Complete Teardown Report of Heimann Sensor's 32 x 32-Array Thermopile LWIR Image Sensor with Silicon Lens

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Aug 08, 2018, 12:00 ET

DUBLIN, Aug 8, 2018 /PRNewswire/ --

The "Heimann Sensor 32 x 32-Array Thermopile LWIR Image Sensor with Silicon Lens Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

This report provides a detailed teardown and cost analysis of the thermopile die, the silicon lens, the EEPROM die, and the packaging.

LWIR imaging is increasingly used in myriad applications, from consumer to industrial. Low-cost, large arrays (32 x 32 and more) are specifically adapted to smart home/smart building applications for occupant detection, popu-lation localization, population counting, fire detection, and more. For these large markets of many hundreds of millions units a year, thermopile sensors are cost-competitive compared to micro-bolometers.

Based on a low-definition, 32 x 32 thermopile sensor, Heimann Sensor's HTPA32x32d is dedicated to these markets. Cheaper than a microbolometer and easier to integrate, the thermopile offers very good performance for applications that do not require high-resolution images and a high frame rate.

The thermopile array sensor consists only of a 0.5cm camera (with lens). The system is made easy for integrators with a digital IC interface, and includes for the first time a silicon lens for low-cost applications. The 32 x 32 array sensor uses a 90m pixel based on a thermopile technology for a very compact design.

This report also includes a comparison between the characteristics of the new and previous versions of the thermopile sensors from Heimann Sensor, and a comparison with FLIR's ISC1403 microbolometer. This latter comparison highlights differences in each company's technical choices.

Key Topics Covered:

1. Overview / Introduction

Executive Summary
Reverse Costing Methodology

2. Company Profile

Heimann Sensor

3. Physical Analysis

Synthesis of the Physical Analysis
Physical Analysis Methodology
Package

Package views, dimensions and marking
Package opening

Silicon Lens

View, dimensions
Cross-section and lens coating

EERPOM Die
Thermopile Die

View, dimensions and marking
Pixels, thermocouples
Cross-section
ROIC characteristics
Process characteristics

4. Comparison - Heimann Sensor HTPA32x32d vs. Flir ISC1403L

5. Manufacturing Process Flow

Global Overview
EEPROM Front-End Process and Wafer Fabrication Unit
ROIC Front-End Process and Wafer Fabrication Unit
Thermopile Front-End Process and Wafer Fabrication Unit
Thermopile Back-End 0: Probe Test and Dicing
Silicon Lens Front-End Process
Back-End - Final Test

6. Cost Analysis

Synthesis of the Cost Analysis
Yields Explanation and Hypotheses

EEPROM die - front-end cost + Wafer and die cost
Silicon lens - front-end cost + Wafer and die cost
Thermopile die - front-end cost + wafer and die cost

Component

Back-end - packaging cost
Back-end - final test cost
Component cost

7. Estimated Price Analysis

For more information about this report visit https://www.researchandmarkets.com/research/b42lkb/complete_teardown?w=5

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