Nikon Announces First Back-End Process Lithography System

Accepting Orders Now for the Digital Lithography System DSP-100 Showcasing at SEMICON West 2025

TOKYO, Oct. 1, 2025 /PRNewswire/ -- Nikon Corporation is reaffirming the availability of its Digital Lithography System, DSP-100, with orders having commenced in July 2025. This system is specifically developed for advanced packaging applications, supporting large substrates up to 600mm square and delivering high resolution of 1.0μm *¹ (L/S*²) and will be prominently featured during SEMICON West 2025.

*1 1 micrometer (μm) is one-millionth of a meter (one-thousandth of a millimeter).
*2 Abbreviation for Line and Space. Refers to the width of circuit lines and the spacing between adjacent patterns.

Release Overview

Development Background

With the widespread adoption of high-speed communication technologies such as the internet of things (IoT) and generative artificial intelligence (AI), the volume of information processing is rapidly increasing, driving demand for high-performance semiconductor devices, especially in data centers. In addition, as advanced packaging technologies such as chiplets—that connect multiple chips side by side—continue to progress, circuit patterns are becoming increasingly fine, and package sizes are growing. In response to these challenges, demand for panel-level packaging (PLP) using resin or glass substrates is expected to see continued growth.

Performance Overview

Key Benefits
Combining High Resolution and Productivity
The DSP-100 integrates Nikon's high-resolution semiconductor lithography technology with the multi-lens technology*⁴ from its flat panel display (FPD) lithography systems. It delivers high resolution (1.0μm L/S), excellent overlay accuracy (≦±0.3μm), and high productivity—up to 50 panels per hour using 510×515mm substrates.

*4 Nikon's proprietary technology exposes multiple projection lenses in an array and precisely controls them to produce the same effect as if a single giant lens were used. This enables patterning over a wider area with a single exposure.

Maskless Operation for Large Advanced Packaging Applications
Unlike conventional lithography systems that require photomasks with circuit patterns, the DSP-100 uses a spatial light modulator (SLM) to directly project circuit patterns onto substrates without the need for a photomask. This approach eliminates the size constraints of photomasks, provides greater flexibility for large, advanced packaging applications, and streamlines the development process—reducing both cost and lead time for customers.

Support for Large Square Substrates—9x Productivity Compared to Wafers
The DSP-100 supports exposure on large square substrates up to 600×600mm. For 100mm-square large packages, productivity per substrate is nine times higher than when utilizing 300mm wafers. Additionally, the system offers high-precision correction for substrate warpage and deformation, reducing production costs with maskless technology and minimizing maintenance costs with solid state light sources, supporting greener manufacturing.

The information contained in this press release is current as of its date of publication.

About Nikon
Since 1980, Nikon Corporation has been revolutionizing lithography with innovative products and technologies. The company is a worldwide leader in semiconductor lithography systems for the microelectronics manufacturing industry with more than 8,000 (semiconductor) lithography systems installed worldwide. Nikon offers the most extensive selection of production-class steppers and scanners in the industry. These products serve the semiconductor, flat panel display (FPD) and thin-film magnetic head (TFH) industries. Nikon Precision Inc. provides service, training, applications and technical support, as well as sales and marketing for Nikon lithography equipment in North America. For more information about Nikon, access our website at https://www.nikonprecision.com.

This press release contains forward-looking statements as that term is defined in the Private Securities Reform Act of 1995, which are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such statements are subject to risks, uncertainties and changes in condition, particularly those related to industry requirements and other risks. The Company undertakes no obligation to update the information in this press release.

SOURCE Nikon Precision Inc.