Simtek Corporation
 (OTC Bulletin Board:   SRAM), provider of high performance nonvolatile memory
 and logic integrated circuits, is expanding packaging capabilities in support
 of its FPGA to ASIC conversion products.
     Simtek's Integrated Logic business unit is now supporting conversion of
 high density FPGAs in an extended family of Ball Grid Array (BGA) packaging,
 ranging from ball counts as low as 40 to high density packages that exceed 900
 balls.  Ball pitch ranges from 1.0 mm to 0.5 mm and packages can be as thin as
 1.2 mm.
     Major FPGA manufacturers including Xilinx, Altera and Lattice
 Semiconductor are increasingly using BGA packaging as the technology of choice
 for high density and low profile applications requiring ease of manufacturing,
 low cost and high reliability.
     Simtek can typically deliver prototypes 8 weeks from receipt and approval
 of FPGA design archive files from Xilinx, Altera, Lattice and other suppliers
 with cost savings of at least 50% when compared to the original FPGA.
 Additional information can be found by visiting Simtek's web site or by
 contacting Simtek directly.
 
     Simtek Corporation delivers the world's fastest re-programmable
 nonvolatile semiconductor memories and the industry's most cost-effective FPGA
 to ASIC conversions.  Information on Simtek products can be obtained from its
 web page: www.simtek.com; email: info@simtek.com; by calling (719) 531-9444;
 or fax (719) 531-9481.  The company is headquartered in Colorado Springs,
 Colorado, with international sales and marketing channels.  Simtek is listed
 under the symbol SRAM on the OTC Electronic Bulletin Board.
 
                     MAKE YOUR OPINION COUNT -  Click Here
                http://tbutton.prnewswire.com/prn/11690X78258562
 
 SOURCE  Simtek Corporation