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Connected World: Next Generation Mobile Communication Forum to be Held


News provided by

Chengdu Tianfu Software Park

Nov 24, 2011, 10:00 ET

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CHENGDU, China, Nov. 24, 2011 /PRNewswire-Asia/ -- The second Connected World: Next Generation Mobile Communication Forum, organized by Chengdu Hi-tech zone and Tianfu Software Park, will be held in Chengdu on December 8. It aims to share mobile communication technology innovation, to build an industry information exchange platform and to explore future market opportunities of the industry.

This forum will cover 3 major topics this year: 4G/LTE Technologies, Mobile Internet, and Next Generation Handheld Devices. Senior technology and strategy executives from China Mobile, China Telecom, China Unicom, France Telecom, T-Mobile, NTT Docomo, Vodafone, Qualcomm, Ericsson, Alcatel-Lucent, HTC, Huawei, Cisco, ARM, Microsoft, Sony-Ericsson, Motorola, Broadcom and Lenovo will be presenting their thoughts and ideas at this event.

Also in attendance will be around 200 business/technical leaders and experts from leading companies in the telecom sector. We believe this event will help enterprises not only understand the industry trends better, but also effectively develop networks and business opportunities.

Day One 8th, December Thursday


08:20-09:00

Registration and VIP Mingle


09:00-09:20

High-tech Zone leaders

Chengdu Investment Environment

09:20-09:40

China Mobile

Mobile Networks Development and Evolution: LTE, HSPA+, etc.

09:40-10:00

China Mobile

TD Technology Development, Evolution and Applications

10:00-10:20

Kyllesbech Larsen, Senior VP, T-Mobile

LTE/HSPA+ Deployment and Networks Operations Management

10:20-10:40

Coffee break


10:40-11:50

Yongchun Liu, VP & Chief Architect, Alcatel Shanghai
David Fittal, R&D Director, Vodafone
Allen Wu, GM, ARM China

  • 1. Networks Optimization and & Self-Organized Networks;
  • 2. TD-LTE Technology and Networks;
  • 3. Mobile Internet and Applications.

11:50-12:20

Panel Discussion

Connected World, Future Life

  • 1. 4G Key Technologies;
  • 2. Commercial Networks Deployment and Applications
  • 3. Future Networks Characters and Trend
  • 4. Case Studies

Mobile Terminals and Life

12:20-13:20

Lunch


13:20-15:00
Track 1
Convergence

Gu Daqing, VP, R&D, France Telecom Beijing Lab
Ayumu Futakata, General Manager, NTT Docomo Beijing Representative Office

Joon Yong Choi, VP, KT China

  • 1. Triple Play and Future Networks
  • 2. Network Convergence and Key Technologies
  • 3. Experiment Networks and Service Innovation

15:00-15:30

Coffee Break


15:30-17:20
Track 1
Convergence

Jin Pu, Head of Chengdu R&D Center, Ericsson

Zhou Baoguo, Deputy GM, LTE Unit, Putian

Paul Chang, General Manager, Cisco Systems (China) Research and Development Co., Ltd.

Ye Shuaimin, Director, President, Lenovo Chengdu R&D Center

  • 1. Mobile Internet
  • 2. Broadband Wireless Networks
  • 3. Mobile Terminals
  • 4. Digital Trunk Communication and Radio Regulatory

13:20-15:00
Track 2
Technology

Wei-Pang Chin,R&D Managing Director,Motorola Xu Xiaoxing, Chief Engineer, MKTG, Huawei
Ding Wei, GM, Strategic Cooperation, NEC China

  • 1. Mobile Broadband Technologies Enable New Generation Networks Deployment: LTE, Wi-Fi, Femtocell, TD;
  • 2. Mobile Internet and Mobile Technologies;
  • 3. IPv6 Technologies and IPv6 Based Network Architect;
  • 4. IPTV & Triple Play.

15:00-15:30

Coffee Break


15:30-17:20
Track 2
Technology

Rupert Baines, VP, Marketing, Picochip
Liu Jianfeng, Director, Solutions, H3C C-Marketing
Kong Yong, Chief Engineer, Carrying Network, ZTE
Xu Qiqi, VP, Telecom Architect and Solutions, Cisco; Executive VP, Greater China

  • 1. The Technologies for Internet of Things: M2M/MSN/SOC, etc
  • 2. Cloud Computing
  • 3. Mobile Terminals and OS Platform
  • 4. Femtocell: Chip, System, and Solutions (TD/LTE-Femtocell)

13:20-15:00
Track 3
Terminals

Charlie Liu, Head of Research and Technology, CTO China, Sony-Ericsson

  • 1. Mobile Computing Core Technologies
  • a) Wi-Fi / Bluetooth / RFID / NFC
  • b) Batteries Management
  • c) Sensor / M2M Technology

15:00-15:30

Coffee Break


15:30-17:20
Track 3
Terminals

Zheng Xia, Head, Device Innovation & Prototyping, Nokia China Ray Yam, R&D GM, HTC

  • 1. New Generation Devices Technologies, Software, OS & Applications.

Day one closing



Dujiangyan and post-quake reconstruction site visit

Day Two 9th December Friday

08:00-12:30

Word Culture Heritage - Dujiangyan Irrigation Project Visit

Dujiangyan is the world's oldest functional irrigation project. The project mainly includes fish mouth water diversion dike, Feisha weir spillway, bottled water, Baizhang dike, eliminating flood plain, making the western Sichuan plain become the land of abundance.

12:30-13:30

Lunch

13:30-15:30

Post-quake reconstruction Site Visit

After the devastating earthquake in 2008, Yingxiu, the epicenter and heavily destroyed in the disaster, has been re-built and turned into a modern town accomplishing big transportation, residential and hydraulic projects.

17:00

Back to Millennium Hotel

Day two closing


As the holding place of this summit, Chengdu is the communications hub of Southwest China determined by the State Council and China's fourth largest communications technology and equipment R&D center, next only to Beijing, Shanghai and Shenzhen. Its communications industry development level and communication services capabilities rank first in Central and West China. As of October 2011, Chengdu communications industry had gathered more than 150 associated enterprises, employing more than 50,000 people.

About Chengdu Hi-tech Zone

Chengdu Hi-tech Zone is the core clustering place of Chengdu communications industry. At present, it has become a key communications technology and equipment R&D center and an important R&D and production base of optical communication products in China. The global top five communications providers, Ericsson, Huawei, Nokia Siemens, Alcatel Lucent and ZTE, have all set up R & D centers in the Chengdu Hi-tech Zone, which is one of China's leading R&D bases of 3G\4G, NGN, optical communications technology, unified communications software, software for switches and routers, intelligent packet switch core network subsystems, systems and platform software, terminal software, IMS platforms, GSM and 3G base stations, mobile integration and mobile browsing WAP Gateway and other products.

About Tianfu Software Park

Since Tianfu Software Park was launched in 2005, it has successfully attracted a large number of world-class enterprises segmented in six sectors – ITO/software development, digital entertainment, information security, telecom, R&D, IC design and BPO/shared service centres. As per November 2011,over 300 companies, including IBM, Accenture, SAP, EMC, Maersk, DHL, Manulife Financial, Huawei, Ericsson, Nokia-Siemens, Tencent, operate in the park, employing over 30,000 people. Tianfu Software Park has become the fastest development software park in China.

For details about the agenda of the summit, please visit: http://www.tianfusoftwarepark.com/

SOURCE Chengdu Tianfu Software Park

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