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AT&S bietet herausragende neue Lösungen für eingebettete Leistungselektronik


News provided by

AT&S Austria Technologie & Systemtechnik AG

Dec 22, 2014, 03:00 ET

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AT&S Austria Technologie & Systemtechnik Logo (PRNewsFoto/AT_S)
AT&S Austria Technologie & Systemtechnik Logo (PRNewsFoto/AT_S)

LEOBEN, Österreich, December 22, 2014 /PRNewswire/ --

  • AT&S gelingt erste bahnbrechende Technologie für Leistungselektroniklösungen für Automobil- und Industrieanwendungen  
  • Erste Referenzdesigns weisen deutliche Miniaturisierung bis zu 50% für Leistungsmodule auf 
  • Leistungsanwendungen in verschiedenen Leistungsklassen von 50 W bis 50 kW  
  • 50 W Leistunsgsanwendungen sind bereit zur Industrialisierung 

AT&S ist der führende Anbieter für Embedded Component Packaging-Lösungen. Die patentierte ECP®-Technologie ermöglicht eine weitere Miniaturisierung bei gleichzeitig verbesserter Leistungsfähigkeit. Aufgrund kontinuierlicher technologischer Entwicklungen und starker Partnerschaften konnte AT&S jetzt ausgezeichnete Ergebnisse im Bereich Leistungselektronik erzielen. Diese Lösung gewährleistet deutlich erhöhte Effizienz und Leistungsfähigkeit bei Anwendungen im Industrie- und Automobilbereich.

     (Logo: http://photos.prnewswire.com/prnh/20141222/721394 )

Zusammen mit dem EmPower Konsortium aus wichtigen Playern in der Industrie und Partnern aus der Wissenschaft ist die Entwicklung von Leistungsgehäusen mit eingebetteten Leistungshalbleitern nun bereit für die Industrialisierung. Nach 18-monatiger Projektarbeit zeigen sich jetzt die ersten beeindruckenden Ergebnisse vor allem im Benchmarking mit bestehenden Packaging-Lösungen:

Referenzdesigns wurden bereits produziert und weisen eine Miniaturisierung von bis zu 50% für Leistungsmodule auf. Mit den neuen eingebetteten Packaging-Konzepten wurden Effizienzsteigerungen durch reduzierten Leistungsverlust und verringerte thermische Widerstände erzielt. Neue Plattierungsanlagen für die Beschichtung von Halbleiterwafer wurden entwickelt, um doppelseitige kupferbeschichtete Leistungschips zu realisieren. Dies ermöglicht eine neue Wertschöpfungskette für eingebettete Leistungsgeräte und neue Gehäuselösungen.

Aufgrund dieser positiven Entwicklung sind führende Unternehmen aus der Automobil-, Industrie- & Halbleiterbranche nun auf dem Weg, diese neuen Lösungen zu industrialisieren. Ziel im Industrialisierungsplan sind Leistungsanwendungen (z. B. Gleichstrom/Wechselstrom Konverter, erneuerbare Energielösungen) in verschiedenen Leistungsklassen im Bereich von 50 W bis 50 kW.

Andreas Gerstenmayer, CEO AT&S: "Die steigende Nachfrage im Bereich der Leistungselektronik bestätigt unsere Strategie, den Fokus auf innovative und effiziente Methoden zur Optimierung der Energienutzung zu legen. Auf Basis der erzielten Ergebnisse ist AT&S nun in der Lage, Kunden und potenziellen Kunden in der Automobil-, Industrie- und Halbleiterbranche unsere innovativen Lösungen für eingebettete Leistungselektronik anzubieten."

Das EmPower Konsortium besteht aus folgenden Mitgliedern:

  • AT&S - Österreich
  • Continental - Deutschland
  • STMicroelectronics - Frankreich/Italien
  • TU Wien - Österreich
  • TU Berlin - Deutschland
  • Atotech - Deutschland
  • Ilfa - Deutschland
  • Fundico - Belgien

Über AT&S  

AT&S ist europäischer Marktführer und weltweit einer der führenden Hersteller von hochwertigen Leiterplatten.

Weitere Infos auch unter http://www.ats.net

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Presserückfragen
Christina Schuller, Head of Corporate Communications
AT & S Austria Technologie & Systemtechnik AG
Tel: +43(0)3842-200-5908; Mobile: +43(0)676-8955-5908; [email protected], http://www.ats.net

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