Accessibility Statement Skip Navigation
  • Back to Global Sites
  • +972-77-2005042
  • Blog
  • Journalists
  • GDPR
  • Send a Release
PR Newswire: news distribution, targeting and monitoring
  • News
  • Products
  • Contact
  • Hamburger menu
  • PR Newswire: news distribution, targeting and monitoring
  • Send a Release
    • Telephone

    • +972-77-2005042 from 8 AM - 11 PM IL

    • Contact
    • Contact

      +972-77-2005042
      from 8 AM - 11 PM IL

  • Request More Information
  • Journalists
  • GDPR
  • Request More Information
  • Journalists
  • GDPR
  • Request More Information
  • Journalists
  • GDPR
  • Request More Information
  • Journalists
  • GDPR

DustPhotonics Expands Silicon Photonics Portfolio with 2xFR4 Products for AI and Hyperscale Data Centers

DustPhotonics Logo

News provided by

DustPhotonics

01 Apr, 2025, 15:30 IDT

Share this article

Share toX

Share this article

Share toX

Tamar Product Family Includes Industry's First Merchant 1.6T-2xFR4 and 800G-2xFR4 Products with Integrated Optical Multiplexer

MODI'IN, Israel, April 1, 2025 /PRNewswire/ -- DustPhotonics, a leading developer of silicon photonics solutions, today announced Tamar200 and Tamar, two next-generation Photonic Integrated Circuits (PICs) that further extend the company's merchant product leadership. Designed for AI workloads and hyperscale data center environments, the new 1.6T and 800G PICs enable breakthrough levels of performance, density, and power efficiency, and will be on display during a live demonstration at the OFC Trade Show in San Francisco, CA from April 1-3, 2025. 

The Tamar200 is the industry's first merchant 1.6T-2xFR4 PIC. The device supports two transmit channels of 800G-FR4, with each optical lane operating at 200Gb/s per lane, targeting next-generation 2xFR4 optical modules. Similarly, the Tamar PIC delivers two transmit channels of 400G-FR4 operating at 100Gb/s per lane.

Both products include a low-loss athermal integrated multiplexer (mux) and DustPhotonics' proprietary low-loss Mach-Zehnder Modulator (MZM) technology, eliminating the need for a Thermoelectric Cooler (TEC), and dramatically improving overall system efficiency. The products are designed for external lasers and require only 40mW class lasers per wavelength.

"We are excited to offer the first merchant 2xFR4 silicon photonics chip to the industry," stated Yoel Chetrit, CTO of DustPhotonics. "We believe these products will play a significant role in relieving some of the ongoing EML (Electro-Absorbtion Modulated Laser) supply chain constraints in the industry."

Both PICs are designed in a compact footprint ideal for OSFP and other high-density modules and can be used for fully retimed (DSP), Linear Pluggable Optics (LPO), and Linear Receive Optics (LRO) applications at reaches up to 2km.

The chips will be available for sampling later this month. To learn more, visit our team at Booth #5321 at the OFC Trade Show in San Francisco, CA from April 1-3, 2025.

About DustPhotonics

DustPhotonics is a leading developer of silicon photonics technology for hyperscale data center and AI applications. The DustPhotonics technology platform is uniquely built to meet the requirements of the optical networking market, offering significant improvements in bandwidth and speeds while lowering costs and power consumption. For more information, please visit www.dustphotonics.com.

Media Contact:
DustPhotonics, Ltd.
Yossi Lev
+972-73-3982552
www.dustphotonics.com

Logo: https://mma.prnewswire.com/media/2234594/dustphotonics_Logo.jpg

SOURCE DustPhotonics

Modal title

Also from this source

DustPhotonics Launches Industry-First Merchant 1.6Tb/s Silicon Photonics Engine Targeting a Multitude of AI and Hyperscale Data Center Applications

DustPhotonics Launches Industry-First Merchant 1.6Tb/s Silicon Photonics Engine Targeting a Multitude of AI and Hyperscale Data Center Applications

DustPhotonics, a leading developer of silicon photonics technology and solutions for hyperscale data center and AI applications, today announced the...

More Releases From This Source

Explore

Banking & Financial Services

Banking & Financial Services

Artificial Intelligence

Artificial Intelligence

Computer Software

Computer Software

Computer Software

Computer Software

News Releases in Similar Topics

Contact PR Newswire

  • +972-77-2005042
    from 8 AM - 11 PM IL

Global Sites

  • APAC
  • APAC - Traditional Chinese
  • Asia
  • Brazil
  • Canada
  • Czech
  • Denmark
  • Finland
  • France
  • Germany

 

  • India
  • Indonesia
  • Israel
  • Italy
  • Mexico
  • Middle East
  • Middle East - Arabic
  • Netherlands
  • Norway
  • Poland

 

  • Portugal
  • Russia
  • Slovakia
  • Spain
  • Sweden
  • United Kingdom
  • United States

Do not sell or share my personal information:

  • Submit via [email protected] 
  • Call Privacy toll-free: 877-297-8921
Global Sites
  • Asia
  • Brazil
  • Canada
  • Csezh
  • Denmark
  • Finland
  • France
  • Germany
  • India
  • Israel
  • Italie
  • Mexico
  • Middle East
  • Netherlands
  • Norway
  • Poland
  • Portugal
  • Russia
  • Slovakia
  • Spain
  • Sweden
  • United Kingdom
  • United States
+972-77-2005042
from 8 AM - 11 PM IL
  • Terms of Use
  • Privacy Policy
  • Information Security Policy
  • Site Map
  • Cookie Settings
Copyright © 2025 Cision US Inc.