Redtea Mobile Develops Secure SoC Solutions for Consumer Electronics Connectivity

Integrating Redtea Mobile's embedded SIM (eSIM) software component into Qualcomm Technologies' iUICC concept featuring in Snapdragon Mobile Platforms, the combination is designed to address the growing demands for a higher level of connectivity on mobile devices -- to address the security platforms in the device and be the trusted element for SIM.

As one of the eSIM implementations, the iUICC module has no separate off-chip component as the SoC solution combines the secure processor, the baseband processor and possibly other processors into one discrete hardware component. This solution can satisfy prevailing and future security requirements.

In particular, Redtea Mobile will deploy their eSIM terminal solution (e.g. LPA) and Subscription Manager-Data Preparation+ (SM-DP+) cloud service on top of Qualcomm Technologies' iUICC. This eSIM offering for consumer electronics is compliant with GSMA eSIM standards to support fast, seamless deployment and connectivity for OEMs and mobile network operators (MNOs).

"An important aspect of our 5G vision is the adoption of leading new standards and innovations around the trusted SIM card," said Sy Choudhury, senior director of product management, Qualcomm Technologies, Inc. "Qualcomm Technologies and Redtea Mobile have worked together to demonstrate how the GSMA's Remote SIM Provisioning specification for embedded SIM can run on a Snapdragon Mobile Platform while effectively integrating with existing mobile operator infrastructures."

"We're excited to showcase our eSIM Technology running on the Snapdragon Mobile Platform to the world's most innovative device manufacturers and mobile operators at Qualcomm Technologies' annual 4G/5G Summit in Hong Kong," said Dr. Hui Jin, CEO and Co-founder of Redtea Mobile. "As an established brand that has shipped its eSIM capability and data/roaming service to over 100 million devices by partnering with 20+ MNOs/MVNOs worldwide and a majority of smartphone manufacturers including OPPO, vivo, Samsung (China), Xiaomi, Lenovo, ZTE, Meizu, LeEco, and Smartisans, Redtea's proven technology brings a brand new level of features and convenience to consumers and the roaming industry as a whole. The demonstration with Qualcomm Technologies is a first of its kind to show integrated eSIM capabilities on a Qualcomm Technologies platform and may offer a generational leap in data connectivity."

"We are always pursuing a more complete and integrated solution for device manufacturers. By working together, Redtea Mobile and Qualcomm Technologies are demonstrating how a leading and innovative eSIM and SoC can be integrated at the platform level, while also making the solution easier to integrate for device manufacturers, to reduce physical space requirements and be more cost effective," said Ming Jiang, Redtea Mobile's CTO and Co-founder.

About Redtea Mobile

Redtea Mobile is an eSIM service provider that delivers turn-key solutions including global cellular data coverage, RSP (Remote SIM Provisioning) platform, eSIM terminal technology and eSIM based applications. Redtea Mobile has developed an RSP platform which is fully compliant with GSMA eSIM standards and strives to promote the wide deployment and secure implementation of eSIM technology by closely collaborating with device OEMs, chipset and module manufacturers, and mobile operators. Redtea Mobile was named one of the "China's 50 Most Innovative Companies of 2016" by Fast Company Magazine. Redtea Mobile jointly hosted WAS #5 with GSMA. For the full story of Redtea Mobile, please visit www.redteamobile.com.

Media Contact:

Vivi Mou
VP of Brand Management, Redtea Mobile
[email protected]

Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.

SOURCE Redtea Mobile

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