Suss Enters SOI Market with First to Market Combination Cleaning and Bonding System

Apr 24, 2001, 01:00 ET from Karl Suss

    MUNICH, Germany, April 24 /PRNewswire Interactive News Release/ --
 Karl Suss unveiled its latest tool, the CL200 Cleaner/SOI Bonder, the first
 system worldwide that cleans, dries, aligns and bonds in one closed chamber
 with specific atmosphere. The system is specially designed for creating
 silicon-on-insulator (SOI) substrates, promising semiconductor materials for
 leading edge devices such as low power and high speed LSIs, smart sensors, and
 smart power devices. The system addresses the growing demand for SOI wafers,
 which Dataquest reports will increase by a compound annual growth rate (CAGR)
 of 55% between 1999 and 2005.
     The Fraunhofer Institute, based in Germany, qualified the CL200 and
 demonstrated very low contamination, high cleaning efficiency and excellent
 bonding results. Two units have already been sold to major semiconductor and
 MEMS/MST manufacturers in the US and Europe.
     "Traditionally, military and aerospace applications and industrial
 equipment have driven SOI device demand," explained Markus Gabriel, the CL200
 product manager for Karl Suss. "This demand is expected to increase while
 gradually shifting to data processing, communications, and consumer
 electronics areas, which would represent a significant growth area for Karl
 Suss. The CL200 facilitates SOI production by minimizing wafer contamination,
 which results in significant bond defect reduction and yield increase."
     SOI wafers are joined together by silicon fusion bonding, a method that
 brings into contact two hydrophilic, mirror-polished, flat and clean silicon
 surfaces and anneals them at high temperature. The CL200 processes two wafers
 simultaneously without separation between process steps. The closed chamber
 acts as splash protection and creates a mini-environment with a controlled
 nitrogen atmosphere for optimum process control. The semiautomatic machine can
 be upgraded to a fully automatic substrate bond cluster.
     Optional cleaning with diluted standard cleaning chemicals is offered for
 process development. The final cleaning is performed by megasonic activation.
 The system has demonstrated the capability to remove fine particles greater
 than or equal to 0.1 micron from the wafer surface. The drying step is
 performed by spinning the wafers at high speed and incorporating
 infrared-heating. Alignment of the wafers is created by floating each
 substrate to reference pins at the flat and the edge. The CL200 initializes
 prebonding by performing a point contact at the edge or center position,
 depending on the required process.
 
     About Karl Suss
     Karl Suss is a global supplier of manufacturing equipment and process
 technology for the advanced packaging, microelectronics and MEMS markets. With
 over 7,000 systems installed, Suss products include coating and developing
 systems, proximity lithography systems, substrate bonders, flip chip bonders
 and probe systems. Headquartered in Munich, Germany, Suss operates nine
 manufacturing, sales and service centers in North America, Europe, Asia and
 Japan. More information about Karl Suss and its products is available from its
 web site at www.suss.com or www.suss.de.
     News release issued on behalf of Suss MicroTec AG (Frankfurt Stock
 Exchange Neuer Markt: SMH), holding company of Karl Suss.
 
                     MAKE YOUR OPINION COUNT -  Click Here
                http://tbutton.prnewswire.com/prn/11690X86368116
 
 

SOURCE Karl Suss
    MUNICH, Germany, April 24 /PRNewswire Interactive News Release/ --
 Karl Suss unveiled its latest tool, the CL200 Cleaner/SOI Bonder, the first
 system worldwide that cleans, dries, aligns and bonds in one closed chamber
 with specific atmosphere. The system is specially designed for creating
 silicon-on-insulator (SOI) substrates, promising semiconductor materials for
 leading edge devices such as low power and high speed LSIs, smart sensors, and
 smart power devices. The system addresses the growing demand for SOI wafers,
 which Dataquest reports will increase by a compound annual growth rate (CAGR)
 of 55% between 1999 and 2005.
     The Fraunhofer Institute, based in Germany, qualified the CL200 and
 demonstrated very low contamination, high cleaning efficiency and excellent
 bonding results. Two units have already been sold to major semiconductor and
 MEMS/MST manufacturers in the US and Europe.
     "Traditionally, military and aerospace applications and industrial
 equipment have driven SOI device demand," explained Markus Gabriel, the CL200
 product manager for Karl Suss. "This demand is expected to increase while
 gradually shifting to data processing, communications, and consumer
 electronics areas, which would represent a significant growth area for Karl
 Suss. The CL200 facilitates SOI production by minimizing wafer contamination,
 which results in significant bond defect reduction and yield increase."
     SOI wafers are joined together by silicon fusion bonding, a method that
 brings into contact two hydrophilic, mirror-polished, flat and clean silicon
 surfaces and anneals them at high temperature. The CL200 processes two wafers
 simultaneously without separation between process steps. The closed chamber
 acts as splash protection and creates a mini-environment with a controlled
 nitrogen atmosphere for optimum process control. The semiautomatic machine can
 be upgraded to a fully automatic substrate bond cluster.
     Optional cleaning with diluted standard cleaning chemicals is offered for
 process development. The final cleaning is performed by megasonic activation.
 The system has demonstrated the capability to remove fine particles greater
 than or equal to 0.1 micron from the wafer surface. The drying step is
 performed by spinning the wafers at high speed and incorporating
 infrared-heating. Alignment of the wafers is created by floating each
 substrate to reference pins at the flat and the edge. The CL200 initializes
 prebonding by performing a point contact at the edge or center position,
 depending on the required process.
 
     About Karl Suss
     Karl Suss is a global supplier of manufacturing equipment and process
 technology for the advanced packaging, microelectronics and MEMS markets. With
 over 7,000 systems installed, Suss products include coating and developing
 systems, proximity lithography systems, substrate bonders, flip chip bonders
 and probe systems. Headquartered in Munich, Germany, Suss operates nine
 manufacturing, sales and service centers in North America, Europe, Asia and
 Japan. More information about Karl Suss and its products is available from its
 web site at www.suss.com or www.suss.de.
     News release issued on behalf of Suss MicroTec AG (Frankfurt Stock
 Exchange Neuer Markt: SMH), holding company of Karl Suss.
 
                     MAKE YOUR OPINION COUNT -  Click Here
                http://tbutton.prnewswire.com/prn/11690X86368116
 
 SOURCE  Karl Suss