Fresh Partnerships, New Technology Platform and Innovative Solutions - Research Report on Synopsys, Veeco, Ultratech, STMicroelectronics, and Entegris

NEW YORK, June 26, 2013 /PRNewswire/ --

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Today, Wall Street Reports announced new research reports highlighting Synopsys, Inc. (NASDAQ: SNPS), Veeco Instruments Inc. (NASDAQ: VECO), Ultratech, Inc. (NASDAQ: UTEK), STMicroelectronics N.V. (NYSE: STM), and Entegris, Inc. (NASDAQ: ENTG). Today's readers may access these reports free of charge - including full price targets, industry analysis and analyst ratings - via the links below.

Synopsys, Inc. Research Report

On June 19, 2013, Synopsys, Inc. (Synopsis) announced that OCZ Technology Group, Inc. (OCZ) has achieved first-pass silicon success for its NAND flash Vector SSD with the use of Synopsys' DesignWare DDR2/3-Lite PHY, Embedded Memories, STAR Memory System solution, and Professional Services. The Company said that through the help of its technology and services, OCZ was able to accelerate the completion of its project, meet its performance requirements, and achieve first-pass silicon success with a production-ready design. "We were very focused on reducing schedule risk, which made it imperative that we partner with an established vendor like Synopsys that had the proven portfolio of IP, design flows, and services that we needed," said Brian McMath, Technical Director at OCZ. "The combination of Synopsys' proven DesignWare IP, experienced design consultants, and tapeout-proven Lynx Design System made it possible for us to achieve our performance goals while saving an estimated two months of schedule time." The Full Research Report on Synopsis, Inc. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.wsreports.com/r/full_research_report/8cbc_SNPS]

Veeco Instruments Inc. Research Report

On June 18, 2013, Veeco Instruments Inc. (Veeco) received a letter from NASDAQ, indicating that the NASDAQ Listing Qualifications Panel had granted Veeco's request to extend the stay of suspension of trading in its common stock pending a final determination regarding the Company's listing status after a hearing before the Panel. The hearing has been scheduled for June 27, 2013. During the hearing, Veeco said that it will request for additional time to fulfill the NASDAQ listing requirement, which requires that the Company be current in its filings with the Securities and Exchange Commission. According to Veeco, the Panel usually issues its decisions within 30 days of the hearing date. The Company informed that it will provide an update on its continued listing status, after the decision on the matter has been issued. The Full Research Report on Veeco Instruments Inc. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.wsreports.com/r/full_research_report/3180_VECO]

Ultratech, Inc. Research Report

On June 19, 2013, Ultratech, Inc. (Ultratech) announced the first shipment of its LSA201 system to a leading IDM. The Company said that the first shipment reflects its continuing efforts to develop solutions that enable the leading-edge technology roadmaps of its global customers. Further, the Company intends to begin volume shipments of the LSA201 in the second half of 2013. Ultratech said that the LSA201 is built on a new platform that enables precise control over the gases that surround the wafer during processing. "As devices scale below 20nm, there are an increasing number of applications beyond dopant activation which involve interface engineering or film modification, such as advanced silicide formation and high K anneal," said Jeff Hebb, Ph.D., Vice President of Laser Product Marketing at Ultratech. "Precise control over the wafer ambient is required for these kinds of processes, and the LSA201 delivers this capability." The Full Research Report on Ultratech, Inc. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.wsreports.com/r/full_research_report/470e_UTEK]

STMicroelectronics N.V. Research Report

On June 19, 2013, STMicroelectronics N.V. (ST) revealed a new technology platform for RF front-end of wireless devices. The Company stated that the increasing demand for faster wireless broadband connections is calling for an increasingly complex circuitry inside devices. To address this, ST has developed an advanced component process technology specifically optimized to increase performance and reduce the size of the RF front-end of mobile devices. ST's new manufacturing process, known as the H9SOI_FEM, allows production of complete integrated front-end modules. "The H9SOI_FEM dedicated process enables our customers to develop state-of-the-art front-end modules that are half the size or smaller compared to today's front-end solutions," said Flavio Benetti, General Manager of the Mixed Process Division of STMicroelectronics. "Moreover, we have achieved a simplified process flow to enable extremely short overall lead-times and supply flexibility, which are crucial for end customers in this market." The Full Research Report on STMicroelectronics N.V. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.wsreports.com/r/full_research_report/3b1c_STM]

Entegris, Inc. Research Report

On June 21, 2013, Entegris, Inc. (Entegris) announced its partnership with 3S Korea Co., Ltd. (3S) for the sale of 450 mm wafer handling products to customers in Korea. Entegris will manufacture its 450 mm wafer handling and shipping products for 3S on a private label co-branded basis and 3S will have the exclusive rights to promote and sell the 450 mm products in Korea. The products covered by the partnership include the 450 mm Front Opening Unified Pod (FOUP), 450 mm Multi Application Carrier (MAC), 450 mm Single Wafer Shipper (SWS), and related secondary packaging systems used with 450 mm products. "The combination of 3S Korea's leadership in the region and Entegris' technical capabilities creates a strong partnership to provide the industry's best wafer carrier solutions," said William Shaner, Vice President and General Manager of Microenvironments Division at Entegris. The Full Research Report on Entegris, Inc. - including full detailed breakdown, analyst ratings and price targets - is available to download free of charge at: [http://www.wsreports.com/r/full_research_report/a204_ENTG]

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SOURCE Wall Street Reports