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      LITEON präsentiert auf der electronica 2026 optische Hochgeschwindigkeitsverbindungen und wichtige optoelektronische Technologien und treibt die Infrastruktur von KI-Rechenzentren mit intelligenter Photonik voran

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      News provided by

      LITEON Technology

      Nov 11, 2026, 14:37 ET

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      MÜNCHEN, 11. November 2026 /PRNewswire/ -- LITEON Technology (2301) nimmt an der electronica 2026 teil, die vom 10. bis 13. November in München stattfindet, und präsentiert dort seine optoelektronischen Halbleitertechnologien unter dem Motto „Intelligente Photonik". Das Portfolio umfasst optische Hochgeschwindigkeitsverbindungen, hocheffiziente Isolation und Leistungssteuerung, intelligente Sensorik sowie AR-Optik und verdeutlicht den breiten Einsatz der optoelektronischen Kerntechnologien von LITEON in KI-Rechenzentren, im hocheffizienten Energiemanagement und in intelligenten Anwendungen.

      Continue Reading
      LITEON Showcases High-Speed Optical Interconnect and Key Optoelectronic Technologies at electronica 2026, Advancing AI Data Center Infrastructure with Intelligent Photonics
      LITEON Showcases High-Speed Optical Interconnect and Key Optoelectronic Technologies at electronica 2026, Advancing AI Data Center Infrastructure with Intelligent Photonics

      „KI beschleunigt den Wandel der Rechen- und Energieinfrastruktur und treibt gleichzeitig die wachsende Nachfrage nach schnellen, stromsparenden und äußerst zuverlässigen optischen Verbindungen voran", sagte Sander Su, General Manager des Geschäftsbereichs Optoelectronics Products Solutions bei LITEON. „Mit fundiertem Fachwissen in den Bereichen optische Kommunikation und optoelektronische Halbleiter positioniert sich LITEON als ‚Digital Photonics Integrator' und integriert kontinuierlich Technologien über Schlüsselkomponenten, Module und Anwendungen auf Systemebene hinweg, um Kunden dabei zu unterstützen, den wachsenden Anforderungen an Hochgeschwindigkeitsübertragung, höhere Effizienz und intelligente Sensorik im KI-Zeitalter gerecht zu werden."

      Mit zunehmendem KI-Rechenaufkommen benötigen Rechenzentren höhere Bandbreiten, geringere Latenzzeiten und größere Energieeffizienz. LITEON präsentiert seine VHP-Technologie für externe Laserquellen (ELS) sowie ELSFP-Lösungen, die CPO- und NPO-Switch-Architekturen unterstützen und eine leistungsstarke, skalierbare optische Konnektivität für KI-Cluster und zukünftige Rechenzentren bieten. Die Lösungen sind auf unterschiedliche Systemkonfigurationen, Flüssigkeitskühlungsarchitekturen und Integrationsanforderungen ausgelegt und helfen Kunden dabei, eine effizientere KI-Netzwerkinfrastruktur aufzubauen.

      LITEON präsentiert zudem Isolations- und Leistungssteuerungstechnologien für 800-VDC-Stromversorgungssysteme und Stromversorgungsarchitekturen für KI-Rechenzentren und erweitert damit sein optoelektronisches Know-how von der Datenübertragung auf die Stromumwandlung und -steuerung. Das Portfolio umfasst Isolationsverstärker, Gate-Treiber, Hochgeschwindigkeits-Optokoppler, Fotorelais und verstärkte Isolationsplattformen, die eine sichere und zuverlässige Stromumwandlung sowie präzise Signalerfassung und -steuerung in Hochspannungs- und Hochleistungsumgebungen gewährleisten. Diese Technologien kommen zudem in Solarwechselrichtern, Batteriemanagementsystemen, EV-Ladesystemen und der industriellen Automatisierung zum Einsatz und verbessern Sicherheit, Zuverlässigkeit und Energieeffizienz in vielfältigen Anwendungsbereichen.

      Über Rechenzentren hinaus präsentiert LITEON Multi-Zone-ToF-, Direct-ToF-, Metalens-Punktprojektoren und SWIR-Sensortechnologien für Robotik, industrielle Bildverarbeitung, industrielle Automatisierung, autonome Navigation sowie AR/VR-Anwendungen.

      Die Präsentation umfasst zudem optische AR-Technologien der nächsten Generation, darunter MicroLED-Anzeigemodule, Vollfarb-Optikmodule, Wellenleiterintegration und das Design optischer AR-Systeme. Damit demonstriert LITEON seine Fähigkeit, sein Know-how im Bereich optoelektronischer Halbleiter von Sensorkomponenten auf optische Module und integrierte Systeme auszuweiten und seine Präsenz in aufstrebenden Anwendungsbereichen wie Smart Wearables und Immersive Computing weiter auszubauen.

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