PI's New Air Bearing Scanner Targets Metrology and Wafer Inspection

The A-323, a US-built planar XY platform. pairs 2 g acceleration with reaction-force management, increasing stability and throughput so processes can start sooner after every move

SHREWSBURY, Mass., Oct. 27, 2026 /PRNewswire/ -- Introduced at SEMICON West 2026, PI's new air bearing scanner raises the bar for precision motion. In high-throughput wafer inspection, speed isn't just about how fast a stage moves. It's also about how quickly processes can begin once the stage stops. The A-323 planar air bearing scanner, designed and manufactured by PI engineers in the USA, improves performance in semiconductor inspection, optical metrology and photonics applications. It builds on the company's A-322 planar scanning stage with a new architecture aimed at higher acceleration, shorter step-and-settle times, and better repeatability.

At a Glance: A Configurable Platform

• Travel: 500 × 500 mm in XY
• Dynamics: up to 2 m/s velocity and 2 g acceleration
• Accuracy: 0.1 µm, with pitch and yaw of 10 µrad and 2 µrad
• Integration: central pocket for Z, tip/tilt and rotary modules, plus provisions for customer-supplied equipment

Three Design Choices That Improve Performance
The A-323 redirects motor reaction forces into the machine frame instead of the granite base. The granite, along with the optics, cameras and sensors mounted on its bridge, sees less disturbance, so processes will deliver higher quality and/or can start sooner.

A split-beam cross-axis design keeps the payload low and close to the motor force plane. That reduces rocking during acceleration and shrinks the offset between the payload and the encoder measurement plane, limiting errors caused by angular motion.

Drive and encoder points also sit farther apart than on the previous A-322 Ultra version, giving more control over rotation about the vertical axis. That matters at the edge of a 300 mm wafer, where a small yaw error turns into a larger positioning error than it would near the center.

Built Around Your Equipment
The central pocket accepts application-specific modules, including PI's A-523 Z-tip/tilt stage, a compact 5 mm Z-stage, a rotary axis or combined rotary/Z/tilt units, all kept low to preserve dynamic performance. Newly developed air-bearing pucks provide a stiffer air film, and integrated cable tracks, pneumatic routing and cooling provisions simplify mounting customer hardware. Symmetrical cable loops help limit position-dependent disturbances.

Headroom to Grow
With 2 g already validated, performance is now limited mainly by motor force and thermal loading, not stage structure. Liquid-cooled motors manage heat, and motors can be sized and cooled to match payload and duty cycle. Final performance depends on the integrated payload, selected modules, motor configuration, and operating conditions.

Applications and Industries Served
Wafer and panel inspection, optical metrology, wafer stealth slicing, photonics alignment, material research and laser processing

Availability and More Information
To discuss scanning requirements, payload configuration, added motion axes or system integration, contact PI's engineering team. 

Download the datasheet: High-Performance Scanning and Metrology
More information: A-323 Air Bearing Scanner Advances Wafer Metrology
Watch Video of the A-323 Scanner

About PI
PI is a leading global manufacturer of precision motion control systems, nanopositioning solutions, air bearings, piezo materials, piezo mechanical systems. For more than 50 years, PI has developed standard and custom solutions for OEM and industry leaders in photonics, semiconductor, laser, medical/life sciences, and aerospace applications.

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SOURCE Physik Instrumente (PI)