MELVILLE, N.Y., Dec. 21, 2017 /PRNewswire/ -- Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has begun sales of a 200 millimeter (mm) option for the company's FPA-5550iZ2 i-line1 and the FPA-6300ES6a KrF2 semiconductor lithography equipment, released in December 2016 and April 2012 respectively. These two systems are renowned for their capability to mass-produce logic, memory and image sensor devices suited for Internet-of-Things (IoT) and automotive technologies.
For the production of semiconductor devices, such as memory and microprocessors, manufacturing generally utilizes 300 mm diameter wafers and the latest miniaturization technology. The rapid expansion of the IoT and automotive devices has led to an increased demand for small-lot production using a wide variety of existing processes to meet a growing need among device makers for equipment capable of processing 200 mm wafers.
Featuring high productivity and overlay accuracy, Canon's FPA-5550iZ2 and FPA-6300ES6a semiconductor lithography equipment are now capable of meeting the demands of an even wider range of applications with the new 200 mm option, compared to support for only 300 mm wafers previously. When equipped with the 200 mm option, these systems deliver among the industry's highest3 throughput among same class lithography equipment. Offering up to 230 wafers per hour4 productivity for the FPA-5550iZ2 and up to 255 wafers per hour5 for the FPA-6300ES6a, both systems can contribute to cost savings for owners.
Both the FPA-5550iZ2 and FPA-6300ES6a allow for easy, continuous option and field upgrades which can provide process flexibility, increase productivity and improve overlay accuracy. By developing and offering a wide variety of semiconductor lithography equipment solutions and upgrade options, Canon continues to demonstrate its support of increasing user needs.
About Canon U.S.A., Inc. Canon U.S.A., Inc., is a leading provider of consumer, business-to-business, and industrial digital imaging solutions to the United States and to Latin America and the Caribbean markets. With approximately $29 billion in global revenue, its parent company, Canon Inc. (NYSE:CAJ), ranks third overall in U.S. patents granted in 2016.† Canon U.S.A. is committed to the highest level of customer satisfaction and loyalty, providing 100 percent U.S.-based service and support for all of the products it distributes in the United States. Canon U.S.A. is dedicated to its Kyosei philosophy of social and environmental responsibility. In 2014, the Canon Americas Headquarters secured LEED® Gold certification, a recognition for the design, construction, operations and maintenance of high-performance green buildings. To keep apprised of the latest news from Canon U.S.A., sign up for the Company's RSS news feed by visiting www.usa.canon.com/rss and follow us on Twitter @CanonUSA. For media inquiries, please contact [email protected].
†Based on weekly patent counts issued by United States Patent and Trademark Office.
1 A semiconductor lithography system that utilizes a 365 nm wavelength exposure light using a mercury lamp as the light source. 1 nm (nanometer) is 1 billionth of a meter.
2 A semiconductor lithography system that utilizes a 248 nm wavelength exposure light using a laser generated by combining the noble gas krypton (Kr) and the halogen gas fluoride (F) as the light source.
3 Among same-class i-line / KrF lithography systems, according to a December 10, 2017 Canon survey.
4 The amount of 200 mm wafers exposed in one hour at 58 shots per wafer.
5 The amount of 200 mm wafers exposed in one hour at 46 shots per wafer.