Kulicke & Soffa Receives SEMI Award for North America for Breakthrough Fluxless Thermocompression Bonding Technology

Recognition Highlights Company's Leadership in Enabling Advanced Heterogeneous Integration and AI-Driven Semiconductor Innovation

FORT WASHINGTON, Pa., Oct. 13, 2026 /PRNewswire/ -- Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company") today announced that it has been selected as the recipient of the 2026 SEMI Award for North America, one of the semiconductor industry's highest honors recognizing exceptional technical and commercial contributions to semiconductor manufacturing.

The award recognizes Kulicke & Soffa's pioneering formic acid in-situ bonding technology, an innovative Fluxless Thermo Compression bonding (FTC) solution that addresses critical interconnect scaling challenges and is actively enabling the next generation of heterogeneous integration architectures supporting artificial intelligence, high-performance computing, and advanced photonics applications.

Presented during the CEO Summit Keynotes at SEMICON West, the award underscores the growing industry adoption and significance of K&S's advanced packaging portfolio, including its industry-leading APTURA™ platform.

"As semiconductor performance is now critically dependent on advanced packaging and heterogeneous integration, the industry's ability to scale interconnect density efficiently and economically becomes more important than ever," said Raj Talluri, Chief Executive Officer of Kulicke & Soffa. "We are honored to receive this recognition from SEMI. This award reflects the ingenuity, dedication, and relentless execution of our global teams, who continue to develop innovative solutions which enable customers to overcome the industry's most complex manufacturing challenges."

Traditional Thermo-Compression bonding often requires a post-bond flux cleaning processes that becomes increasingly difficult at finer interconnect pitches. At the same time, hybrid bonding solutions, while highly capable, can introduce significant manufacturing complexity and cost. Kulicke & Soffa's proprietary Fluxless Thermo-Compression bonding technology combines advanced plasma pre-cleaning and in-situ formic acid oxide reduction to deliver high-yield, ultra-fine-pitch interconnect capabilities while simplifying the manufacturing processes and reducing production costs.

FTC technology has become a foundational element of the Company's advanced packaging roadmap and enables customers to pursue interconnect pitches below 10 microns while supporting applications across wafer-level, substrate-level, and panel-level manufacturing environments.

"This recognition validates our innovation-driven strategy of selecting differentiated technologies that solve real customer challenges," said John Molnar, VP & General Manager, Advanced Solutions. "By enabling hybrid-bonding-class performance with more accessible manufacturing, we are accelerating the adoption of advanced packaging solutions required for next-generation AI, high-performance computing, silicon photonics, and other rapidly growing semiconductor markets."

The award further reinforces Kulicke & Soffa's position as a leading provider of semiconductor interconnect solutions. The company's advanced packaging portfolio spans thermocompression bonding, hybrid bonding enablement technologies, wedge bonding, and vertical interconnect solutions that support some of the industry's most complex heterogeneous applications.

As semiconductor complexity continues to increase, interconnect and packaging innovations are now a requirement in delivering system-level performance across the semiconductor space. This award highlights the critical role Kulicke & Soffa is playing to shape the industry's future.

About Kulicke & Soffa

Kulicke & Soffa is a global leader in semiconductor assembly technology, advancing device performance across automotive, compute, industrial, memory and communications markets. Founded on innovation in 1951, K&S is uniquely positioned to overcome increasingly dynamic process challenges – creating and delivering long-term value by aligning technology with opportunity.

About SEMI

SEMI® is the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more. 

Contacts

Kulicke & Soffa
Marilyn Sim
Public Relations
P: +65-6880-9309
[email protected]

Kulicke & Soffa  
Joseph Elgindy
Investor Relations
P: +1-215-784-7500
[email protected]

SOURCE Kulicke & Soffa Industries, Inc.